Irradiation devices with optical modulators for additively manufacturing three-dimensional objects

ABSTRACT

An irradiation device for additively manufacturing three-dimensional objects may include a beam generation device configured to generate an energy beam, an optical modulator including a micromirror array disposed downstream from the beam generation device, and a focusing lens assembly disposed downstream from the optical modulator. The micromirror array may include a plurality of micromirror elements configured to reflect a corresponding plurality of beam segment of the energy beam along a beam path incident upon the focusing lens assembly. The focusing lens assembly may include one or more lenses configured to focus the plurality of beam segments such that for respective ones of a plurality of modulation groups including a subset of micromirror elements, a corresponding subset of beam segments are focused to at least partially overlap with one another at a combination zone corresponding to the respective modulation group.

PRIORITY INFORMATION

The present application claims priority to U.S. Provisional ApplicationNo. 63/235,303 filed on Aug. 20, 2021, which is incorporated byreference herein for all purposes.

FIELD

The present disclosure generally pertains to irradiation devices forirradiating powder material to additively manufacture three-dimensionalobjects, such as irradiation devices used in powder bed fusionprocesses.

BACKGROUND

Three dimensional objects may be additively manufactured using a powderbed fusion process in which an energy beam generated by an irradiationdevice is directed onto a powder bed to melt and/or sinter sequentiallayers of powder material. The properties of the three dimensionalobject formed by melting and/or fusing the powder material may depend atleast in part on one or more characteristics of the energy beam providedby the irradiation device and/or on the irradiation sequence performedby the irradiation device. Accordingly, it would be welcomed in the artto provide improved additive manufacturing systems and machines,including improved energy beam systems and/or irradiation devices, aswell as improved irradiation sequences that may be performed by suchenergy beam systems and/or irradiation devices.

BRIEF DESCRIPTION OF THE DRAWINGS

A full and enabling disclosure, including the best mode thereof,directed to one of ordinary skill in the art, is set forth in thespecification, which makes reference to the appended Figures, in which:

FIGS. 1A and 1B schematically depict exemplary additive manufacturingsystems or machines;

FIGS. 2A and 2B schematically depict further exemplary additivemanufacturing systems or machines;

FIGS. 3A and 3B schematically depict exemplary energy beam systems withone or more irradiation devices that may be included in an additivemanufacturing machine;

FIGS. 4A-4G schematically depict exemplary optical modulators that maybe included in an irradiation device;

FIGS. 5A-5M schematically depict exemplary modulation groups that may bedefined for an optical modulator and corresponding combination zones fora plurality of beam segments reflected by the modulation group;

FIG. 5N schematically depicts a focusing lens assembly converging aplurality of beam segments from a beam generation device into aplurality of beam spots having a linear arrangement;

FIGS. 6A-6H schematically depict exemplary focusing lens assemblies thatmay be included in an irradiation device to combine beam segmentscorresponding to respective modulation groups;

FIG. 6I schematically depicts a plurality of beam spots having a lineararrangement on a surface of a powder bed defined by a plurality ofparticles, wherein the space between adjacent beam spots has a spacewidth that is less than an average particle size of the plurality ofparticles;

FIGS. 7A-7D schematically depict exemplary alignments of a plurality ofoptical modulators;

FIGS. 8A-8F schematically depict exemplary combination zones;

FIG. 9 schematically depicts an exemplary configuration of an energybeam system that includes a plurality of irradiation devices;

FIGS. 10A-10C schematically depict a perspective view of a build planebeing irradiated by an irradiation device according to an exemplaryirradiation sequence;

FIGS. 10D-10F schematically depict a side view of an exemplaryirradiation sequence that may include the irradiation sequence depictedin FIGS. 10A-10C;

FIG. 11A schematically depicts a perspective view of a build plane beingirradiated by an irradiation device according to another exemplaryirradiation sequence;

FIGS. 11B-11G schematically depict a side view of an exemplaryirradiation sequence that may include the irradiation sequence depictedin FIG. 11A;

FIGS. 12A-12F schematically depict exemplary modulation cycles that maybe included in an irradiation sequence;

FIGS. 13A-13S, schematically depict further exemplary modulation cyclesthat may be included in an irradiation sequence;

FIGS. 14A-14H-2 schematically depict exemplary pulse cycles that may becoordinated with exemplary modulation cycles in an irradiation sequence;

FIG. 15 schematically depicts an exemplary controls system that may beconfigured to control an additive manufacturing system or machine; and

FIGS. 16A and 16B schematically depicts an exemplary method ofadditively manufacturing a three-dimensional object.

Repeat use of reference characters in the present specification anddrawings is intended to represent the same or analogous features orelements of the present disclosure.

DETAILED DESCRIPTION

Reference now will be made in detail to exemplary embodiments of thepresently disclosed subject matter, one or more examples of which areillustrated in the drawings. Each example is provided by way ofexplanation and should not be interpreted as limiting the presentdisclosure. In fact, it will be apparent to those skilled in the artthat various modifications and variations can be made in the presentdisclosure without departing from the scope of the present disclosure.For instance, features illustrated or described as part of oneembodiment can be used with another embodiment to yield a still furtherembodiment. Thus, it is intended that the present disclosure covers suchmodifications and variations as come within the scope of the appendedclaims and their equivalents.

It is understood that terms “upstream” and “downstream” refer to therelative direction with respect to fluid flow in a fluid pathway. Forexample, “upstream” refers to the direction from which the fluid flows,and “downstream” refers to the direction to which the fluid flows. It isalso understood that terms such as “top”, “bottom”, “outward”, “inward”,and the like are words of convenience and are not to be construed aslimiting terms. As used herein, the terms “first”, “second”, and “third”may be used interchangeably to distinguish one component from anotherand are not intended to signify location or importance of the individualcomponents. The terms “a” and “an” do not denote a limitation ofquantity, but rather denote the presence of at least one of thereferenced item.

Approximating language, as used herein throughout the specification andclaims, may be applied to modify any quantitative representation thatcould permissibly vary without resulting in a change in the basicfunction to which it is related. Accordingly, a value modified by a termor terms, such as “about,” “substantially,” and “approximately,” are notto be limited to the precise value specified. In at least someinstances, the approximating language may correspond to the precision ofan instrument for measuring the value, or the precision of the methodsor machines for constructing or manufacturing the components and/orsystems. For example, the approximating language may refer to beingwithin a 10 percent margin.

Here and throughout the specification and claims, range limitations arecombined and interchanged, such ranges are identified and include allthe sub-ranges contained therein unless context or language indicatesotherwise. For example, all ranges disclosed herein are inclusive of theendpoints, and the endpoints are independently combinable with eachother.

The present disclosure generally provides additive manufacturingmachines and methods of additively manufacturing three-dimensionalobjects. Exemplary additive manufacturing machines and methods mayutilize irradiation devices that emit an energy beam that exhibits arelatively lower intensity and/or power density in comparison toexisting irradiation devices typically utilized in powder bed fusionprocesses. For example, an additive manufacturing machine may operatewith an energy beam that imparts a power density and/or intensity to thebuild plane commensurate with a conduction irradiation regime. As usedherein, the term “conduction irradiation” or “conduction irradiationregime” refers to an irradiation regime in a powder bed fusion processin which heat is transferred into the powder bed predominately throughheat conduction such that the thermal conductivity of the powdermaterial is the limiting factor for the depth of the melt pool. Thetemperature of the melt pool with conduction irradiation generallyremains below the vaporization temperature of the powder material. Witha conduction irradiation regime, the width of a melt pool is typicallymuch greater than the depth of the melt pool. A melt pool resulting fromconduction irradiation may have an aspect ratio of less than about 1.0(width/depth), such as from about 0.1 to about 1.0, such as from about0.1 to about 0.5, or such as from about 0.5 to about 1.0. A melt poolresulting from conduction irradiation may have a depth of from about 10micrometers (μm) to about 250 μm, such as from about 10 μm to about 50μm, such as from about 50 μm to about 100 μm, or such as from about 100μm to about 250 μm.

Conduction irradiation may be differentiated from penetrationirradiation. As used herein, the term “penetration irradiation” or“penetration irradiation regime” refers to an irradiation regime in apowder bed fusion process in which the temperature of the melt poolexceeds the vaporization temperature of the powder material to an extentthat an energy beam penetrates into a vapor capillary formed byexpanding gasses releasing from the vaporizing power material. Withpenetration irradiation, the temperature of the melt pool adjacent tothe vapor capillary generally exceeds the vaporization temperature ofthe powder material. With a penetration irradiation regime, the width ofa melt pool is typically much smaller than the depth of the melt pool. Amelt pool resulting from penetration irradiation may have an aspectratio of greater than about 1.0 (width/depth), such as from about 1.0 toabout 18.0, such as from about 1.0 to about 5.0, such as from about 5.0to 10.0, or such as from about 10.0 to about 18.0. A melt pool resultingfrom penetration irradiation may have a depth of from about 100 μm toabout 1 millimeter (mm), such as from about 100 μm to about 250 μm, suchas from about 250 μm to about 500 μm, or such as from about 500 μm toabout 800 μm.

Exemplary additive manufacturing machines may include an irradiationdevice that includes an optical modulator. The optical modulator mayinclude a micromirror device, such as a digital micromirror device, orthe like. A micromirror device may be configured as amicro-opto-electro-mechanical system that includes an integration ofmechanical, optical, and electrical systems that involve manipulation ofoptical signals a very small sizes. An exemplary micromirror device mayinclude a micromirror array made up of a plurality of micromirrorelements respectively coupled to an addressable element. The addressableelements may be actuated to cause the corresponding micromirror elementto move to respective ones of a plurality of modulation states. As usedherein, the term “modulation state” refers to a position or orientationof a micromirror elements imparted by a corresponding addressableelement and/or the position or orientation of the addressable element.The term modulation state may be used with reference to one or moremicromirror elements and/or with reference to a corresponding one ormore addressable elements. By way of example, a micromirror element maybe titled in a first direction in a first modulation state, causing abeam segment reflected by the micromirror element to be directed to afocusing lens assembly. Additionally, or in the alternative, amicromirror element may be tilted in a second direction in a secondmodulation state, causing a beam segment reflected by the micromirrorelement to be directed to a beam stop. As used herein, the term “beamsegment” refers to a cross-sectional portion of an energy beampropagating along an optical path that includes reflection by arespective micromirror element of an optical modulator. An opticalmodulator may include a micromirror array made up of a plurality ofmicromirror elements. An energy beam that becomes incident upon amicromirror array may be described with reference to a plurality of beamsegments, with respective ones of the plurality of beam segmentscorresponding to respective ones of the plurality of micromirrorelements of the optical modulator.

An irradiation devices that includes such an optical modulator may beadvantageously utilized with a conduction irradiation regime. Therelatively lower intensity and/or power density associated withconduction irradiation may allow for the use of optical modulators witha relatively large pixel density, thereby allowing for increasedresolution when irradiating the powder bed. The increased resolutionrealized by the present disclosure may be utilized to facilitatesophisticated irradiation strategies that provide for improvedtemperature control and/or improved material properties of threedimensional objects formed during an additive manufacturing process.Additionally, or in the alternative, the increased resolution realizedby the present disclosure may be utilized to produce three dimensionalobjects that have smaller features, improved surface properties, and/orgreater dimensional tolerances.

In some embodiments, a plurality of beam segments may be combined to atleast partially overlap with one another. The plurality of beam segmentsmay be combined by way of a focusing lens assembly that includes one ormore optical elements that have a particular configuration orarrangement that provides for their combination and/or by way of themodulation state of the respective micromirror elements causing theplurality of beam segments to propagate in a direction that provides fortheir combination. The respective modulation states may be coordinatedwith the configuration or arrangement of the focusing lens assembly.

A plurality of beam segments that are combined with one another may bedescribed in association with an optical modulator by reference to amodulation group. As used herein, the term “modulation group” refers toa subset of micromirror elements and/or corresponding addressableelements of an optical modulator. In some embodiments, a modulationgroup may include a subset of micromirror elements and/or correspondingaddressable elements of an optical modulator that are respectivelyactuated to a modulation state that causes a corresponding plurality ofbeam segments to become incident upon a focusing lens assembly and/or abuild plane. Additionally, or in the alternative, a modulation group mayinclude one or more of micromirror elements and/or correspondingaddressable elements of an optical modulator that are respectivelyactuated to a modulation state that causes a corresponding one or morebeam segments to become incident upon a beam stop. In some embodiments,a modulation group may include a subset of micromirror elements and/orcorresponding addressable elements of an optical modulator that arerespectively actuated to a modulation state that causes thecorresponding plurality of beam segments to be combined to at leastpartially overlap with one another at least at a combination zone.Additionally, or in the alternative, in some embodiments, a modulationgroup may include a subset of micromirror elements and/or correspondingaddressable elements of an optical modulator that are respectivelyactuated to a modulation state that causes the corresponding pluralityof beam segments to become incident upon a build plane withoutoverlapping with one another. When a plurality of beam segmentscorresponding to a modulation group at least partially overlap with oneanother at a combination zone, such combination zone may coincide with afocal point of a focusing lens assembly of the irradiation device and/ora beam spot on the powder bed. An optical modulator may be describedwith reference to a plurality of modulation groups, with respective onesof the plurality of modulation groups including a corresponding subsetof addressable elements and/or micromirror elements. The plurality ofmodulation groups may provide a corresponding plurality of subsets ofbeam segments, such as a corresponding plurality of subsets of beamsegments that combine and/or at least partially overlap with one anothera respective ones of a plurality of combination zones, and/or acorresponding plurality of subsets of beam segments that become incidentupon a build plane without overlapping with one another. The combinationof the beam segments corresponding to the respective modulation groupsmay provide a plurality of beam spots with an increased intensity and/orpower density relative to the intensity and/or power density of theenergy beam upstream from the optical modulator, such as relative to theintensity and/or power density of the energy beam when emitted from abeam generation device and/or when incident upon the optical modulator.A plurality of combination zones respectively corresponding to aplurality of modulation groups may be directed onto the build plane inthe form of a pattern, such as along the build plane, generatedaccording to beam modulation instructions. For example, the pattern mayinclude a linear or curvilinear arrangement of combination zones, whichmay be adjacent to one another and/or overlapping with one another.Additionally, or in the alternative, a plurality of beam segmentscorresponding to a modulation group may propagate incrementally across abuild plane comprising a build array defining a plurality of buildpoints such that a subset of build points in the build arrayrespectively receive irradiation sequentially from the plurality of beamsegments corresponding to the modulation group, for example, from aplurality of beam segments that become incident upon the build planewithout overlapping with one another.

In some embodiments, the optical modulator may be utilized to provide aplurality of beam spots respectively corresponding to a combinationzone. The plurality of beam spots may be scanned across a powder bed ina coordinated manner, such as in the form of a linear or curvilineararrangement of beam spots. The plurality of beam spots may berespectively defined by a combination zone corresponding to a modulationgroup that includes a subset of addressable elements of the opticalmodulator. However, in some embodiments the beam segments need not becombined. The linear or curvilinear arrangement of beam spots may bescanned across the powder bed while respective addressable elements ofthe optical modulator may be modulated according to beam modulationinstructions. The powder bed can be irradiated with good resolutionwhile the beam spots are modulated by the optical modulator. With aconduction irradiation regime, heat transfer from adjacent beam spotsare limited by the thermal conductivity of the powder material, and assuch, the melt pool corresponding to respective beam spots can besubstantially confined to specified build points of the powder bed. Insome embodiments, the presently disclosed additive manufacturingmachines may allow for a powder bed to be irradiated with a resolutionthat approaches or corresponds to a pixel density of the opticalmodulator. Additionally, or in the alternative, the presently disclosedadditive manufacturing machines may allow for a powder bed to beirradiated with a resolution exhibiting a build point dimension that issmaller than a diameter of the energy beam emitted by an energy beamdevice. For example, the voxel dimension may correspond to the pixeldensity of the optical modulator.

As described herein, the presently disclosed subject matter involves theuse of additive manufacturing machines or systems. As used herein, theterm “additive manufacturing” refers generally to manufacturingtechnology in which components are manufactured in a piece-by-piece or alayer-by-layer manner. An exemplary additive manufacturing machine maybe configured to utilize any suitable additive manufacturing technology.The additive manufacturing machine may utilize an additive manufacturingtechnology that includes a powder bed fusion (PBF) technology, such as adirect metal laser melting (DMLM) technology, a selective laser melting(SLM) technology, a directed metal laser sintering (DMLS) technology, ora selective laser sintering (SLS) technology. In an exemplary PBFtechnology, thin layers of powder material are sequentially applied to abuild plane and then selectively melted or fused to one another in alayer-by-layer manner to form one or more three-dimensional objects.Additively manufactured objects are generally monolithic in nature andmay have a variety of integral sub-components.

Additionally or alternatively suitable additive manufacturingtechnologies may include, for example, Fused Deposition Modeling (FDM)technology, Direct Energy Deposition (DED) technology, Laser EngineeredNet Shaping (LENS) technology, Laser Net Shape Manufacturing (LNSM)technology, Direct Metal Deposition (DMD) technology, Digital LightProcessing (DLP) technology, Vat Polymerization (VP) technology,Stereolithography (SLA) technology, and other additive manufacturingtechnologies that utilize an energy beam or other energy source tosolidify an additive manufacturing material such as a powder material.In fact, any suitable additive manufacturing modality may be utilizedwith the presently disclosed the subject matter.

Additive manufacturing technology may generally be described asfabrication of objects by building objects point-by-point, line-by-line,or layer-by-layer, typically in a vertical direction. Other methods offabrication are contemplated and within the scope of the presentdisclosure. For example, although the discussion herein refers to theaddition of material to form successive layers, the presently disclosedsubject matter may be practiced with any additive manufacturingtechnology or other manufacturing technology, including layer-additiveprocesses, layer-subtractive processes, or hybrid processes.

The additive manufacturing processes described herein may be used forforming components using any suitable material. For example, thematerial may be metal, ceramic, polymer, epoxy, photopolymer resin,plastic, concrete, or any other suitable material that may be in solid,liquid, powder, sheet material, wire, or any other suitable form, orcombinations thereof. Exemplary materials may include metals, polymers,or ceramics, as well as combinations thereof. Additionally, or in thealternative, exemplary materials may include metals, ceramics, orbinders, as well as combinations thereof. Exemplary ceramics may includeultra-high-temperature ceramics, and/or precursors forultra-high-temperature ceramics, such as polymeric precursors. Eachsuccessive layer of powder material. Each successive layer may be, forexample, between about 10 m and 200 m, although the thickness may bedetermined based on any number of parameters and may be any suitablesize.

As used herein, the term “build plane” refers to a plane defined by asurface upon which an energy beam impinges during an additivemanufacturing process. Generally, the surface of a powder bed definesthe build plane. During irradiation of a respective layer of the powderbed, a previously irradiated portion of the respective layer may definea portion of the build plane, and/or prior to distributing powdermaterial across a build module, a build plate that supports the powderbed generally defines the build plane.

It is understood that terms “upstream” and “downstream” refer to therelative direction with respect to fluid flow in a fluid pathway. Forexample, “upstream” refers to the direction from which the fluid flows,and “downstream” refers to the direction to which the fluid flows. It isalso understood that terms such as “top”, “bottom”, “outward”, “inward”,and the like are words of convenience and are not to be construed aslimiting terms. As used herein, the terms “first”, “second”, and “third”may be used interchangeably to distinguish one component from anotherand are not intended to signify location or importance of the individualcomponents. The terms “a” and “an” do not denote a limitation ofquantity, but rather denote the presence of at least one of thereferenced item.

Approximating language, as used herein throughout the specification andclaims, may be applied to modify any quantitative representation thatcould permissibly vary without resulting in a change in the basicfunction to which it is related. Accordingly, a value modified by a termor terms, such as “about,” “substantially,” and “approximately,” are notto be limited to the precise value specified. In at least someinstances, the approximating language may correspond to the precision ofan instrument for measuring the value, or the precision of the methodsor machines for constructing or manufacturing the components and/orsystems. For example, the approximating language may refer to beingwithin a 10 percent margin.

Here and throughout the specification and claims, range limitations arecombined and interchanged, such ranges are identified and include allthe sub-ranges contained therein unless context or language indicatesotherwise. For example, all ranges disclosed herein are inclusive of theendpoints, and the endpoints are independently combinable with eachother.

The presently disclosed subject matter will now be described in furtherdetail. FIGS. 1A and 1 i, and FIGS. 2A and 2B, schematically depictexemplary additive manufacturing systems 100. As shown, an additivemanufacturing system 100 may include one or more additive manufacturingmachines 102. It will be appreciated that the additive manufacturingsystems 100 and machines 102 shown in FIGS. 1A and 1 i, and FIGS. 2A and2B, are provided by way of example and not to be limiting. In fact, thesubject matter of the present disclosure may be practiced with anysuitable additive manufacturing system 100 and machine 102 withoutdeparting from the scope of the present disclosure.

As shown, the one or more additive manufacturing machines 102 mayinclude a control system 104. The control system 104 may be included aspart of the additive manufacturing machine 102 or the control system 104may be associated with the additive manufacturing machine 102. Thecontrol system 104 may include componentry integrated as part of theadditive manufacturing machine 102 and/or componentry that is providedseparately from the additive manufacturing machine 102. Variouscomponentry of the control system 104 may be communicatively coupled tovarious componentry of the additive manufacturing machine 102.

The control system 104 may be communicatively coupled with a managementsystem 106 and/or a user interface 108. The management system 106 may beconfigured to interact with the control system 104 in connection withenterprise-level operations pertaining to the additive manufacturingsystem 100. Such enterprise level operations may include transmittingdata from the management system 106 to the control system 104 and/ortransmitting data from the control system 104 to the management system106. The user interface 108 may include one or more user input/outputdevices to allow a user to interact with the additive manufacturingsystem 100.

As shown, for example, in FIG. 1A, an additive manufacturing machine 102may include a build module 110 that includes a build chamber 112 withinwhich an object or objects 114 may be additively manufactured. Anadditive manufacturing machine 102 may include a powder module 116 thatcontains a supply of powder material 120 housed within a supply chamber122. The build module 110 and/or the powder module 116 may be providedin the form of modular containers configured to be installed into andremoved from the additive manufacturing machine 102 such as in anassembly-line process. Additionally, or in the alternative, the buildmodule 110 and/or the powder module 116 may define a fixed componentryof the additive manufacturing machine 102.

The powder module 116 may include a powder piston 124 that actuates apowder supply floor 126 during operation of the additive manufacturingmachine 102. As the powder supply floor 126 actuates, a portion of thepowder material 120 is forced out of the powder module 116. A recoater128 such as a blade or roller sequentially distributes thin layers ofpowder material 120 across a build plane 130 above the build module 110.A build platform 132 supports the sequential layers of powder material120 distributed across the build plane 130. A build platform 132 mayinclude a build plate (not shown) secured thereto and upon which anobject 114 may be additively manufactured.

As shown, for example, in FIGS. 1A and 1B, an additive manufacturingmachine 102 may include an energy beam system 134 configured to generateone or more of energy beams and to direct the respective energy beamsonto the build plane 130 to selectively solidify respective portions ofthe powder bed 138 defining the build plane 130. The energy beams may belaser beams or beams from any other suitable energy source, such as LEDsor other light sources, and so forth. As the respective energy beamsselectively melt or fuse the sequential layers of powder material 120that define the powder bed 138, the object 114 begins to take shape. Theone or more energy beams or laser beams may include electromagneticradiation having any suitable wavelength or wavelength range, such as awavelength or wavelength range corresponding to infrared light, visiblelight, and/or ultraviolet light.

Typically, with a DMLM, EBM, or SLM system, the powder material 120 isfully melted, with respective layers being melted or re-melted withrespective passes of the energy beams. With DMLS or SLS systems,typically the layers of powder material 120 are sintered, fusingparticles of powder material 120 to one another generally withoutreaching the melting point of the powder material 120. The energy beamsystem 134 may include componentry integrated as part of the additivemanufacturing machine 102 and/or componentry that is provided separatelyfrom the additive manufacturing machine 102.

The energy beam system 134 may include one or more irradiation devices142 configured to generate a plurality of energy beams 144 and to directthe energy beams 144 upon the build plane 130. As shown, for example, inFIG. 1A, an energy beam system 134 may include a plurality ofirradiation devices 142, such as a first irradiation device 142 and asecond irradiation device 142. The one or more irradiation devices mayrespectively include an energy beam source, a scanner, and opticalassembly. The optical assembly may include a plurality of opticalelements 136 configured to direct the energy beam onto the build plane130. By way of example, the one or more optical elements 136 may includeone more focusing lenses that focus an energy beam 144 on a build plane130. Additionally, or in the alternative, the energy beam system 134 mayinclude a window 137, such as a protective glass, that separates one ormore components of the energy beam system 134 from the environment of aprocess chamber 140 within which powder material 120 is irradiated bythe one or more energy beams 144 to additively manufacture athree-dimensional object 114.

A flow of inert process gas 141 may be supplied to the process chamber140, for example, to remove contaminants such as fumes and soot from theprocess chamber 140 and/or to reduce the tendency of such contaminantsto deposit on the on the window 137, optical elements 136, or othercomponentry of the energy beam system 134. Additionally, or in thealternative, the flow if inert process gas 141 may reduce the tendencyof such contaminants to interfere with the energy beams 144 used toirradiate the powder material 120.

The plurality of energy beams 144 may become incident upon the buildplane 130, for example, after passing through one or more opticalelements 136 and/or a window 137 of the energy beam system 134.Additionally, or in the alternative, an irradiation device 142 mayinclude a scanner configured to direct the plurality of energy beams 144onto the powder bed 138. An exemplary scanner may include a galvoscanner, an electro-optic modulator, an acousto-optic modulator, apiezo-driven mirror, or the like. To irradiate a layer of the powder bed138, the one or more irradiation devices 142 respectively direct theplurality of energy beams 144 across the respective portions of thebuild plane 130 to melt or fuse the portions of the powder material 120that are to become part of the object 114.

As shown in FIG. 1A, the energy beam system 134 may include a firstirradiation device 142 a and a second irradiation device 142 b. Thefirst irradiation device 142 a may include a first optical assembly thatincludes a first one or more optical elements 136 a, and/or the secondirradiation device 142 b may include a second optical assembly thatincludes a second one or more optical elements 136 b. Additionally, orin the alternative, an energy beam system 134 may include three, four,six, eight, ten, or more irradiation devices, and such irradiationdevices may respectively include an optical assembly that includes oneor more optical elements 136. The plurality of irradiation devices 142may be configured to respectively generate one or more energy beams thatare respectively scannable within a scan field incident upon at least aportion of the build plane 130 to melt or fuse the portions of thepowder material 120 that are to become part of the object 114. Forexample, the first irradiation device 142 a may generate a first energybeam 144 a that is scannable within a first scan field 146 a incidentupon at least a first build plane region 148 a. The second irradiationdevice 142 b may generate a second energy beam 144 b that is scannablewithin a second scan field 146 b incident upon at least a second buildplane region 148 b. The first scan field 146 a and the second scan field146 b may overlap such that the first build plane region 148 a scannableby the first energy beam 144 a overlaps with the second build planeregion 148 b scannable by the second energy beam 144 b. The overlappingportion of the first build plane region 148 a and the second build planeregion 148 b may sometimes be referred to as an interlace region 150.Portions of the powder bed 138 to be irradiated within the interlaceregion 150 may be irradiated by the first energy beam 144 a and/or thesecond energy beam 144 b in accordance with the present disclosure.

To irradiate a layer of the powder bed 138, the one or more irradiationdevices (e.g., the first irradiation device 142 a and the secondirradiation device 142 b) respectively direct the plurality of energybeams (e.g., the first energy beam 144 a and the second energy beam 144b) across the respective portions of the build plane 130 (e.g., thefirst build plane region 148 a and the second build plane region 148 b)to melt or fuse the portions of the powder material 120 that are tobecome part of the object 114. The first layer or series of layers ofthe powder bed 138 are typically melted or fused to the build platform132, and then sequential layers of the powder bed 138 are melted orfused to one another to additively manufacture the object 114. Assequential layers of the powder bed 138 are melted or fused to oneanother, a build piston 152 gradually moves the build platform 132 tomake room for sequential layers of powder material 120. As the buildpiston 152 gradually lowers and sequential layers of powdered material120 are applied across the build plane 130, the next sequential layer ofpowder material 120 defines the surface of the powder bed 138 coincidingwith the build plane 130. Sequential layers of the powder bed 138 may beselectively melted or fused until a completed object 114 has beenadditively manufactured.

Still referring to FIGS. 1A and 1B, an additive manufacturing machine102 may include an imaging system 154 configured to monitor one or moreoperating parameters of an additive manufacturing machine 102, one ormore parameters of an energy beam system 134, and/or one or moreoperating parameters of an additive manufacturing process. The imagingsystem may a calibration system configured to calibrate one or moreoperating parameters of an additive manufacturing machine 102 and/or ofan additive manufacturing process. The imaging system 154 may be a meltpool monitoring system. The one or more operating parameters of theadditive manufacturing process may include operating parametersassociated with additively manufacturing a three-dimensional object 114.The imaging system 154 may be configured to detect an imaging beam suchas an infrared beam from a laser diode and/or a reflected portion of anenergy beam (e.g., a first energy beam 144 a and/or a second energy beam144 b).

An energy beam system 134 and/or an imaging system 154 may include oneor more detection devices. The one or more detection devices may beconfigured to determine one or more parameters of an energy beam system134, such as one or more parameters associated with irradiating thesequential layers of the powder bed 138 based at least in part on anassessment beam detected by the imaging system 154. One or moreparameters associated with irradiating the sequential layers of thepowder bed 138 may include irradiation parameters and/or objectparameters, such as melt pool monitoring parameters. The one or moreparameters determined by the imaging system 154 may be utilized, forexample, by the control system 104, to control one or more operations ofthe additive manufacturing machine 102 and/or of the additivemanufacturing system 100. The one or more detection devices may beconfigured to obtain assessment data of the build plane 130 from arespective assessment beam. An exemplary detection device may include acamera, an image sensor, a photo diode assembly, or the like. Forexample, a detection device may include charge-coupled device (e.g., aCCD sensor), an active-pixel sensor (e.g., a CMOS sensor), a quantaimage device (e.g., a QIS sensor), or the like. A detection device mayadditionally include a lens assembly configured to focus an assessmentbeam along a beam path to the detection device. An imaging system 154may include one or more imaging optical elements (not shown), such asmirrors, beam splitters, lenses, and the like, configured to direct anassessment beam to a corresponding detection device.

In addition, or in the alternative to determining parameters associatedwith irradiation the sequential layers of the powder bed 138, theimaging system 154 may be configured to perform one or more calibrationoperations associated with an additive manufacturing machine 102, suchas a calibration operation associated with the energy beam system 134,one or more irradiation devices 142 or components thereof, and/or theimaging system 154 or components thereof. The imaging system 154 may beconfigured to project an assessment beam and to detect a portion of theassessment beam reflected from the build plane 130. The assessment beammay be projected by an irradiation device 142 and/or a separate beamsource associated with the imaging system 154. Additionally, and/or inthe alternative, the imaging system 154 may be configured to detect anassessment beam that includes radiation emitted from the build plane130, such as radiation from an energy beam 144 reflected from the powderbed 138 and/or radiation emitted from a melt pool in the powder bed 138generated by an energy beam 144 and/or radiation emitted from a portionof the powder bed 138 adjacent to the melt pool. The imaging system 154may include componentry integrated as part of the additive manufacturingmachine 102 and/or componentry that is provided separately from theadditive manufacturing machine 102. For example, the imaging system 154may include componentry integrated as part of the energy beam system134. Additionally, or in the alternative, the imaging system 154 mayinclude separate componentry, such as in the form of an assembly, thatcan be installed as part of the energy beam system 134 and/or as part ofthe additive manufacturing machine 102.

Still referring to FIGS. 1A and 1 i, in some embodiments, an additivemanufacturing machine may include a positioning system 156 configured tomove an energy beam system 134 and/or one or more components thereofrelative to the build plane 130. The positioning system 156 may beconfigured to move the energy beam system 134 and/or one or morecomponents thereof to specified build coordinates and/or along specifiedbuild vectors corresponding to a cartesian coordinate system inaccordance with control commands provided, for example, by the controlsystem 104. The control commands may be provided, for example, to carryout operations of the one or more energy beam system 134 and/or of theadditive manufacturing machine 102 in accordance with the presentdisclosure. The positioning system 156 may include one or more gantryelements 158 configured to move the energy beam system 134 and/or one ormore components thereof across the powder bed. Respective gantryelements 158 may be configured to move the energy beam system 134 and/orone or more components thereof in one or more directions, such as anX-direction, a Y-direction, and/or a Z-direction. In some embodiments,the positioning system 156 may be coupled to a housing assembly 160 thatcontains one or more components of the energy beam system 134, such asone or more irradiation devices 142 and or one or more imaging systems154. The housing assembly 160 may be coupled to one or more gantryelements 158 by one or more gantry mounts 162. The positioning system156 may include a drive motor 164 configured to move the housingassembly 160 and/or the one or more components the energy beam system134 according to instructions for the control system 104. Thepositioning system 156 may include componentry typically associated witha gantry system, such as stepper motors, drive elements, carriages, andso forth.

The energy beam system 134 may be positioned at any suitable locationwithin the process chamber 140. Additionally, or in the alternative, theenergy beam system 134 may be coupled to a perimeter wall of the processchamber 140. In some embodiments, as shown, for example, in FIG. 1B, anenergy beam system 134 may be positioned in close proximity to the buildplane 130. As shown in FIG. 1B, an inertization system 166 may supply aflow of inert process gas 141 to a region of the process chamber 140between the energy beam system 134 and the powder bed 138. Theinertization system 166 may include a supply manifold 168 and a returnmanifold 170. As shown in FIG. 1B, the supply manifold 168 and/or thereturn manifold 170 may be coupled to the housing assembly 160. With thesupply manifold 168 and/or the return manifold 170 coupled to thehousing assembly 160, a relatively small volume of space between theenergy beam system 134 and the powder bed 138 may be inertized, asopposed to inertizing an entire process chamber 140. Additionally, or inthe alternative, contaminants may have a shorter path to travel beforebeing drawn into the return manifold 170 by the flow of inert processgas 141.

Referring now to FIGS. 2A and 2B, an additive manufacturing system 100or additive manufacturing machine 102 may include one or more buildunits 200 configured to selectively solidify powder material 120 toadditively manufacture a three-dimensional object 114. In someembodiments, the additive manufacturing system 100 or additivemanufacturing machine 102 may be configured for large format additivemanufacturing. For example, one or more build units 200 may beconfigured to irradiate a powder bed 138 supported by a build vessel 202that includes a cross-sectional area that exceeds the cross-sectionalarea of the one or more build units 200. Likewise, an object 114additively manufactured with the additive manufacturing machine 102 mayhave a cross-sectional area that is larger than the one or more buildunits 200. The one or more build units 200 and/or the build vessel 202may be movable relative to one another, for example, to performlarge-format additive manufacturing operations.

As shown in FIGS. 2A and 2B, an exemplary build unit 200 may include anenergy beam system 134 and an irradiation chamber 204. The build unit200 may be configured to irradiate powder material 120 within a regionof the powder bed coinciding the perimeter of the irradiation chamber204. The one or more build units 200 may be movable relative to thebuild vessel 202, and/or the build vessel 202 may be movable relative toone or more build units 200. For example, a build unit 200 and/or abuild vessel 202 may be movable in one or more directions, such as anX-direction, a Y-direction, and/or a Z-direction. Movement of a buildunit 200 relative to the build vessel 202 may be configured to allow thebuild unit 200 to access various regions of the powder bed 138 so thatthe energy beam system 134 may irradiate powder material 120 inrespective regions. The energy beam system 134 may be configured asdescribed with reference to FIG. 1 . The energy beam system 134 mayinclude one or more irradiation devices 142 and/or other components asdescribed herein. The irradiation chamber 204 may be configured toprovide an inert environment for irradiating the powder bed 138. A flowof inert process gas may be supplied to the irradiation chamber 204, forexample, to remove contaminants such as fumes and soot from theirradiation chamber 204 and/or to reduce the tendency for suchcontaminants from depositing on the optical elements 136 and/or frominterfering with the energy beams 144 used to irradiate the powdermaterial 120. In some embodiments, a build unit 200 may include a powdersupply hopper 206 configured to supply powder material 120 to a buildvessel 202. Additionally, or in the alternative, powder material 120 maybe supplied by a powder module 116 as described with reference to FIG. 1.

As shown in FIG. 1 , the one or more build units 200 may be operablycoupled to a build unit-positioning system 208. The buildunit-positioning system 208 may be configured to move the one or morebuild units 200 to specified build coordinates and/or along specifiedbuild vectors corresponding to a three-dimensional cartesian coordinatesystem in accordance with control commands provided, for example, by thecontrol system 104. The control commands may be provided, for example,to carry out operations of the one or more build units 200 and/or therespective components thereof. The build unit-positioning system 208 mayinclude one or more build unit-gantry elements 210 configured to movablysupport the one or more build units 200. The build unit-gantry elements210 may include componentry typically associated with a gantry system,such as stepper motors, drive elements, carriages, and so forth.Respective build unit-gantry elements 210 may be configured to move theone or more build units 200 in one or more directions, such as anX-direction, a Y-direction, and/or a Z-direction.

As shown in FIG. 2A, the one or more build vessels 202 may be operablycoupled to a build vessel-positioning system 212. The buildvessel-positioning system 212 may be configured to move the build vessel202 to specified build coordinates and/or along specified build vectorscorresponding to a three-dimensional cartesian coordinate system inaccordance with control commands provided, for example, by the controlsystem 104. The control commands may be provided, for example, to carryout operations of the one or more build units 200 in accordance with thepresent disclosure. The build vessel-positioning system 212 may includeone or more build vessel-gantry elements 214 configured to movablysupport the build vessel 202. Respective build vessel-gantry elements214 may be configured to move the build vessel 202 in one or moredirections, such as an X-direction, a Y-direction, and/or a Z-direction.

The one or more build vessels 212 may be operably coupled to a buildvessel-positioning system 212 in addition to, or in the alternative to,one or more build units 200 operably coupled to a build unit-positioningsystem 208. For example, an additive manufacturing machine 102 mayinclude a build vessel-positioning system 212 and one or more stationarybuild units 200. Additionally, or in the alternative, an additivemanufacturing machine 102 may include a build vessel-positioning system212 and a build unit-positioning system 208. The buildvessel-positioning system 212 may be configured to move a build vessel202 in one or more directions, and the build vessel-positioning system212 may be configured to move a build vessel 202 in one or moredirections. For example, the build vessel-positioning system 212 may beconfigured to move a build vessel 202 in an X-direction and/or aY-direction. Additionally, or in the alternative, the buildunit-positioning system 208 may be configured to move a build unit 200in a Z-direction.

A build vessel-positioning system 212 may be configured to move a buildvessel 202 horizontally while one or more build units 200 selectivelyirradiate portions of the powder material 120 in the build vessel 202.For example, the build vessel-positioning system 212 may be configuredto move a build vessel 202 in accordance with an X-Y coordinate system.Additionally, or in the alternative, a build unit-positioning system 208may be configured to move a build unit 200 horizontally while the buildunit 200 selectively irradiates portions of the powder material 120 inthe build vessel 202. For example, the build vessel-positioning system212 may be configured to move a build vessel 202 in accordance with anX-Y coordinate system. A vertical position of the one or more buildunits 200 and/or the build vessel 202 may be augmented in connectionwith the addition of sequential layers of powder material 120 to thebuild vessel 202 and selective irradiation of the respective layers ofpowder material 120 in the build vessel 202. The buildvessel-positioning system 212 may be configured to sequentially move thebuild vessel 202 vertically to provide room for the next sequentiallayer of powder material 120 to be added to the build vessel 202.Additionally, or in the alternative, the build unit-positioning system208 may be configured to sequentially move a build unit 200 verticallyto provide room for the next sequential layer of powder material 120 tobe added to the build vessel 202. Movements of the build unit 200 and/orthe build vessel 202 may be carried out before, during, or after,irradiating a sequential layer of powder material 120.

Now referring to FIGS. 3A and 3B, exemplary energy beam systems 134 andirradiation devices 142 are further described. An energy beam system 134may include one or more irradiation devices 142. The irradiation devices142 described herein may be utilized in an additive manufacturing system100 and/or an additive manufacturing machine 102. Other uses are alsocontemplated. For example, exemplary irradiation device 142 may beutilized in laser welding systems, laser machining systems, laserablation systems, laser cutting systems, laser drilling systems, lasermicromanufacturing systems, and the like. As shown in FIGS. 3A and 3B,an exemplary irradiation device 142 may include a beam generation device300 and an optical modulator 302 disposed downstream from the beamgeneration device 300. The beam generation device 300 may be configuredto provide an energy beam 144. The energy beam 144 may be emitted fromthe beam generation device 300 with a power level and/or intensitysuitable for melting and/or sintering powder material 120. In someembodiments, the power level and/or intensity of the energy beam 144 maybe suitable for a conduction irradiation regime. The energy beam 144 mayfollow a beam path 304 that coincides with an optical axis of the energybeam 144, extending from the beam generation device 300 to thesolid-state optical modulator 302.

The optical modulator 302 may include a micromirror array 306 thatincludes a plurality of micromirror elements 308 respectively coupled toan addressable element 310. The optical modulator 302 may be configuredto direct cross-sectional portions of the energy beam 144 incident uponthe micromirror array 306 towards a focusing lens assembly 312 and/ortowards a beam stop 314 respectively disposed downstream from theoptical modulator 302, depending on a modulation state of respectiveaddressable elements 310. For example, in a first modulation state, anaddressable element 310 may cause a micromirror element 308 to direct acorresponding beam segment along an irradiation beam path 316 leading tothe focusing lens assembly 312. Beam segments that propagate through thefocusing lens assembly 312 may be utilized to irradiate powder material120 at the build plane 130. The focusing lens assembly 312 may includeone or more lenses or other optical elements configured to direct therespective beam segments onto the build plane 130. Additionally, or inthe alternative, in a second modulation state, an addressable element310 may cause a micromirror element 308 to direct a corresponding beamsegment along an extraction beam path 318 leading to a beam stop 314.The beam stop 314 may include an energy absorbing medium configured toabsorb energy from the beam segments that become incident upon the beamstop 314. Additionally, or in the alternative, the beam stop 314 mayinclude optical elements configured to recycle the energy from the beamsegments propagating to the beam stop 314 and thereby reduce energylosses.

In addition to the focusing lens assembly 312, an irradiation device 142may include a beam conditioning assembly 320 that includes one or moreoptical elements configured to focus and/or otherwise condition theenergy beam 144 prior to becoming incident upon the optical modulator302. In some embodiments, the beam conditioning assembly 320 may includea beam collimator 322. The beam collimator 322 may include one or morelenses and/or other optical elements configured to collimate the energybeam 144. Additionally, or in the alternative, the beam conditioningassembly may include a beam homogenizer 324. The beam homogenizer 324may be configured to provide a uniform power distribution across across-sectional profile of the energy beam 144. For example, an energybeam 144 may have a Gaussian power distribution as emitted by anirradiation device 142 and/or after having ben collimated by the beamcollimator 322. In some embodiments, the beam homogenizer 324 may beconfigured to provide a top-hat power distribution. Additionally, or inthe alternative, the beam homogenizer 324 may be configured to provide aplurality of beam segments that have a substantially uniform intensityand/or powder level. An exemplary beam homogenizer 324 may include oneor more microlens arrays in front of a condenser lens. Another exemplarybeam homogenizer 324 may include a rod lens or light pipe. Additionally,or in the alternative, the beam homogenizer 324 may include a lenselement aperture configured to conform the energy beam 144 to across-sectional profile that that corresponds to a surface area of theoptical modulator 302. For example, the beam homogenizer 324 may providean energy beam 144 that exhibits a rectangular cross-sectional profile,such as from an energy beam 144 that exhibits a circular cross-sectionalprofile.

The irradiation device 142 may include any one or more other opticalelements that may be suitable for the particular embodiment. Forexample, as shown in FIGS. 3A and 3B, the irradiation device may includeone or more dichroic elements 326, such as dichroic mirror, configuredto split a measurement beam 328 from the energy beam 144. Themeasurement beam 328 may propagate to a modulation sensor 330. Themodulation sensor 330 may include a charge-coupled device (e.g., a CCDsensor), an active-pixel sensor (e.g., a CMOS sensor), a quanta imagedevice (e.g., a QIS sensor), or the like. The modulation sensor 330 maybe configured to provide data pertaining to modulation of the energybeam 144 by the optical modulator 302. The data may be utilized by acontrol system 104, such as for process monitoring and control of theoptical modulator 302 and/or of the beam generation device 300. Forexample, the modulation sensor 330 may be configured to determinewhether the energy beam 144, as modulated by the optical modulator 302,corresponds to beam modulation instructions provided by the controlsystem 104 and/or to provide adjustments to the beam modulationinstructions and/or to the operation of the optical modulator 302 and/orthe operation of the beam generation device 300.

In some embodiments, as shown in FIG. 3A, the modulated portions of theenergy beam 144 may propagate through the focusing lens assembly anddirectly onto the build plane 130. The modulated portions of the energybeam 144 may pass through one or more optical elements 136, and/or awindow 137, that separates the components of the irradiation device 142from the process chamber 140. Additionally, or in the alternative, asshown in FIG. 3B, the irradiation device 142 may include a scanner 332,such as a galvo-scanner, a MEMS scanner, or the like. The scanner 332may be configured to direct the plurality of beam segments along thebuild plane 130 to irradiate specified locations of the powder bed 138.As shown in FIG. 3A, the irradiation device 142 may be movable relativeto the powder bed 138. For example, the irradiation device 142 may becoupled to one or more gantry elements 158 of a positioning system 156configured to movably support the irradiation device 142 and/or one ormore components thereof. Additionally, or in the alternative, as shownin FIG. 3B, the irradiation device 142 may be stationary, and thescanner 332 may direct the modulated energy beam 144 to variouslocations of the powder bed 138. Additionally, or in the alternative,the powder bed 138 may be movable relative to the irradiation device142.

The focusing lens assembly 312 may include one or more optical elements,such as lenses, mirrors, or the like, configured to focus respectivebeam segments onto the build plane 130. In some embodiments, an opticalmodulator 302 may reflect a plurality of subsets of beam segments to thefocusing lens assembly 312. Respective ones of the plurality of subsetsof beam segments may be associated with a respective modulation groupthat includes a corresponding subset of addressable elements 310. Thefocusing lens assembly 312 may cause the plurality of subsets of beamsegments corresponding to a respective modulation group to at leastpartially overlap with one another. In some embodiments, the focusinglens assembly 312 may cause the plurality of subsets of beam segmentscorresponding to a respective modulation group to at least partiallyoverlap with one another at a combination zone 334. The combination zone334 may correspond with a focal point of the focusing lens assembly 312.Additionally, or in the alternative, the combination zone 334 maycorrespond with and/or align with the build plane 130. In someembodiments, the combination zone 334 may be selectively offset in thez-direction from the build plane 130, such as slightly above the buildplane and/or slightly below the build plane 130. Additionally, or in thealternative, the focusing lens assembly 312 may cause the plurality ofsubsets of beam segments corresponding to a respective modulation groupto become aligned with a common optical axis, such as the optical axiscorresponding to the irradiation beam path 316. For example, therespective beam segments may at least partially overlap one another at aplurality of points along the irradiation beam path 316. A plurality ofcombination zones 334 respectively coinciding with a correspondingplurality of modulation groups may become incident upon the build plane130 in the form of beam spots 336 that have a particular pattern, suchas a linear or curvilinear arrangement of beam spots 336. Respectivebeam spots 336 corresponding to the combination zones 334 may beadjacent to one another and/or overlapping with one another.

The optical modulator 302 may be configured to actuate respectiveaddressable elements 310 according to beam modulation instructions froma control system 104 associated with the irradiation device 142.Addressable elements 310 of the optical modulator 302 corresponding torespective ones of the plurality of modulation groups may be actuatedaccording to the beam modulation instructions to irradiate powdermaterial 120 at the build plane with the specified pattern ofcombination zones 334. The combination of the beam segments may providea plurality combination zones 334 that respectively exhibit an increasedintensity and/or power density relative to a point upstream from theoptical modulator 302, such as relative to the intensity and/or powerdensity of the energy beam 144 when emitted from the beam generationdevice 300 and/or when incident upon the optical modulator 302. Theintensity and/or power density of the plurality of combination zones maycorrespond to a conduction irradiation regime. A plurality of beam spots336 coinciding with the respective combination zones 334 may be scannedacross the powder bed 138 in a coordinated manner or pattern, such as inthe form of a linear or curvilinear arrangement of beam spots 336. Insome embodiments, as shown, for example, in FIG. 3B, the irradiationdevice may include a cooling element 338 configured to cool the opticalmodulator 302.

The control system 104 may include a controller configured to causerespective ones of the plurality of addressable elements 310 to actuatethe corresponding micromirror elements 308 according to the beammodulation instructions. The beam modulation instructions may define amodulation state corresponding to respective ones of the plurality ofmodulation groups that include a subset of addressable elements 310 fromamong the plurality of addressable elements 310 of the optical modulator302. When the plurality of subsets of micromirror elements 308 arerespectively actuated according to the modulation state defined by themodulation instructions, such as a first modulation state, thecorresponding plurality of subsets of beam segments incident upon therespective micromirror elements 308 may follow an optical path, such asan irradiation beam path 316, to the focusing lens assembly 312 andonward to the build plane 130. Additionally, or in the alternative, whenmicromirror elements 308 are actuated, for example, according to asecond modulation state, the corresponding plurality of subsets of beamsegments incident upon the respective micromirror elements follow anoptical path, such as an extraction beam path 318, to the beam stop 314.

Now referring to FIGS. 4A-4G, exemplary optical modulators 302 arefurther described. As shown in FIGS. 4A and 4B, an optical modulator 302may include a micromirror array 306 that includes a plurality ofmicromirror elements 308. An energy beam 144 may have a cross-sectionalprofile configured to become incident on all or substantially all of themicromirror elements 308 of the micromirror array 306. For example, theenergy beam 144 may have a rectangular cross-sectional profile, whichmay correspond to a rectangular profile of the micromirror array 306.The energy beam 144 may have a nominal amount of underlap and/or overlapwith the micromirror array 306, which may be determined by way of acalibration procedure, for example, using a modulation sensor 330. Asshown in FIGS. 4A and 4B, a plurality of beam segments 400 may becomeincident upon respective micromirror elements 308 of the micromirrorarray 306. Beam segments 400 corresponding to a row or column ofmicromirror elements 308 are depicted for illustrative purposes;however, it will be appreciated that additional beam segments 400 maybecome incident upon the other micromirror elements 308 in themicromirror array 306. Respective micromirror elements 308 may beoriented in a plurality of orientations respectively corresponding to aplurality of modulation states. As shown, a first micromirror elementgroup 402 may exhibit a first modulation state. Additionally, or in thealternative, a second micromirror element group 404 may exhibit a secondmodulation state. By way of example, the first micromirror element group402 is shown tilted towards the right and the second micromirror elementgroup 404 is shown titled towards the left. The first micromirrorelement group 402 and the second micromirror element group 404 mayrespectively represent a modulation group. Additionally, or in thealternative, the first micromirror element group 402 and the secondmicromirror element group 404 may respectively include a plurality ofmodulation groups. As shown in FIG. 4A, beam segments 400 that becomeincident upon micromirror elements 308 oriented according to the firstmodulation state may reflect towards a focusing lens assembly 312. Asshown in FIG. 4B, beam segments 400 that become incident uponmicromirror elements 308 oriented according to the second modulationstate may reflect towards a beam stop 314.

The first micromirror element group 402 may include a plurality ofsubsets of micromirror elements 308. Respective ones of the plurality ofsubsets of micromirror elements 308 may represent a modulation group.Additionally, or in the alternative, a modulation group may be describedwith reference to a plurality of subsets of micromirror elements 308.For example, as shown in FIG. 4A, the first micromirror element group402 may include a first micromirror element-subset 406. A first beamsegment-subset 408 that becomes incident upon the first micromirrorelement-subset 406 may propagate towards the focusing lens assembly 312.The first beam segment-subset 408 may include a plurality of beamsegments 400 respectively corresponding to the plurality of micromirrorelements 308 in the first micromirror element-subset 406. The secondmicromirror element group 404 may include a second plurality of subsetsof micromirror elements 308. For example, as shown in FIG. 4B, thesecond micromirror element group 404 may include a second micromirrorelement-subset 410. A second beam segment-subset 412 that becomesincident upon the second micromirror element-subset 410 may propagatetowards the beam stop 314. The second beam segment-subset 412 mayinclude a plurality of beam segments 400 respectively corresponding tothe plurality of micromirror elements 308 in the second micromirrorelement-subset 410. The first micromirror element-subset 406 and/or thesecond micromirror element-subset 410 may include a plurality ofmicromirror elements 308 arranged in a row or column. Other arrangementsare also contemplated, including columns, arrays, and/or regions, aswell as spatially separated columns, arrays, and/or regions.

As shown in FIGS. 4C and 4D, an optical modulator 302 may include amicromirror array 306 operably coupled to a plurality of addressableelements 310. The plurality of addressable elements 310 may berespectively configured to actuate a corresponding micromirror element308 of the micromirror array 306. The micromirror array 306 may beconfigured as a two-dimensional array or as a one-dimensional array. Theexemplary optical modulators 302 shown in FIGS. 4C and 4D areillustrated as having plate-type addressable elements 310. However,optical modulators 302 with other addressable elements 310 are alsocontemplated, including comb-type addressable elements 310, thermaladdressable elements 310, Lorentz addressable elements 310, andpiezoelectric addressable elements 310. As shown in FIG. 4C, themicromirror array 306 may be configured as an array of discretemicromirror elements 308. As shown in FIG. 4D, the micromirror array maybe configured as a continuous membrane with respect to which the term“micromirror elements” 308 refers to portions of the continuous membraneconfigured to deform locally according to movements of the respectiveaddressable elements 310.

An optical modulator 302 may be configured as a semiconductor element,such as CMOS semiconductor element or any other suitable a MOSFETsemiconductor element. The semiconductor element may include an array ofaddressable elements 310 with respective micromirror elements 308coupled to respective addressable elements 310. An exemplary addressableelement 310 may include a flexure assembly 414 configured to utilizeelastic deformation to achieve specified motions corresponding torespective modulation states. The flexure assembly may include one ormore flexure elements 416 coupled to a base plate 418. Exemplary flexureelements may be configured as slender wires or flat blade elementsconfigured to exhibit elastic deformation. An exemplary addressableelement 310 may additionally include one or more electrodes 420configured to receive an electric current from circuitry, such as CMOSor other MOSFET circuitry. The electrodes 420 may exhibit anelectrostatic field corresponding to a modulation state introduced byway of the circuitry of the semiconductor element. The electrostaticfield exhibited by an electrode 420 of an addressable element 310 mayattract and/or repel an adjacent portion of a corresponding micromirrorelement 308 coupled to the flexure assembly 414, causing the micromirrorelement 308 to tip, tilt, or extend in accordance with the electrostaticfield corresponding to the respective modulation state. The flexureassembly 414 may include a post element 422 coupling the respectivemicromirror element 308 to the flexure elements 416 of the flexureassembly 414.

Exemplary optical modulators 302 may be configured to exhibit aplurality of modulation states corresponding to tip, tilt, or pistonmotions, as well as combinations of these. FIG. 4E shows an opticalmodulator 302 configured to exhibit a plurality of modulation statescorresponding to tip motion. FIG. 4F shows an optical modulator 302configured to exhibit a plurality of modulation states corresponding totilt motion. FIG. 4G shows an optical modulator 302 configured toexhibit a plurality of modulation states corresponding to a pistonmotion. An optical modulator 302 configured to exhibit a plurality ofmodulation states corresponding to each of a tip motion, a tilt motion,and a piston motion may sometimes be referred to as a TTP opticalmodulator. An optical modulator 302 configured to exhibit a plurality ofmodulation states corresponding to each of a tip motion and a tiltmotion may sometimes be referred to as a TT optical modulator. Anoptical modulator 302 configured to exhibit a plurality of modulationstates corresponding each of a tip motion and a piston motion maysometimes be referred to as a TP optical modulator.

An optical modulator 302 may include addressable elements 310 configuredto be actuated to provide a modulation state by way of a digitalactuator, an analog actuator, or a resonant actuator. An opticalmodulator 302 that includes a digital actuator may utilize discretesignals configured to move respective micromirror elements 308 todiscrete positions. These discrete positions may be set by mechanicalstops 424 that ensure the micromirror element 308 stops at the discretepositions according to the modulation state corresponding to thediscrete signal. By way of example, a TT optical modulator that includesa digital actuator may exhibit eight (8) discrete modulation statescorresponding to respective degrees of freedom associated withbidirectional tip actuation and bidirectional tilt auction. A TP opticalmodulator that includes a digital actuator may similarly exhibit eight(8) discrete modulation states. As another example, a TTP opticalmodulator that includes a digital actuator may exhibit sixteen (16)discrete modulation states. An optical modulator 302 that includes ananalog actuator may be configured to drive and hold an addressableelement 310 to any position within a range of motion corresponding to ananalog signal. An optical modulator 302 that includes a resonantactuator may be configured to utilize a harmonic actuation signal toactuate an addressable elements 310. The harmonic actuation signal maycorrespond to a resonant frequency of the flexure assembly 414 and/orone or more flexure elements 416 thereof, such that flexion of therespective flexure elements 416 becomes amplified. The harmonicactuation signal may provide a sinusoidal actuation motion of theaddressable elements 310. In some embodiments, the harmonic actuationmay be synchronized with a pulse frequency of a beam generation device300.

An optical modulator 302 may be described with reference to a mirrorarea (A_(m)) according to the following relationship: A_(m)=γ_(F)L²,where γ_(F) is the directed fill factor and L is the pitch. The directedfill factor (γ_(F)) refers to the percent of the area of the micromirrorarray 306 that reflects the energy beam 144 from only the micromirrorelements 308 of micromirror array 306. The directed fill factordistinguishes portion of the energy beam 144 reflected by themicromirror elements 308 as opposed to portions of the energy beam 144that may be reflected by portions of the optical modulator accessible bythe energy beam propagating through gaps between adjacent micromirrorelements 308. The pitch (L) of the optical modulator refers to thesquare root of the area occupied by the micromirror elements 308 in themicromirror array 306. The pitch may correspond to an average distancebetween center points of adjacent micromirror elements 308. The pitchmay differ as between the x-direction and the y-direction. An exemplaryoptical modulator 302 may have a mirror area (A_(m)) of from about 100millimeters squared (mm²) to about 2,500 mm², such as from about 100mm^(2v) to about 400 mm², such as from about 400 mm² to about 800 mm²,such as from about 800 mm² to about 1,500 mm², or such as from about1,500 mm² to about 2,500 mm². An exemplary optical modulator 302 mayhave a pitch of from about 10 micrometers (μm) to about 500 μm, such asfrom about 10 μm to about 50 μm, such as from about 50 μm to about 100μm, such as from about 100 μm to about 250 μm, or such as from about 250μm to about 500 μm. An exemplary optical modulator 302 may have a fillfactor of from about 75% to about 100%, such as from about 90% to about100%, such as from about 95% to about 100%, or such as from about 99% toabout 100%. An exemplary optical modulator 302 may have a micromirrorarray 306 that includes a number of micromirror elements 308 rangingfrom about 1×10{circumflex over ( )}4 to about 1×10{circumflex over( )}7, such as from about 1×10{circumflex over ( )}5 to about1×10{circumflex over ( )}6, such as from about 1×10{circumflex over( )}6 to about 5×10{circumflex over ( )}6, or such as from about5×10{circumflex over ( )}6 to about 1×10{circumflex over ( )}7.

Referring now to FIGS. 5A-5M, exemplary modulation groups are furtherdescribed. FIGS. 5A-5M schematically depict exemplary modulation groups500 that may be defined for an optical modulator 302. The configurationand arrangement of the micromirror elements 308 included in theexemplary modulation groups 500 shown in FIGS. 5A-5M are provided by wayof example and not to be limiting. Modulation groups with otherconfigurations and arrangements of micromirror elements 308 are alsocontemplated. As shown in FIG. 5A, a modulation group 500 may include arow or column of micromirror elements 308. As shown in FIG. 5B, amodulation group 500 may include a sub-array that includes a pluralityof rows and columns. The number of micromirror elements 308 included ina modulation group 500 may be determined based at least in part on oneor more irradiation parameters associated with the correspondingcombination zone, such as a specified intensity and/or power density ofthe irradiation imparted to the powder bed 138 by the beam segmentscorresponding to the combination zone 334. The intensity and/or powerdensity of the irradiation imparted to the powder bed 138 by arespective combination zone 334 may be proportional to the number ofbeam segments corresponding to the respective combination zone. By wayof example, as shown in FIG. 5A, twelve (12) beam segments are combinedwith one another at a combination zone 334. The twelve (12) beamsegments may at least partially overlap with one another at thecombination zone 334, such that the intensity and/or power density ofthe irradiation imparted to the powder bed 138 with respect to thecombination zone 334 may be increased by a factor of 12×. As anotherexample, as shown in FIG. 5B, sixteen (16) beam segments are combinedwith one another at a combination zone 334. The sixteen (16) beamsegments may at least partially overlap with one another at thecombination zone 334, such that the intensity and/or power density ofthe irradiation imparted to the powder bed 138 with respect to thecombination zone 334 may be increased by a factor of 16×. It will beappreciated that a modulation group 500 may include any number ofmicromirror elements 308 and that the intensity and/or power density ofthe imparted to the powder bed 138 with respect to a combination zone334 may be increased proportionally to the number of beam segmentscorresponding to the specified number of micromirror elements 308included in the modulation group 500.

In some embodiments, a number of micromirror elements 308 included in amodulation group 500 may be adjusted and/or controlled, for example, toprovide a specified intensity and/or power density of the irradiationimparted to the powder bed 138 with respect to the combination zone 334corresponding to the modulation group 500. For example, as shown inFIGS. 5A and 5B, all of the micromirror elements 308 included in amodulation group 500 may exhibit a modulation state that includes therespective beam segment in the combination zone 334. Additionally, or inthe alternative, as shown in FIGS. 5C and 5D, a subset of the totalnumber of micromirror elements 308 in a modulation group 500 may exhibita modulation state that includes the respective beam segment 400 in thecombination zone 334. Remaining micromirror elements 308 in themodulation group 500 may exhibit a modulation state that excludes therespective beam segment 400 to the combination zone 334. For example, afirst subset of micromirror elements 308 in the modulation group 500 mayexhibit a modulation state that directs the respective beam segment 400to the focusing lens assembly 312 and/or to the build plane 130. Themodulation state of the first subset of micromirror elements 308 mayinclude a corresponding plurality of beam segments 400 in thecombination zone 334. The modulation group 500 may include a firstmicromirror element-subset 406, and the first micromirror element-subset406 may provide a first beam segment-subset 408 corresponding to acombination zone 334. Additionally, or in the alternative, a secondsubset of micromirror elements 308 in the modulation group 500 mayexhibit a modulation state that directs the respective beam segment 400to the beam stop 314 (see, e.g., FIG. 4B). The modulation state of thesecond subset of micromirror elements 308 may exclude a correspondingplurality of beam segments 400 from the combination zone 334 (see, e.g.,FIG. 4B). The modulation group 500 may include a second micromirrorelement-subset 410, and the second micromirror element-subset 410 mayprovide a second beam segment-subset 412 correspondingly excluded fromthe combination zone 334.

As shown in FIGS. 5C and 5D, a modulation group 500 may include a firstmicromirror element-subset 406 that provides a first beam segment-subset408 representing beam segments 400 that are combined with one another atleast at a combination zone 334. The beam segments 400 in the first beamsegment-subset 408 may be combined at the combination zone 334 andutilize to irradiate the powder bed 138. A modulation group 500 mayinclude second micromirror element-subset 410 that provides a secondbeam segment-subset 412 representing beam segments 400 that are excludedfrom the combination zone 334. The beam segments 400 included in thesecond beam segment-subset 412 may be directed to the beam stop 314(see, e.g., FIG. 4B). The intensity and/or power density of theirradiation imparted to the powder bed 138 with respect to thecombination zone 334 may be adjusted and/or controlled for a modulationgroup 500 at least in part by changing the number of micromirrorelements 308 that provide a corresponding beam segment 400 to thecombination zone 334. For example, the intensity and/or power density ofthe irradiation imparted to the powder bed 138 with respect to thecombination zone 334 may be adjusted and/or controlled for a modulationgroup 500 at least in part by assigning micromirror elements 308 to thefirst micromirror element-subset 406, such as by allocating micromirrorelements 308 of a modulation group 500 as between the first micromirrorelement-subset 406 and the second micromirror element-subset 410.

By way of illustration, FIG. 5C shows a modulation group 500 thatincludes twelve (12) micromirror elements 308, with eight (8) of themicromirror elements 308 in the modulation group 500 included in thefirst micromirror element-subset 406, providing a combination zone 334that includes eight (8) beam segment-subset 408. The remaining four (4)the micromirror elements 308 in the modulation group 500 may be includedin a second micromirror element-subset 410, with the correspondingsecond beam segment-subset 412 being excluded from the combination zone334, and, for example, being directed to the beam stop 314. For theexample illustrated in FIG. 5C, the power level and/or intensity of theirradiation provided by modulation group 500 may be adjusted by a factorof 0.75 relative to including all twelve (12) of the beam segments 400in the combination zone 334. As another example, FIG. 5D shows amodulation group 500 that includes sixteen (16) micromirror elements308, with eight (8) of the micromirror elements 308 in the modulationgroup 500 included in the first micromirror element-subset 406,providing a combination zone 334 that includes eight (8) beamsegment-subset 408. The remaining eight (8) the micromirror elements 308in the modulation group 500 may be included in a second micromirrorelement-subset 410, with the corresponding second beam segment-subset412 being excluded from the combination zone 334, and, for example,being directed to the beam stop 314. For the example illustrated in FIG.5D, the power level and/or intensity of the irradiation provided bymodulation group 500 may be adjusted by a factor of 0.5 relative toincluding all sixteen (16) of the beam segments 400 in the combinationzone 334. The number of micromirror elements 308 in a modulation group500 that provide a beam segments 400 included in a correspondingcombination zone 334 may be adjusted by a factor of from 0.0 to 1.0,such as from 0.1 to 1.0, or such as from 0.5 to 1.0, for example, toprovide irradiation with a specified power level and/or intensity forthe corresponding combination zone 334.

Referring to FIGS. 5E through 5M, in some embodiments, a plurality ofmodulation groups 500, whether including a row or column of micromirrorelements 308 and/or a sub-array of micromirror elements 308, may providea corresponding plurality of combination zones 334 that extend acrossthe build plane 130 in a row or column. The orientation of the row orcolumn of micromirror elements 308 in a modulation group 500 maycorrespond to an x-axis of an energy beam system 134, such as adirection of movement of an irradiation device 142 relative to a buildplane 130. The orientation of the row or column of micromirror elements308 in a modulation group 500 may be determined in reference to theprojection of the corresponding combination zone upon the build plane130, rather than the physical orientation of the micromirror array 306within an irradiation device 142. For example, it will be appreciatedthat an energy beam path may include a plurality of optical elementssuch as lenses, mirrors, and the like, such that the coordinates of amicromirror array 306 may correspond to the coordinate system of anenergy beam system 134 regardless of the physical orientation of themicromirror array 306 within the irradiation device 142. In someembodiments, the plurality of combination zones 334 may have anorientation corresponding to a y-axis of the energy beam system 134,such as perpendicular to a direction of movement of an irradiationdevice 142 relative to the build plane 130. Alternatively, a row orcolumn of micromirror elements 308 that make up a modulation group 500may have any other specified orientation.

As shown in FIGS. 5E and 5F, a plurality of modulation groups 500 may beconfigured and arranged to provide a plurality of combination zones 334that impart irradiation to the powder bed 138 in sequence and/or in aseries with one another. For example, a first modulation group 500 mayprovide a first plurality of beam segments 400 that at least partiallyoverlap with one another at a first combination zone 334, and a secondmodulation group 500 may provide a second plurality of beam segments 400that at least partially overlap with one another at a second combinationzone 334. The first combination zone 334 and the second combination zone334 may irradiate a portion of the powder bed 138 in sequence with oneanother. Additionally, or in the alternative, a third modulation group500 may provide a third plurality of beam segments 400 that at leastpartially overlap with one another at a third combination zone 334. Thesecond combination zone 334 and the third combination zone 334 mayirradiate a portion of the powder bed 138 in sequence with one another.In some embodiments, the first combination zone 334 may providepreheating and the second combination zone 334 may provide irradiationsufficient to melt and/or fuse the powder material 120. The preheatingprovided by the first combination zone 334 may impart energy to thepowder bed 138 at a level selected to preheat the powder material 120,for example, without melting and/or fusing the powder material 120. Thesecond combination zone 334 may impart energy to the powder bed 138 at alevel selected to melt and/or fuse the powder material 120, for example,in accordance with a conduction irradiation regime. The intensity and/orpower density of the second combination zone 334 may be greater than theintensity and/or power density of the first combination zone 334.Additionally, or in the alternative, the third combination zone 334 mayprovide post-heating. The third combination zone 334 may impart energyto the powder bed 138 at a level selected to post-heat the powdermaterial 120, for example, while allowing the melted and/or fused powdermaterial to cool and/or while allowing a melt pool to solidify, forexample, at a controlled rate. The intensity and/or power density of thethird combination zone 334 may be less than the intensity and/or powerdensity of the second combination zone 334.

By way of further illustration, the first combination zone 334 mayprovide a first beam spot 336 that becomes incident upon the build plane130 at a first location and the second combination zone 334 may providea second beam spot 336 that becomes incident upon the build plane 130 ata second location. Additionally, or in the alternative, the thirdcombination zone 334 may provide a third beam spot 336 that becomesincident upon the build plane 130 at a third location. The firstlocation may have coordinates upon the build plane 130 that precede thecoordinates upon the build plane 130 of the second location. Forexample, as shown, the first location may have coordinates of (1,0) andthe second location may have coordinates of (2,0). Additionally, or inthe alternative, the third location may have coordinates upon the buildplane 130 that follow the coordinates upon the build plane 130 of thesecond location. For example, as shown, the third location may havecoordinates of (3,0). The first beam spot 336 corresponding to the firstmodulation group may become incident upon the powder bed 138 at thefirst location concurrently with the second beam spot 336 correspondingto the second modulation group 500 becoming incident upon the powder bed138 at the second location. Additionally, or in the alternative, thefirst beam spot 336 corresponding to the first modulation group 500 maybecome incident upon the powder bed 138 at the first location prior tothe second beam spot 336 corresponding to the second modulation group500 becoming incident upon the powder bed 138 at the first location. Thethird beam spot 336 corresponding to the third modulation group 500 maybecome incident upon the powder bed 138 at the third locationconcurrently with the first beam spot 336 corresponding to the firstmodulation group 500 becoming incident upon the powder bed 138 at thefirst location and/or concurrently with the second beam spot 336corresponding to the second modulation group 500 becoming incident uponthe powder bed 138 at the second location.

As shown in FIG. 5F, the intensity and/or power density of theirradiation imparted to the powder bed 138 with respect to the firstcombination zone 334, the second combination zone 334, and/or the thirdcombination zone 334 may be adjusted and/or controlled at least in partby changing the number of micromirror elements 308 that provide acorresponding beam segment 400 to the respective combination zone 334.For example, the intensity and/or power density of the irradiationimparted to the powder bed 138 with respect to the first combinationzone 334, the second combination zone 334, and/or the third combinationzone 334 may be adjusted and/or controlled as described with referenceto FIGS. 5C and 5D.

As shown, for example, in FIGS. 5G through 5I, a plurality of modulationgroups 500 may be configured and arranged to provide a plurality ofcombination zones 334 that impart irradiation to the powder bed 138 inparallel with one another. For example, a first modulation group 500 mayprovide a first plurality of beam segments 400 that at least partiallyoverlap with one another at a first combination zone 334, and a secondmodulation group 500 may provide a second plurality of beam segments 400that at least partially overlap with one another at a second combinationzone 334. The first combination zone 334 and the second combination zone334 may irradiate a portion of the powder bed 138 in parallel with oneanother. Additionally, or in the alternative, a third modulation group500 may provide a third plurality of beam segments 400 that at leastpartially overlap with one another at a third combination zone 334. Thesecond combination zone 334 and the third combination zone 334 mayirradiate a portion of the powder bed 138 in parallel with one another.Any number of modulation groups 500 may provide correspondingcombination zones 334 configured and arranged to irradiate respectiveportions of the powder bed 138 in parallel with one another.

For example, as shown in FIG. 5G, twelve (12) modulation groups 500respectively provide twelve (12) combination zones 334 configured andarranged to irradiate the powder bed 138 in parallel with one another.The respective combination zones 334 may provide corresponding beamspots 336 that respectively become incident upon the build plane 130 atlocations that are arranged in parallel with one another. For example,the twelve (12) combination zones 334 shown in FIG. 5G may becomeincident upon the build plane 130 at coordinates from (1,1) to (1,12).The beam spots 336 respectively corresponding to the plurality ofmodulation segments 500 may become incident upon the build plane 130concurrently with one another. The respective beam spots 336 maypropagate across the build plane 130 in coordination with one another,such as in parallel with one another. For example, the twelve (12)combination zones 334 shown in FIG. 5G may advance across the buildplane 130 from coordinates (1,1) through (1,12), to coordinates (2,1)through (2,12), and from coordinates (2,1) through (2,12), tocoordinates (3,1) through (3,12), and so forth.

As shown, for example, in FIG. 5H, micromirror elements 308 that belongto a modulation group 500 coinciding with a location of the build plane130 to be irradiated may exhibit a modulation state that directs therespective beam segment 400 to the build plane 130. Additionally, or inthe alternative, micromirror elements 308 that belong to a modulationgroup 500 coinciding with a location of the build plane 130 that is notto be irradiated may exhibit a modulation state that directs therespective beam segment 400 to the beam stop 314. By way ofillustration, FIG. 5H shows twelve (12) modulation groups 500 arrangedin columns, of which, seven (7) modulation groups 500 are providing afirst beam segment-subset 408 corresponding to a combination zone 334.The combination zones 334 corresponding to the seven (7) modulationgroups 500 are shown as irradiating the build plane 130 at locationshaving coordinates (1,1), (1,2), (1,4), (1,8) through (1,10), and(1,12). The five (5) modulation groups 500 shown in FIG. 5H that are notproviding a first beam segment-subset 408 corresponding to a combinationzone 334 may instead provide a second beam segment-subset 412, which maybe directed to the beam stop 314. For example, as shown in FIG. 5H,locations of the build plane 130 having coordinates (1,3), (1,5) through(1,7), and (1,11) may correspond to modulation groups 500 that are notproviding a first beam segment-subset 408 corresponding to a combinationzone 334 and that may instead provide a second beam segment-subset 412,which may be directed to the beam stop 314.

Referring, for example to FIG. 5I, in addition or in the alternative towhether or not a respective modulation groups 500 directs a first beamsegment-subset to the build plane 130, the respective modulation groups500 may include a first micromirror element-subset 406 that provides afirst beam segment-subset 408 representing beam segments 400 that areutilize to irradiate a respective location on the powder bed 138, and asecond micromirror element-subset 410 that provides a second beamsegment-subset 412 representing beam segments 400 that are not utilizedto irradiate the respective location on the powder bed 138. For example,FIG. 5I shows a plurality of modulation groups 500 that respectivelyinclude twelve (12) micromirror elements 308. A first modulation group500 coinciding with a location of the build plane 130 having coordinates(1,1) has a first micromirror element-subset 406 that includes twelve(12) micromirror elements 308. A second modulation group 500 coincidingwith a location of the build plane 130 having coordinates (1,2) has afirst micromirror element-subset 406 that includes nine (9) micromirrorelements 308. A third modulation group 500 coinciding with a location ofthe build plane 130 having coordinates (1,4) has a first micromirrorelement-subset 406 that includes three (3) micromirror elements 308. Aplurality of modulation groups 500 respectively coinciding with locationof the build plane 130 having coordinates of (1,8) through (1,10)respectively have a first micromirror element-subset 406 that includessix (6) micromirror elements 308. A modulation group coinciding with alocation of the build plane 130 having coordinates (1,12) has a firstmicromirror element-subset 406 that includes one (1) micromirror element308.

Referring now, for example, to FIGS. 5G, and to FIGS. 5J through 5M, insome embodiments, a plurality of modulation groups 500 may respectivelyprovide a plurality of combination zones 334 with corresponding beamspots 336 configured and arranged upon the build plane 130 in the formof a pattern 502, such as a linear or curvilinear arrangement of beamspots 336. As shown in FIGS. 5G and 5J, a plurality of modulation groups500 may provide a plurality of combination zones 334 with correspondingbeam spots 336 arranged in a pattern 502 that includes a lineararrangement of beam spots 336 incident upon the build plane 130. Thelinear arrangement of beam spots 336 may be oriented perpendicular to adirection of motion of the beam spots 336 across the build plane 130.For example, the plurality of combination zones 334 shown in FIG. 5G maycorrespond to a linear arrangement of beam spots 336 orientedperpendicular to a direction of motion of the beam spots 336.Additionally, or in the alternative, the linear arrangement of beamspots 336 may be oriented parallel to a direction of motion of the beamspots 336 across the build plane 130. For example, the plurality ofcombination zones 334 shown in FIG. 5G may correspond to a lineararrangement of beam spots 336 oriented parallel to a direction of motionof the beam spots 336. Additionally, or in the alternative, the lineararrangement of beam spots 336 may be oriented oblique to a direction ofmotion of the beam spots 336 across the build plane 130. For example,the plurality of combination zones 334 shown in FIG. 5J may correspondto a linear arrangement of beam spots 336 oriented oblique to adirection of motion of the beam spots 336 across the build plane 130.

As shown in FIGS. 5K and 5L, a plurality of modulation groups 500 mayprovide a plurality of combination zones 334 with corresponding beamspots 336 arranged in a pattern 502 that includes a curvilineararrangement of beam spots 336 incident upon the build plane 130. Thecurvilinear arrangement of beam spots 336 may be configured and arrangedin any suitable curvilinear manner, including, for example, a parabolicarrangement, a hyperbolic arrangement, a sinusoidal arrangement, apolynomial arrangement, and the like, as well as combinations of these.Additionally, or in the alternative, the curvilinear arrangement of beamspots 336 may have any suitable oriented relative to a direction ofmotion of the beam spots 336 across the build plane 130. For example,the plurality of combination zones 334 shown in FIG. 5K may correspondto a curvilinear arrangement of beam spots 336 that includes a parabolicor hyperbolic arrangement. The parabolic or hyperbolic arrangement mayhave any suitable orientation relative to a direction of motion of thebeam spots 336 across the build plane 130. For example, a parabolicarrangement may have a directrix oriented parallel, perpendicular, oroblique to a direction of motion of the beam spots 336 across the buildplane 130. A hyperbolic arrangement may have an asymptote orientedparallel, perpendicular, or oblique to a direction of motion of the beamspots 336 across the build plane 130. As another example, the pluralityof combination zones 334 shown in FIG. 5L may correspond to acurvilinear arrangement of beam spots 336 that includes a sinusoidalarrangement. The sinusoidal arrangement may have any suitableorientation relative to a direction of motion of the beam spots 336across the build plane 130. For example, a sinusoidal arrangement mayhave a midline oriented parallel, perpendicular, or oblique to adirection of motion of the beam spots 336 across the build plane 130.

As shown in FIG. 5M, a plurality of modulation groups 500 may provide aplurality of combination zones 334 with corresponding beam spots 336arranged in a pattern 502 that includes a pseudorandom arrangement ofbeam spots 336 incident upon the build plane 130. The pseudorandomarrangement of beam spots 336 may be deterministic and repeatable, andyet may appear patternless. For example, the pseudorandom arrangementmay be provided by a pseudorandom number generator.

FIG. 5N schematically depicts a focusing lens assembly 312, including acylindrical lens 600 converging a plurality of beam segments 400 from abeam generation device 308 into a plurality of beam spots 336 a-336 nhaving a linear arrangement 335. It is noted that the beam spots 336 inthe embodiments shown in FIGS. 5A-5M may be converged into a lineararrangement with a focusing lens assembly 312, even though the focusinglens assembly 312 is not shown. For example, the beam segments 400 inthe embodiments of FIGS. 5A and 5C converge to a linear arrangement ofbeam spots 336 a-336 n through a focusing lens assembly 312 (as shown inFIG. 5N).

Referring now to FIGS. 6A-6H, exemplary focusing lens assemblies 312 arefurther described. As shown, a focusing lens assembly 312 may includeone or more lenses 600 supported by a housing 602. The one or morelenses 600 of the focusing lens assembly 312 may be configured to causea plurality of beam segments 400 corresponding to a modulation group 500to be at least partially combined with one another. The one or morelenses 600 of the focusing lens assembly 312 may be configured to causethe plurality of beam segments 400 to be combined with one another so asto at least partially overlap with one another at least at a combinationzone 334. In some embodiments, the one or more lenses 600 may includeone or more cylindrical lenses, such as one or more plano-convexcylindrical lenses. A cylindrical lens, such as a plano-convexcylindrical lens, may focus a plurality of beam segments along a singleaxis. In some embodiments, a focusing lens assembly 312 may include aplurality of cylindrical lenses respectively corresponding to respectiveones of a plurality of modulation groups 500. The plurality ofcylindrical lenses may provide a plurality of combination zones 334 thatexhibit a linear or curvilinear pattern. The plurality of cylindricallenses may be configured as an array of cylindrical lenses, which maysometimes be referred to as a lenticular lens. Additionally, or in thealternative, the one or more lenses 600 may include a microlens arraythat includes a plurality of small lenses formed of a common substrate,such as a homogeneous glass or semiconductor substrate. A microlensarray may include a 1-dimensional array of lens. For example, amicrolens array may include an array of cylindrical microlenses.Additionally, or in the alternative, a microlens array may include a2-dimensional microlens array. For example, a microlens array mayinclude an array of spherical lenses, or an array of polygonal lenses,such as hexagonal lenses or rectangular lenses.

A microlens array may have a pitch of from about 10 micrometers (μm) toabout 500 μm, such as from about 10 μm to about 50 μm, such as fromabout 50 μm to about 100 μm, such as from about 100 μm to about 250 μm,or such as from about 250 μm to about 500 μm. As used with reference toa microlens array, the term “pitch” refers to an average distancebetween center points of adjacent microlenses in the microlens array. Insome embodiments, a microlens array may have a pitch that coincides witha pitch of an optical modulator 302. An exemplary microlens array mayhave a number of microlenses ranging from about 1×10{circumflex over( )}4 to about 1×10{circumflex over ( )}7, such as from about1×10{circumflex over ( )}5 to about 1×10{circumflex over ( )}6, such asfrom about 1×10{circumflex over ( )}6 to about 5×10{circumflex over( )}6, or such as from about 5×10{circumflex over ( )}6 to about1×10{circumflex over ( )}7.

In some embodiments, a microlens array may have a fill factor of fromabout 75% to about 99.9%, such as from about 90% to about 100%, such asfrom about 95% to about 99.9%, or such as from about 99% to about 99.9%.As used with reference to a microlens array, the term “fill factor”refers to the percent of the area of the microlens array that isoccupied by the microlenses of the microlens array. By way ofillustration, a square array of spherical microlenses without any spacebetween the microlenses may have a fill factor of π/4, or about 78.5%.As another example, a hexagonal array of spherical microlenses withoutany space between the microlenses may have a fill factor of about 96.7%.A microlens array with cylindrical microlenses may have a fill factor ofup to about 99.9%. The fill factor of the microlens array may becoordinated with the fill factor of an optical modulator 302.Additionally, or in the alternative, the configuration and arrangementof the lenses of the microlens array may be coordinated with theconfiguration and arrangement of the micromirror elements 308 of amicromirror array 306. For example, a microlens array may include ahexagonal arrangement of lenses, and/or hexagonal lenses, incoordination with a micromirror array 306 that includes hexagonalmicromirror elements. The microlens array may include an anti-reflectivecoating. The areas between the microlenses of the microlens array mayinclude a mask that blocks light from being transmitted through theareas between microlenses. Exemplary microlens arrays may bemanufactured using semiconductor fabrication techniques.

As shown in FIG. 6A, the one or more lenses 600 of the focusing lensassembly 312 may focus a plurality of beam segments 400 with respect toa first axis, such as an x-axis. Thus, the combination zone 334 may be aplurality of beam spots 336 along the y-axis across the build plane 130.The one or more lenses 600 may be configured as cylindrical lenses, suchas cylindrical microlenses. The plurality of beam segments 400 maybelong to a beam segment-subset 408 corresponding to a modulation group500. In some embodiments, one or more lenses 600, such as an array ofcylindrical lenses, may focus a plurality of subsets of beam segments400 respectively corresponding to respective ones of a plurality ofmodulation groups 500 along a first axis. Additionally, or in thealternative, as shown in FIG. 6B, a plurality of cylindrical lenses,such as a plurality of cylindrical microlenses in a microlens array, mayprovide a plurality of beam segment-subsets 408 with correspondingcombination zones 334 that exhibit a linear or curvilinear pattern withrespect to second axis, such as a y-axis. In some embodiments, theplurality of beam segment-subsets 408 may be collimated relative to thesecond axis, such as the y-axis. The linear or curvilinear patternexhibited by the plurality of combination zones 334 may provide acorresponding plurality of beam spots 336 upon the powder bed 138. Theplurality of beam spots 336 may exhibit a linear or curvilinear pattern.When irradiating the powder bed 138, the plurality of beam spots 336 maypropagate across the powder bed 138. For example, as shown in FIG. 6A,the plurality of beam spots 336 may propagate across the powder bed 138in a direction transverse to the direction of focus imparted by acylindrical lens, such as a direction perpendicular to the direction offocus imparted by a cylindrical microlens array.

As shown in FIG. 6C, in some embodiments, a focusing lens assembly 312may include a first lens 604 and a second lens 606. The first lens maybe configured as a cylindrical lens or a cylindrical lens array, such asa microlens array that includes cylindrical microlenses. The first lens604 may focus a plurality of beam segments 400 and/or beamsegment-subsets 408 in with respect to a first axis, such as a y-axis.Additionally, or in the alternative, the second lens 606 may focus theplurality of beam segments 400 and/or beam segment-subsets 408 in asecond direction, such as an x-direction.

As shown in FIG. 6D, in some embodiments, a focusing lens assembly 312may include a multi-focal lens 608, such as a bifocal lens or a trifocallens. As shown, a multi-focal lens 608 may include a first focal region610, and a second focal region 612. Additionally, or in the alternative,a multi-focal lens 608 may include a third focal region 614. The firstfocal region 610 may provide a first combination zone 334. In someembodiments, the first focal region 610 and/or the first combinationzone 334 may provide preheating. The preheating provided by the firstfocal region 610 and/or the first combination zone 334 may impart energyto the powder bed 138 at a level selected to preheat the powder material120, for example, without melting and/or fusing the powder material 120.Additionally, or in the alternative, the second focal region 612 mayprovide a second combination zone 334. The second focal region 612and/or the second combination zone 334 may provide irradiationsufficient to melt and/or fuse the powder material 120. For example, thesecond focal region 612 and/or the second combination zone 334 may meltand/or fuse the powder material 120 in accordance with a conductionirradiation regime. The intensity and/or power density of the secondfocal region 612 and/or the second combination zone 334 may be greaterthan the intensity and/or power density of the first focal region 610and/or the first combination zone 334. Additionally, or in thealternative, the third focal region 614 and/or the third combinationzone 334 may provide post-heating. The third focal region 614 and/or thethird combination zone 334 may impart energy to the powder bed 138 at alevel selected to post-heat the powder material 120, for example, whileallowing the melted and/or fused powder material to cool, such as at aspecified and/or controlled rate, and/or while allowing a melt pool tosolidify, for example, at a specified and/or controlled rate. Theintensity and/or power density of the third focal region 614 and/or thethird combination zone 334 may be less than the intensity and/or powerdensity of the second focal region 612 and/or the second combinationzone 334.

As shown in FIGS. 6E and 6F, in some embodiments, a focusing lensassembly 312 may include a first lens 604 and a second lens 606. Thefirst lens may be configured as a cylindrical lens or a cylindrical lensarray, such as a microlens array that includes cylindrical microlenses.The first lens 604 may focus a plurality of beam segments 400 and/orbeam segment-subsets 408 in a first direction, such as a x-direction.Additionally, or in the alternative, the second lens 606 may collimatethe plurality of beam segments 400 and/or beam segment-subsets 408. Theplurality of beam segments 400 may be combined with one another at acombination zone 334 coinciding with the second lens 606. For example,the combination zone 334 may be at the second lens 606, upstream fromthe second lens 606 and/or downstream from the second lens 606. Thefirst lens 604 may combine the beam segments 400 at a combination zone334, and the second lens 606 may collimate the plurality of beamsegments 400. In some embodiments, the first lens 604 may collimate theplurality of beam segments 400 with respect to a first axis, such as ay-axis, and the second lens 606 may collimate the plurality of beamsegments 400 with respect to a second axis, such as an x-axis. The beamsegment-subset 408 corresponding to the plurality of beam segments 400may propagate from the second lens 606 to the build plane 130, providinga beam spot 336 that includes at least partially overlapping beamsegments 400 having been combined with one another at the combinationzone 334 coinciding with the second lens 606.

As shown in FIGS. 6G and 6H, in some embodiments, an irradiation device142 may include a plurality of optical modulators 302 and acorresponding plurality of focusing lens assemblies 312. An opticalmodulator 302 and a corresponding focusing lens assembly 312 maysometimes be referred to as a beam combination group 616. An irradiationdevice 142 may include a plurality of beam combination groups 616. Theplurality of beam combination groups 616 may be arranged adjacent to oneanother. A plurality of beam combination groups 616 may be arrangedadjacent to one another in one or more directions, such as along anx-axis as shown in FIG. 6G and/or along a y-axis as shown in FIG. 6H. Insome embodiments, the plurality of beam combination groups 616 may bearranged in an array, such as a 1-dimensional array and/or a2-dimensional array. A 2-dimensional array may include a first pluralityof beam combination groups 616 arranged adjacent to one another in afirst direction, such as along an x-axis, and a second plurality of beamcombination groups 616 arranged adjacent to one another in a seconddirection, such as along a y-axis. A plurality of beam combinationgroups 616 may be incorporated into a common irradiation device 142.Additionally, or in the alternative, a plurality of irradiation devices142 may respectively include one or more beam combination groups 616.

The plurality of beam combination groups 616 may respectively provide aplurality of beam segment-subsets 408 with corresponding combinationzones 334 that exhibit a linear or curvilinear pattern. The linear orcurvilinear pattern exhibited by the plurality of combination zones 334may provide a corresponding plurality of beam spots 336 upon the powderbed 138. As shown in FIG. 6G, the plurality of beam combination groups616 may be configured and arranged adjacent to one another such thatwhen the one or more irradiation devices 142 cause the respective beamspots 336 corresponding to the plurality of combination zones 334 topropagate across the powder bed 138, a plurality of combination zones334 corresponding to the first beam combination group 618 may provide afirst plurality of beam spots 336 that precedes a second plurality ofbeam spots 336 corresponding to a second plurality of combination zones334 provided by the second beam combination group 620. Additionally, orin the alternative, the plurality of beam combination groups 616 may beconfigured and arranged adjacent to one another such that when the oneor more irradiation devices 142 cause the respective beam spots 336corresponding to the plurality of combination zones 334 to propagateacross the powder bed 138, a plurality of combination zones 334corresponding to a third beam combination group 622 may provide a thirdplurality of beam spots 336 that follow the second plurality of beamspots 336 corresponding to the second plurality of combination zones 334provided by the second beam combination group 620.

In some embodiments, the first beam combination group 616 and/or thefirst plurality of combination zones 334 may provide preheating. Thepreheating provided by the first beam combination group 618 and/or thefirst plurality of combination zones 334 may impart energy to the powderbed 138 at a level selected to preheat the powder material 120, forexample, without melting and/or fusing the powder material 120.Additionally, or in the alternative, the second beam combination group620 and/or the second plurality of combination zones 334 may provideirradiation sufficient to melt and/or fuse the powder material 120. Forexample, second beam combination group 620 and/or the second pluralityof combination zones 334 may melt and/or fuse the powder material 120 inaccordance with a conduction irradiation regime. The intensity and/orpower density of the second beam combination group 620 and/or the secondplurality of combination zones 334 may be greater than the intensityand/or power density of the first beam combination group 618 and/or thefirst plurality of combination zones 334. In some embodiments, the thirdbeam combination group 622 and/or the third plurality of combinationzones 334 may provide post-heating. The third beam combination group 622and/or the third plurality of combination zones 334 may impart energy tothe powder bed 138 at a level selected to post-heat the powder material120, for example, while allowing the melted and/or fused powder materialto cool and/or while allowing a melt pool to solidify, for example, at acontrolled rate. The intensity and/or power density of the third beamcombination group 622 and/or the third plurality of combination zones334 may be less than the intensity and/or power density of the secondplurality of beam spots 336 corresponding to the second plurality ofcombination zones 334.

As shown in FIG. 6H, the plurality of beam combination groups 616 may beconfigured and arranged adjacent to one another such that a linear orcurvilinear pattern defined by a plurality of combination zones 334 mayinclude combination zones corresponding to a plurality of adjacentlydisposed beam combination groups 616. The plurality of beam combinationgroups 616 may together provide a linear or curvilinear pattern thatincludes a plurality of combination zones 334 from respective ones ofthe plurality of beam combination groups 616. For example, a firstplurality of combination zones 334 corresponding to a first beamcombination group 618 may be adjacently disposed relative to a fourthplurality of combination groups 334 corresponding to a fourth beamcombination group 624. Additionally, or in the alternative, the fourthplurality of combination groups 334 corresponding to the fourth beamcombination group 624 may be adjacently disposed relative to a fifthplurality of combination zones 334 corresponding to a fifth beamcombination group 626. The linear or curvilinear pattern of combinationzones 334 may provide a plurality of beam spots 336 that extend across awidth of a powder bed 138, such as an entire width of the powder bed138. Additionally, or in the alternative, the linear or curvilinearpattern of combination zones 334 may provide a plurality of beam spots336 that extend across about 5% to about 100% of a total width of apowder bed 138, such as from about 10% to about 30%, such as from about30% to about 60%, or such as from about 60% to about 90% of a totalwidth of the powder bed 138.

In some embodiments, a first plurality of beam segments 400, such as afirst beam segment-subset 408, and a second plurality of beam segments400, such as a second beam segment-subset 408, may be caused to at leastpartially overlap with one another at a combination zone 334. Thecombination zone 334 may be located at an interlace region 150 of thebuild plane 130. The first plurality of beam segments 400, such as thefirst beam segment-subset 408, may be provided by a first irradiationdevice 142 a. Additionally, or in the alternative, the second pluralityof beam segments 400, such as the second beam segment-subset 408, may beprovided by a second irradiation device 142 b. Additionally, or in thealternative, the first plurality of beam segments 400 and the secondplurality of beam segments 400 may be provided by the same irradiationdevice 142. For example, the first plurality of beam segments 400 maycorrespond to a first beam combination group 618, and the secondplurality of beam segments 400 may correspond to a second beamcombination group 620. The first plurality of beam segments 400 (e.g.,the first beam segment-subset 408) and the second plurality of beamsegments 400 (e.g., the second beam segment-subset 408) may be caused tooverlap by one or more optical elements of the focusing lens assembly312 and/or by a scanner 332, as shown, for example, in FIGS. 1A and 3B.

FIG. 6I schematically depicts a plurality of beam spots 336 a-336 nhaving a linear arrangement 335 on a build plane 130 formed by thepowder material 120 defined by a plurality of particles 121. The space337 between adjacent beam spots 336 has a space width that is less thanan average particle size P_(w) of the plurality of particles 121. In oneembodiment, the space 337 between adjacent beam spots 336 has an aspectratio of a width of each space 337 to a width P_(w) of the beam spot 336that is less than 0.5. In one embodiment, each space 337 widthcorresponds to the width between adjacent micromirrors from the beamgenerating device. For instance, referring to FIG. 5A, the micromirrorelements of the subset of micromirror elements are spaced apartaccording to an aspect ratio of the space to a width of the micromirrorelements that is less than 0.5.

As shown in FIGS. 7A-7D, a plurality of optical modulators 302 may bealigned with one another, for example, with respect to a reference axis700. The plurality of optical modulators 302 aligned with respect to thereference axis 700 may be integrated into a common irradiation device142. A plurality of optical modulators 302 aligned with respect to thereference axis 700 may correspond to a common beam combination group616. Additionally, or in the alternative, a plurality of opticalmodulators 302 from separate beam combination group 616 and/or separateirradiation devices 142 may be aligned with respect to a reference axis700. In some embodiments, a plurality of optical modulators 302 may bealigned in such a manner that at least some of the micromirror elements308 of the respective optical modulators coincide with one another withrespect to a reference axis 700. For example, as shown in FIGS. 7A-7D, afirst micromirror element 308 of a first optical modulator 302 may bealigned with a second micromirror element 308 of a second opticalmodulator 302. Additionally, or in the alternative, a first plurality ofmicromirror elements 308 of a first optical modulator 302 may be alignedwith a second plurality of micromirror elements 308 of a second opticalmodulator 302. The first micromirror element or plurality of micromirrorelements 308 may be associated with a first modulation group 500, and/orthe second micromirror element or plurality of micromirror elements 308may be associated with a second modulation group 500. The reference axis700 may transect the first micromirror element 308 of the first opticalmodulator 302 and the second micromirror element 308 of the secondoptical modulator 302. In some embodiments, the reference axis 700 maycoincide with a direction of motion of the irradiation device 142 and/ora direction of motion relative to the powder bed 138. For example, thereference axis 700 may be parallel with the direction of motion. Thereference axis 700 may correspond to an x-axis of an energy beam system134. The orientation of the reference axis 700 may be determined inreference to the projection of corresponding combination zones 334 uponthe build plane 130, rather than the physical orientation of themicromirror array 306 within an irradiation device 142. For example, itwill be appreciated that an energy beam path may include a plurality ofoptical elements such as lenses, mirrors, and the like, such that thecoordinates of a micromirror array 306 may correspond to the coordinatesystem of an energy beam system 134 regardless of the physicalorientation of the micromirror array 306 within the irradiation device142.

As shown, for example, in FIG. 7A, a first micromirror element 308 of afirst optical modulator 302 may be aligned with a second micromirrorelement 308 of a second optical modulator 302. Additionally, or in thealternative, a first row or column of micromirror elements 308 of afirst optical modulator 302 may be aligned with a second row or columnof micromirror elements 308 of a second optical modulator 302. As shown,for example, in FIG. 7B, a first micromirror element 308 of a firstoptical modulator 302 may be offset with respect to a second micromirrorelement 308 of a second optical modulator 302. Additionally, or in thealternative, a first row or column of micromirror elements 308 of afirst optical modulator 302 may be offset with respect to a second rowor column of micromirror elements 308 of a second optical modulator 302.In some embodiments, the offset may correspond to a fraction of a pitchof the micromirror array 306. For example, the offset may correspond toone-half of the pitch of the micromirror array 306. The firstmicromirror element 308 and/or the first row of micromirror elements 308may be associated with a first modulation group 500. The secondmicromirror element 308 and/or the second row of micromirror elements308 may be associated with a second modulation group 500. A referenceaxis 700 may transect a first micromirror element 308 from among a firstrow of micromirror elements 308 of a first optical modulator 302. Thereference axis 700 may transect a second micromirror element 308 fromamong a second row micromirror elements 308 of a second opticalmodulator 302. The reference axis 700 may be perpendicular to the firstrow of micromirror elements 308 and/or to the second row of micromirrorelements 308.

As shown, for example, in FIG. 7A, the first micromirror element 308and/or the first row of micromirror elements 308 may be centered on thereference axis 700. As shown, for example, in FIG. 7B, a secondmicromirror element 308 and/or the second row of micromirror elements308 may be offset with respect to the reference axis 700, such as by afraction of the pitch of the micromirror array 306. As shown in FIGS. 7Cand 7D, a first row of micromirror elements 308 of a first opticalmodulator 302 and a second row of micromirror elements 308 of a secondoptical modulator 302 may partially overlap one another with respect toa reference axis 700. For example, as shown in FIG. 7C, a firstmicromirror element 308 from among a first row of micromirror elements308 of a first optical modulator 302 may overlap a second micromirrorelement 308 from among a second row of micromirror elements 308 of asecond optical modulator 302. The first micromirror element 308 mayoverlap the second micromirror element 308 by a distance that is lessthan the pitch of the micromirror array 306, such as one-half of thepitch of the micromirror array 306. Additionally, or in the alternative,as shown in FIG. 7D, a plurality of micromirror elements 308 from amongthe first row of micromirror elements 308 of the first optical modulator302 may overlap a plurality of micromirror elements 308 from among thesecond row of micromirror elements 308.

Referring now to FIGS. 8A-8F, exemplary combination zones 334 arefurther described. As shown in FIGS. 8A-8F, a combination zone 334represents a region along an irradiation beam path 316 at which aplurality of beam segments 400 are combined to at least partiallyoverlap with one another. A combination zone 334 may coincide with abeam spot 336 upon the powder bed 138 that includes a region of thepowder bed where the plurality of beam segments 400 become incident uponthe powder material 120. Additionally, or in the alternative, acombination zone 334 may be located at least partially above and/or atleast partially below the build plane 130 defined by the powder bed 138.In some embodiments, the configuration and arrangement of thecombination zone 334 may be selected at least in part to provide aspecified intensity and/or power density to the powder bed 138.

As shown in FIGS. 8A and 8D, the combination zone 334 may include aplurality of beam segments 400 that overlap with one another at a mutuallocation, such as a mutual location defined by mutual coordinates. Forexample, as shown in FIG. 8A, the combination zone 334 may include aplurality of beam segments 400 that share mutual coordinates in respectof an x-axis and a y-axis. Additionally, or in the alternative, as shownin FIG. 8D, the combination zone 334 may include a plurality of beamsegments 400 that share mutual coordinates in respect of a z-axis, an/oras in respect of a z-axis and an x-axis. In some embodiments, FIGS. 8Aand 8D may represent a combination zone 334 that includes a plurality ofbeam segments 400 that share mutual coordinates in respect of an x-axis,a y-axis, and a z-axis. A beam spot 336 corresponding to a combinationzone 334 may have a cross-sectional area that coincided with across-sectional area of a respective beam segment 400, such as when theplurality of beam segments 400 corresponding to the combination zone 334share mutual coordinates in respect of x-axis and a y-axis.

Additionally, or in the alternative, as shown in FIGS. 8B, 8C, 8E, and8F, and a combination zone 334 may include a plurality of beam segments400 that partially overlap with one another. In some embodiments, asshown, for example, in FIGS. 8C, 8D, and 8F, the beam spot 336corresponding to the combination zone 334 may have a cross-sectionalarea that is larger than a cross-sectional area of a respective beamsegment 400. For example, the combination zone 334 may include aplurality of beam segments 400 that have different coordinates from oneanother at least in respect of the x-axis and/or the y-axis. Therespective beam segments may at least partially overlap with one anotherin respect of the x-axis and/or the y-axis, for example, such that thecross-sectional area of the beam spot 336 is larger than thecross-sectional area of a respective beam segment 400. Additionally, orin the alternative, as shown in FIGS. 8E and 8F, the combination zone334 may include a plurality of beam segments 400 that have differentcoordinates from one another at least in respect of the z-axis. Theplurality of beam segments 400 may at least partially overlap with oneanother at least in respect of the z-axis. Additionally, or in thealternative, as shown, for example, in FIG. 8E, the plurality of beamsegments 400 may at least partially overlap with one another in respectof the z-axis, while having mutual coordinates in respect of the x-axisand/or the y-axis. As shown in FIG. 8F, the plurality of beam segments400 may at least partially overlap with one another, while havingdiffering coordinates in respect of the x-axis, the y-axis, and/or thez-axis.

Referring now to FIG. 9 , in some embodiments, an energy beam system 134may include one or more housing assemblies 160 that respectively includea plurality of irradiation devices 142. A plurality of housingassemblies 160 may be coupled to one another. Additionally, or in thealternative, a plurality separate housing assemblies 160 may beprovided. The plurality of housing assemblies 160 may be movablerelative to the build plane 130, separately and/or as a group. Forexample, a plurality of housing assemblies 160 may be movable relativeto the build plane 130 by way of a positioning system 156 coupled to therespective housing assemblies 160. Additionally, or in the alternative,the plurality of housing assemblies 160 may be movable relative to thebuild plane 130 by way of a build unit-positioning system 208 as shown,for example, in FIG. 2A, and/or by way of a build vessel-positioningsystem 212, as shown, for example, in FIG. 2B.

A housing assembly 160 may include a plurality of irradiation devicescoupled to the housing assembly and/or disposed within the housingassembly 160. For example, a plurality of irradiation devices 142 may becoupled to a pylon 900. The pylon 900 may be disposed within the housingassembly 160 and/or the pylon 900 may define at least a portion of thehousing assembly 160. A plurality of pylons 900 may be couple to oneanother by one or more joists 902. The one or more joists 902 may bedisposed within the housing assembly 160 and/or the one or more joists902 may define at least a portion of the housing assembly 160.Additionally, or in the alternative, one or more joists 902 may becoupled to an exterior portion of a respective housing assembly 160.

As shown in FIG. 9 , respective ones of the plurality of irradiationdevices 142 may include one or more beam combination groups 616. The oneor more beam combination groups 616 may respectively include one or moreoptical modulators 302 and a corresponding one or more focusing lensassemblies 312. The one or more beam combination groups 616 mayrespectively provide a plurality of beam segment-subsets 408 thatrespectively include a plurality of beam segments 400 that combine withone another at a combination zone 334. A plurality of combination zones334 corresponding to the one or more beam combination groups 616 of arespective irradiation device 142 may exhibit a linear or curvilinearpattern. Additionally, or in the alternative, a plurality of beam spots336 upon the powder bed 138 corresponding to the plurality ofcombination zones 334 may exhibit a linear or curvilinear pattern. Asshown in FIG. 9 , the linear or curvilinear pattern of combination zones334 and/or beam spots 336 corresponding to respective irradiationdevices 142 and/or the respective beam combination groups 616 may becoordinated with one another, for example, to extend across a region ofthe powder bed 138. A first linear or curvilinear pattern of combinationzones 334 and/or beam spots 336 corresponding to a first irradiationdevice 142 and/or a first one or more beam combination groups 616 may beat least partially aligned with a second linear or curvilinear patternof combination zones 334 and/or beam spots 336 corresponding to a secondirradiation device 142 and/or a second one or more beam combinationgroups 616. In some embodiments, the first linear or curvilinear patternof combination zones 334 and/or beam spots 336 may overlap with thesecond linear or curvilinear pattern of combination zones 334 and/orbeam spots 336 in respect of one or more axis of the build plane 130,such as in respect of the y-axis of the build plane 130.

A first housing assembly 160 and/or a first pylon 900 may be disposed infront of a second housing assembly 160 and/or a second pylon 900. Whenthe respective beam spots 336 propagate across the build plane 130, thebeam spots 336 corresponding to the first housing assembly 160 and/orthe first pylon 900 may become incident upon a region of the powder bed138 prior to the beam spots 336 corresponding to the second housingassembly 160 and/or the second pylon 900. In some embodiments, a firstone or more irradiation devices 142 and/or a first one or more beamcombination groups 616 associated with a first housing assembly 160and/or a first pylon 900 may be utilized for preheating. For example,the first one or more irradiation devices 142 and/or the first one ormore beam combination groups 616 may provide a plurality of beam spots336 that impart energy to the powder bed 138 at a level selected topreheat the powder material 120, for example, without melting and/orfusing the powder material 120. Additionally, or in the alternative, asecond one or more irradiation devices 142 and/or a second one or morebeam combination groups 616 associated with a second housing assembly160 and/or a second pylon 900 may provide irradiation sufficient to meltand/or fuse the powder material 120. For example, the second one or moreirradiation devices 142 and/or the second one or more beam combinationgroups 616 may provide a plurality of beam spots 336 that melt and/orfuse the powder material 120 in accordance with a conduction irradiationregime. The intensity and/or power density of the plurality of beamspots 336 from the second one or more irradiation devices 142 and/or thesecond one or more beam combination groups 616 may be greater than theintensity and/or power density of the plurality of beam spots 336 fromthe first one or more irradiation devices 142 and/or the first one ormore beam combination groups 616.

In some embodiments, a third one or more irradiation devices 142 and/ora third one or more beam combination groups 616 associated with a thirdhousing assembly 160 and/or a third pylon 900 may provide post-heating.For example, the third one or more irradiation devices 142 and/or thethird one or more beam combination groups 616 may provide a plurality ofbeam spots 336 that impart energy to the powder bed 138 at a levelselected to post-heat the powder material 120, for example, whileallowing the melted and/or fused powder material to cool and/or whileallowing a melt pool to solidify, for example, at a controlled rate. Theintensity and/or power density of the plurality of beam spots 336 fromthe third one or more irradiation devices 142 and/or the third one ormore beam combination groups 616 may be less than the intensity and/orpower density of the plurality of beam spots 336 from the second one ormore irradiation devices 142 and/or the second one or more beamcombination groups 616.

It will be appreciated that, while two rows of irradiation devices 142and/or beam combination groups 616 are shown in FIG. 9 , any number ofrows of irradiation devices 142 and/or beam combination groups 616 maybe provided. For example, a first row of irradiation devices 142 and/orbeam combination groups 616 may provide preheating. A second row ofirradiation devices 142 and/or beam combination groups 616 may meltand/or fuse the powder material 120, for example, in accordance with aconduction irradiation regime. A third row of irradiation devices 142and/or beam combination groups 616 may provide preheating. Additionally,or in the alternative, a first row of irradiation devices 142 and/orbeam combination groups 616 may melt and/or fuse the powder material120, for example, in accordance with a conduction irradiation regime,and a second row of irradiation devices 142 and/or beam combinationgroups 616 may provide preheating.

Referring now to FIGS. 10A-10F, exemplary irradiation sequences arefurther described. As shown in FIGS. 10A-10F, a build plane 130 thatincludes a powder bed 138 may be described with reference to a buildarray 1000 that includes a plurality of build points 1002. As shown,respective build points 1002 in the build array 1000 may be identifiedwith reference to a coordinate system, such as an (X,Y,Z) cartesiancoordinate system. FIGS. 10A-10C schematically depict a perspective viewof a build plane 130, with a build array 1000 being irradiated by anirradiation device 142 according to an exemplary irradiation sequence.By way of example, the build array 1000 includes build points 1002located from (X1,Y1) to (X5,Y5). FIGS. 10D-10F schematically depict aside view of the irradiation sequence depicted in FIGS. 10A-10C,respectively, with respect to column Y2 of the build array 1000. Asshown in FIGS. 10D-10F, relative movement between the irradiation device142 and the build plane 130 and/or build array 1000 may include theirradiation device moving from right to left and/or the build plane 130moving from left to right. As shown, an exemplary irradiation sequencemay include a plurality of beam spots 336 propagating across the buildplane and/or the build array 1000 with relative movement between theirradiation device 142 and the build plane 130 and/or build array 1000.Additionally, or in the alternative, an exemplary irradiation sequencemay include a plurality of beam spots 336 propagating across the buildplane and/or the build array 1000 with movement of the plurality of beamsegment-subsets 408 corresponding to the plurality of beam spots 336relative to the build plane and/or the build array 1000.

As shown in FIG. 10A, an irradiation device 142 may reflect a pluralityof beam spots 336 onto the build plane 130. The plurality of beam spots336 may respectively correspond to a plurality of combination zones 334.Respective ones of the plurality of beam spots 336 and/or the pluralityof combination zones 334 may correspond to a beam combination group 616of the irradiation device and/or a modulation group 500 of the opticalmodulator 302. The respective beam spots 336 may become incident upon acorresponding build point 1002 of the build array 1000. For example, aplurality of adjacent beam spots 336 may become incident upon acorresponding plurality of adjacent build points 1002. The plurality ofadjacent beams pots 336 and/or the corresponding plurality of adjacentbuild points 1002 may define a pattern, such as a linear or curvilinearpattern. Irradiation from the plurality of beam spots 336 may provide aplurality of irradiated beam spots 1004. The irradiated beam spots 1004may be preheated, melted or sintered, and/or post-heated by theplurality of beam spots. The irradiation provided by the plurality ofbeam spots 336 may respectively include a plurality of beam segments 400defining beam segment-subset 408 corresponding to a respectivemodulation group 500 and/or a respective beam combination group 616.Respective modulation groups 500 and/or corresponding micromirrorelements 308 may be modulated according to modulation instructions froma control system 104. The modulation instructions may cause the opticalmodulator 302 to modulate respective modulation groups 500 and/orcorresponding micromirror elements 308 based at least in part on a buildfile that defines build points 1002 of a build array 1000 to beirradiated in order to additively manufacture a three-dimensional object114.

As shown in FIGS. 10A and 10D, a plurality of beam spots 336 may becomeincident upon a first plurality of build points 1002 of the build array1000. The first plurality of build points 1002 may have coordinateslocated at (X1, Y1) through (X1, Y5). As shown in FIGS. 10A and 10D, theplurality of beam spots 336 may irradiate the first plurality of buildpoints 1002. As shown in FIGS. 10B and 10E, the irradiation from theplurality of beam spots 336 may provide a first plurality of irradiatedbuild points 1006, while relative movement between the irradiationdevice 142 and the build plane 130 may advance the plurality of beamspots 336 to a second plurality of build points 1008. The secondplurality of build points 1008 may be adjacent to the first plurality ofbuild points 1002 and/or to the first plurality of irradiated buildpoints 1006.

As shown in FIG. 10B, the second plurality of build points 1008 may havecoordinates located at (X2,Y1), (X2,Y2), (X2,Y4), and (X2,Y5). Themodulation instructions may be configured to cause the build point 1002located at (X2,Y2) not to receive a beam spot 336. The build point 1002located at (X2,Y2) may receive no irradiation, for example, whenmodulation instructions do not include instructions to irradiate thebuild point 1002. For example, the build point 1002 may not define partof an object 114 being additively manufactured, and/or additionalirradiation may be unnecessary at the build point 1002. The modulationgroup 500 and/or corresponding micromirror elements 308 corresponding tothe build point 1002 located at (X2, Y2) may be modulated so as todirect the respective plurality of beam segments 400 along an extractionbeam path 318, for example, leading to a beam stop 314 (see, e.g., FIGS.3A and 3B, FIG. 4B). Thus, the beam segment-subset 408 corresponding tothe build point 1002 located at (X2, Y2) may be directed along theextraction beam path 318 rather than directing the plurality of beamsegments 400 along an irradiation beam path 316 through the focusinglens assembly 312 and leading to the build point located at (X2, Y2).

As shown in FIGS. 10B and 10E, the plurality of beam spots 336 mayirradiate the second plurality of build points 1008. As shown in FIGS.10C and 10F, the irradiation from the plurality of beam spots 336 mayprovide a second plurality of irradiated build points 1010, whilerelative movement between the irradiation device 142 and the build plane130 may advance the plurality of beam spots 336 to a third plurality ofbuild points 1012. The third plurality of build points 1012 may beadjacent to the second plurality of build points 1008 and/or to thesecond plurality of irradiated build points 1010.

As shown in FIG. 10C, the third plurality of build points 1012 may havecoordinates located at (X3,Y2), (X3,Y3), and (X3,Y5). The modulationinstructions may be configured to cause the build point 1002 located at(X3,Y1) and (X3, Y4) not to receive a beam spot 336. The modulationgroups 500 and/or corresponding micromirror elements 308 correspondingto the build points 1002 located at (X3,Y1) and (X3, Y4) may bemodulated so as to direct the respective plurality of beam segments 400along an extraction beam path 318, for example, leading to a beam stop314 (see, e.g., FIGS. 3A and 3B, FIG. 4B). Thus, the respective beamsegment-subsets 408 corresponding to the build points 1002 located at(X3,Y1) and (X3, Y4) may be directed along the extraction beam path 318rather than directing the plurality of beam segments 400 along anirradiation beam path 316 through the focusing lens assembly 312 andleading to the build points respectively located at (X3,Y1) and (X3,Y4). The plurality of beam spots 336 may irradiate the third pluralityof build points 1008, and so-on, as relative movement between theirradiation device 142 and the build plane 130 advances the plurality ofbeam spots 336 to successive regions of the build array 1000.

The irradiation sequence described with reference to FIGS. 10A-10F mayrepresent preheating, melting or sintering, and/or post-heating. In someembodiments, one or more preheating treatments may be performed usingthe irradiation sequence described with reference to FIGS. 10A-10F,followed by one or more melting or sintering treatment performed usingthe irradiation sequence described with reference to FIGS. 10A-10F.Additionally, or in the alternative, one or more melting or sinteringtreatments may be performed using the irradiation sequence describedwith reference to FIGS. 10A-10F, followed by one or more post-heatingtreatment performed using the irradiation sequence described withreference to FIGS. 10A-10F. The preheating treatment may precede themelting or sintering by any suitable interval, and/or the melting orsintering treatment may precede the post-heating treatment by anysuitable interval. Additionally, or in the alternative, a plurality ofpreheating treatments may be separated by any suitable interval, aplurality of melting or sintering treatments may be separated by anysuitable interval, and/or a plurality of post-heating treatments may beseparated by any suitable interval. The respective interval or intervalsmay be described with reference to a number of build points 1002 and/orwith reference to time.

In some embodiments, a first plurality of built points 1002 undergoing afirst treatment may be adjacent to a second plurality of build points1002 undergoing a second treatment. Additionally, or in the alternative,a first plurality of build points 1002 undergoing a first treatment anda second plurality of build points 1002 undergoing a second treatmentmay be separated from one another by an interval defined by a pluralityof build points 1002. The number of build points 1002 separating thefirst plurality of build points 1002 undergoing the first treatment andthe second plurality of build points 1002 undergoing the secondtreatment may be determined based at least in part on a thermalconductivity of the powder material 120. Additionally, or in thealternative, the number of build points 1002 of separation may bedetermined based at least in part on a rate of relative movement betweenthe irradiation device 142 and the build plane 130. The first treatmentmay be a preheating treatment and the second treatment may be a meltingor sintering treatment. Additionally, or in the alternative, the firsttreatment may be a melting or sintering treatment and the secondtreatment may be a post-heating treatment. Additionally, or in thealternative, the first treatment may be a first preheating treatment andthe second treatment may be a second preheating treatment. Additionally,or in the alternative, the first treatment may be a first melting orsintering treatment and the second treatment may be a second melting orsintering treatment. Additionally, or in the alternative, the firsttreatment may be a first post-heating treatment and the second treatmentmay be a second post-heating treatment.

In some embodiments, the number of build points 1002 of separation mayallow for a rate of heating imparted by the first treatment at arespective build point 1002 to cause the temperature of the respectivebuild point 1002 to change at a specified rate that depends at least inpart on the thermal conductivity of the powder material 120. Forexample, the rate of heating imparted by the first treatment may causethe temperature of the respective build point 1002 to change at a ratelimited by the thermal conductivity of the powder material 120.Additionally, or in the alternative, the number of build points 1002 ofseparation may allow for a rate of heating imparted by the secondtreatment at a respective build point 1002 to cause the temperature ofthe respective build point 1002 to change at a specified rate thatdepends at least in part on the thermal conductivity of the powdermaterial 120. For example, the rate of heating imparted by the secondtreatment may cause the temperature of the respective build point 1002to change at a rate limited by the thermal conductivity of the powdermaterial 120. The thermal conductivity of the powder material 120 may bedetermined based at least in part on the composition of the powdermaterial 120 and/or based at least in part on the extent to which thepowder material has been consolidated, for example, melted or sintered,by the respective treatments.

Referring now to FIGS. 11A-11G, another exemplary irradiation sequenceis described. FIGS. 11A-11G show a build plane 130 that includes apowder bed 138 that may be described with reference to a build array1000 that includes a plurality of build points 1002. The respectivebuild points 1002 in the build array 1000 may be identified withreference to a coordinate system, such as an (X,Y,Z) cartesiancoordinate system. FIG. 11A schematically depicts a perspective view ofthe build plane 130, with the build array 1000 being irradiated by anirradiation device 142 according to an exemplary irradiation sequence.By way of example, the build array 1000 includes build points 1002located from (X1,Y1) to (X10,Y5). FIGS. 11B-11G schematically depict aside view of the irradiation sequence depicted in FIG. 11A, with respectto column Y2 of the build array 1000.

As shown in FIG. 11A, an irradiation device 142 may include an opticalmodulator 302 configured to reflect a plurality of beam segments 400onto the build plane 130. The plurality of beam spots 336 mayrespectively correspond to one or more beam segments 400 reflected by arespective micromirror element 308 of a micromirror array 306. In someembodiments, a micromirror array 306 may include a plurality ofmicromirror elements 308 that are respectively configured to reflect abeam segment 400 along an irradiation beam path 316 to respective onesof a corresponding plurality of build points 1002 of a build array 1000.The micromirror array 306 and the build array 1000 may be related to oneanother by a mapping relationship. The mapping relationship may includerespective micromirror elements 308 of the micromirror array 306associated with or coordinated to respective build points 1002 in thebuild array 1000. As shown, the optical modulator 302 may include amicromirror array 306 that includes micromirror elements 308 withcoordinates (X1_(M),Y1_(M)) through (X5_(M),Y5_(M)). Additionally, or inthe alternative, the build plane 130 may include a build array 1000 thatincludes build points 1002 with coordinates (X1_(B),Y1_(B)) through(X10_(B),Y5_(B)).

As shown in FIG. 11A, the micromirror elements 308 with coordinates(X1_(M),Y1_(M)) through (X5_(M),Y5_(M)) may be mapped or coordinated tothe build points 1002 with coordinates (X1_(B),Y1_(B)) through(X5_(B),Y5_(B)). For example, a micromirror element 308 located at(X1_(M),Y1_(M)) may provide a beam segment 400 that becomes incidentupon a build point located at (X5_(B),Y1_(B)). Additionally, or in thealternative, a micromirror element 308 located at (X5_(M),Y5_(M)) mayprovide a beam segment 400 that becomes incident upon a build pointlocated at (X1_(B),Y5_(B)). As the beam segments 400 propagate acrossthe build plane 130 and/or the build array 1000, for example, withrelative motion between the build plane 130 and the plurality of beamsegments 400, and/or with relative motion between the irradiation device142 and the build plane 130, the mapping relationship between themicromirror array 306 and the build array 1000 may increment. Themapping relationship may increment such that at a first increment, afirst micromirror element 308 located at a first position in themicromirror array 306 may provide a first beam segment 400 that becomesincident upon a first build point 1002 in the build array 1000, and at asecond increment, the first micromirror element 308 located at the firstposition in the micromirror array 306 may provide a second beam segment400 that becomes incident upon a second build point 1002 in the buildarray 1000. For example, at a first increment, a micromirror element 308located at (X1_(M),Y1_(M)) may provide a beam segment 400 that becomesincident upon a build point located at (X5_(B),Y1_(B)), and/or at asecond increment the micromirror element 308 located at (X1_(M),Y1_(M))may provide a beam segment 400 that becomes incident upon a build pointlocated at (X6_(B),Y1_(B)). Additionally, or in the alternative, at afirst increment, a micromirror element 308 located at (X5_(M),Y5_(M))may provide a beam segment 400 that becomes incident upon a build pointlocated at (X1_(B),Y5_(B)), and/or at a second increment, a micromirrorelement 308 located at (X5_(M),Y5_(M)) may provide a beam segment 400that becomes incident upon a build point located at (X2_(B),Y5_(B)).

Respective build points 1002 may receive irradiation from a plurality ofbeam segments 400 respectively corresponding to a plurality ofmicromirror elements 308. The plurality of micromirror elements 308 maydefine a modulation group 500 and/or may be part of a modulation group500. The plurality of beam segments 400 may propagate incrementallyacross the build array such that the plurality of build points receiveirradiation from at least some of the plurality of beam segments withrelative motion between the plurality of beam segments 400 and the buildplane 130, and/or with relative motion between the irradiation device142 and the build plane 130. Additionally, or in the alternative, themapping of the micromirror elements 308 to the build points 1002 mayincrement with relative motion between the plurality of beam segments400 and the build plane 130, and/or with relative motion between theirradiation device 142 and the build plane 130. The plurality of buildpoints may receive irradiation from at least some of the plurality ofbeam segments 400. The irradiation imparted to a respective build pointmay be imparted sequentially by a plurality of beam segments 400. Forexample, respective ones of a plurality of beam segments 400 may becomeincident upon the build plane 130 without overlapping with one another,and the respective beam segments 400 may become incident upon arespective build point sequentially with such relative motion.Additionally, or in the alternative, respective ones of the plurality ofmicromirror elements 308 in the modulation group 500 may respectivelyprovide a fraction of the total energy imparted to a respective buildpoint 1002. For example, respective ones of the plurality of micromirrorelements 308 in a modulation group 500 may respectively provide apro-rata portion of the total energy imparted to a respective buildpoint 1002. Additionally, or in the alternative, respective ones of theplurality of micromirror elements 308 in a modulation group 500 mayrespectively provide a weighted portion of the total energy imparted toa respective build point 1002. The weighted portion may differ asbetween respective ones of the plurality of micromirror elements 308 inthe modulation group 500.

As depicted in FIG. 11A, the beam spots 336 on the respective buildpoints 1002 are shown with increasing size to illustrate an increasingproportion of energy imparted to the respective build points 1002 as theplurality of beam segments propagate across the build array 1000, forexample, with relative motion between the irradiation device 142 and thebuild plane 130. The total number of micromirror elements 308 thatprovide a corresponding beam segment 400 to a respective build point1002 may be selected based at least in part on the total quantity ofenergy to be imparted to the respective build point 1002. By way ofexample, five micromirror elements 308 may sequentially provide about acorresponding beam segment 400 that imparts about twenty percent (20%)of the total energy imparted to the respective build point 1002. Asshown in FIG. 11A, the build points 1002 located at (X5_(B),Y1_(B))through (X5_(B),Y5_(B)) of the build array 1000 may receive irradiationfrom a beam segment 400 corresponding to the micromirror element 308respectively located at (X1_(M),Y1_(M)) through (X1_(M),Y5_(M)) of themicromirror array 306. In some embodiments, the irradiation imparted tothe respective build points 1002 located at (X5_(B),Y1_(B)) through(X5_(B),Y5_(B)) of the build array 1000 at the point of the irradiationsequence depicted in FIG. 11A may represent about twenty percent (20%)of the total energy to be imparted to the respective build points 1002located at (X5_(B),Y1_(B)) through (X5_(B),Y5_(B)). Additionally, or inthe alternative, the build points 1002 located at (X1_(B),Y1_(B))through (X1_(B),Y5_(B)) of the build array 1000 may receive irradiationsequentially from a plurality of beam segments 400 respectivelycorresponding to the micromirror element 308 located at (X1_(M),Y1_(M))through (X5_(M),Y5_(M)) of the micromirror array 306. For example, thebuild point 1002 located at (X1_(B),Y1_(B)) may receive irradiationsequentially from a plurality of beam segments 400 respectivelycorresponding to the micromirror element 308 located at (X1_(M),Y1_(M))through (X5_(M),Y1_(M)) of the micromirror array 306. Likewise, thebuild point 1002 located at (X1_(B),Y5_(B)) may receive irradiationsequentially from a plurality of beam segments 400 respectivelycorresponding to the micromirror element 308 sequentially located at(X1_(M),Y5_(M)) through (X5_(M),Y5_(M)) of the micromirror array 306. Insome embodiments, the irradiation imparted to the respective buildpoints 1002 located at (X1_(B),Y1_(B)) through (X1_(B),Y5_(B)) of thebuild array 1000 at the point of the irradiation sequence depicted inFIG. 11A may represent about one-hundred percent (100%) of the totalenergy to be imparted to the respective build points 1002 located at(X5_(B),Y1_(B)) through (X5_(B),Y5_(B)). For example, as shown,respective micromirror elements 308 may provide a beam segment 400 thatimparts a respective twenty percent (20%) of the total energy impartedto the respective build point 1002. In some embodiments, the proportionof energy imparted to a build point 1002 by a respective micromirrorelement 308 may be from about 0.01% to about 50%, such as from about0.01% to about 20%, such as from about 0.1% to about 20%, such as fromabout 1% to about 10%, such as from about 1% to about 5%, such as fromabout 10% to about 20%, or such as from about 20% to about 50%.

FIGS. 11B-11G depict a further exemplary irradiation sequence. Theirradiation sequence depicted in FIGS. 11B-11G may represent asubsequent portions of the exemplary irradiation sequence depicted inFIG. 11A. For example, FIG. 11B may depict a side view of a portion ofthe irradiation sequence depicted in FIG. 11A corresponding to column(Y2_(M)) of the micromirror array 306 and column (Y2_(B)) of the buildarray 1000. As shown in FIGS. 11B-11G, relative movement between theirradiation device 142 and the build plane 130 and/or build array 1000may include the irradiation device moving from right to left and/or thebuild plane 130 moving from left to right. The build points 1002 mayreceive a sequential dose of irradiation from a plurality of beamsegments 400 respectively corresponding to a plurality of micromirrorelements 308 in a modulation group 500. The plurality of micromirrorelements 308 that provide the corresponding plurality of beam segments400 may be adjacent to one another and/or spaced apart from one another.The plurality of beam segments 400 corresponding to the respectivemicromirror elements 308 in the modulation group 500 may become incidentupon respective ones of a plurality of build points 1002 in sequence,for example, with relative movement between the irradiation device 142and the build plane 130 and/or build array 1000. The build points 1002shown in FIGS. 11B-11G are shaded to represent a proportion ofirradiation relieved by the sequence of beam segments 400 becomingincident upon the respective build point 1002.

At a point in the irradiation sequence depicted in FIG. 11B, themicromirror array 306 and the build array 1000 may be mapped orcoordinated to one another, for example, such that the micromirrorelements 308 located at (X1_(M),Y2_(M)) through (X5_(M),Y2_(M)) may bemapped or coordinated with the build points 1002 respectively located at(X5_(B),Y2_(B)) through (X1_(B),Y2_(B)). The build point 1002 located at(X5_(B),Y2_(B)) of the build array 1000 may receive irradiation from abeam segment 400 corresponding to the micromirror element 308 located at(X1_(M),Y2_(M)) of the micromirror array 306. The build point 1002located at (X4_(B),Y2_(B)) of the build array 1000 may receiveirradiation from a beam segment 400 corresponding to the micromirrorelement 308 located at (X2_(M),Y2_(M)) of the micromirror array 306 andmay have previously received irradiation from a beam segment 400corresponding to the micromirror element 308 located at (X1_(M),Y2_(M))of the micromirror array 306. The build point 1002 located at(X3_(B),Y2_(B)) of the build array 1000 may receive irradiation from abeam segment 400 corresponding to the micromirror element 308 located at(X3_(M),Y2_(M)) of the micromirror array 306, and may have previouslyreceived irradiation from a beam segment 400 corresponding to themicromirror element 308 located at (X2_(M),Y2_(M)) of the micromirrorarray 306 and from a beam segment 400 corresponding to the micromirrorelement 308 located at (X1_(M),Y2_(M)) of the micromirror array 306. Thebuild point 1002 located at (X2_(B),Y2_(B)) of the build array 1000 mayreceive irradiation from a beam segment 400 corresponding to themicromirror element 308 located at (X4_(M),Y2_(M)) of the micromirrorarray 306, and may have previously received irradiation from a beamsegment 400 corresponding to the micromirror element 308 located at(X3_(M),Y2_(M)) of the micromirror array 306, from a beam segment 400corresponding to the micromirror element 308 located at (X2_(M),Y2_(M))of the micromirror array 306, and from a beam segment 400 correspondingto the micromirror element 308 located at (X1_(M),Y2_(M)) of themicromirror array 306. The build point 1002 located at (X1_(B),Y2_(B))of the build array 1000 may receive irradiation from a beam segment 400corresponding to the micromirror element 308 located at (X5_(M),Y2_(M))of the micromirror array 306, and may have previously receivedirradiation from a beam segment 400 corresponding to the micromirrorelement 308 located at (X4_(M),Y2_(M)) of the micromirror array 306,from a beam segment 400 corresponding to the micromirror element 308located at (X3_(M),Y2_(M)) of the micromirror array 306, from a beamsegment 400 corresponding to the micromirror element 308 located at(X2_(M),Y2_(M)) of the micromirror array 306, and from a beam segment400 corresponding to the micromirror element 308 located at(X1_(M),Y2_(M)) of the micromirror array 306.

As shown in FIG. 11C, with relative movement between the irradiationdevice 142 and the build plane 130 and/or build array 1000, mappingbetween the micromirror elements 308 of the micromirror array 306 andthe build points 1002 of the build array may increment from the point inthe irradiation sequence depicted in FIG. 11B, for example, such thatthe micromirror elements 308 located at (X1_(M),Y2_(M)) through(X5_(M),Y2_(M)) may be mapped or coordinated with the build points 1002respectively located at (X6_(B),Y2_(B)) through (X2_(B),Y2_(B)). At thepoint in the irradiation sequence depicted in FIG. 11C, the build point1002 located at (X6_(B),Y2_(B)) may receive irradiation from a firstbeam segment 400 corresponding to the micromirror element 308 located at(X1_(M),Y2_(M)) of the micromirror array 306. The irradiation from thefirst beam segment 400 corresponding to the micromirror element 308located at (X1_(M),Y2_(M)) of the micromirror array 306 may be the firstor initial dose of irradiation received by the build point 1002 locatedat (X6_(B),Y2_(B)) for the irradiation sequence depicted in FIGS.11B-11G. Additionally, or in the alternative, the build point 1002located at (X2_(B),Y2_(B)) may receive irradiation from a fifth beamsegment 400 corresponding to the micromirror element 308 located at(X5_(M),Y2_(M)) of the micromirror array 306. The irradiation from thefifth beam segment 400 corresponding to the micromirror element 308located at (X5_(M),Y2_(M)) of the micromirror array 306 may be the fifthor concluding dose of irradiation received by the build point 1002located at (X2_(B),Y2_(B)) for the irradiation sequence depicted inFIGS. 11B-11G. The build points 1002 located at (X5_(B),Y2_(B)) through(X3_(B),Y2_(B)) of the build array 1000 may respectively receiveirradiation from beam segments corresponding to the micromirror elements308 respectively located at (X2_(M),Y2_(M)) through (X4_(M),Y2_(M)) ofthe micromirror array, which may represent the second, third, and fourthdose of irradiation received by the build points 1002 located at(X5_(B),Y2_(B)) through (X3_(B),Y2_(B)) of the build array 1000. Thebuild point 1002 located at (X1_(B),Y2_(B)) may receive no irradiation,having previously received irradiation from a sequence of beam segments400 corresponding to the micromirror elements 308 respectively locatedat (X1_(M),Y2_(M)) through (X5_(M),Y2_(M)).

The irradiation sequence may similarly increment as shown, for example,in FIGS. 11D through 11G, with relative movement between the irradiationdevice 142 and the build plane 130 and/or build array 1000. Mappingbetween the micromirror elements 308 of the micromirror array 306 andthe build points 1002 of the build array may increment from therespective preceding point in the irradiation sequence, for example, toa point in the irradiation sequence shown in FIG. 11G, such that themicromirror elements 308 located at (X1_(M),Y2_(M)) through(X5_(M),Y2_(M)) may be mapped or coordinated with the build points 1002respectively located at (X10_(B),Y2_(B)) through (X4_(B),Y2_(B)). At thepoint in the irradiation sequence depicted in FIG. 11G, the build point1002 located at (X5_(B),Y2_(B)) may have received irradiation from acomplete sequence of beam segments 400 respectively corresponding to amodulation group 500 that includes a plurality of micromirror elements308 from the micromirror array 306. For example, the build point 1002located at (X5_(B),Y2_(B)) may have received a first dose of irradiationfrom a first beam segment 400 corresponding to a first micromirrorelement 308 at the point in the irradiation sequence depicted in FIG.11B. Additionally, or in the alternative, the build point 1002 locatedat (X5_(B),Y2_(B)) may have received a second dose of irradiation from asecond beam segment 400 corresponding to a second micromirror element308 at the point in the irradiation sequence depicted in FIG. 11C, athird dose of irradiation from a third beam segment 400 corresponding toa third micromirror element 308 at the point in the irradiation sequencedepicted in FIG. 11D, a fourth dose of irradiation from a fourth beamsegment 400 corresponding to a fourth micromirror element 308 at thepoint in the irradiation sequence depicted in FIG. 11E, and/or a fifthdose of irradiation from a fifth beam segment 400 corresponding to afifth micromirror element 308 at the point in the irradiation sequencedepicted in FIG. 11F.

As shown in FIG. 11G, at least some of the build points 1002 in thebuild array 1000 may receive no irradiation. For example, the buildpoint 1002 located at (X5_(B),Y2_(B)) of the build array 1000 mayreceive no irradiation at the point in the irradiation sequence depictedin FIG. 11G, having already received irradiation from a sequence of beamsegments 400 sufficient to provide a specified intensity and/or powerdensity for irradiating the build point 1002 according to modulationinstructions carried out by the control system 104 and/or the opticalmodulator. The irradiation received by the build point 1002 located at(X5_(B),Y2_(B)) of the build array 1000 may correspond to a completesequence of beam segments 400 from the plurality of micromirror elements308 in the modulation group 500. Additionally, or in the alternative,the build point 1002 may receive no irradiation when, as described, forexample, with reference to FIG. 10B, modulation instructions do notinclude instructions to irradiate the build point 1002. For example, thebuild point 1002 may not define part of an object 114 being additivelymanufactured, and/or additional irradiation may be unnecessary at thebuild point 1002. As shown in FIG. 11G, the build point 1002 located at(X6_(B),Y2_(B)) may have received irradiation from a sequentialplurality of beam segments 400 respectively corresponding to theplurality of micromirror elements 308 located at (X1_(M),Y2_(M)) through(X5_(M),Y2_(M)). The build point 1002 located at (X7_(B),Y2_(B)) mayhave received irradiation from a sequential plurality of beam segments400 respectively corresponding to the plurality of micromirror elements308 located at (X1_(M),Y2_(M)) through (X4_(M),Y2_(M)). The build point1002 located at (X8_(B),Y2_(B)) may have received irradiation from asequential plurality of beam segments 400 respectively corresponding tothe plurality of micromirror elements 308 located at (X1_(M),Y2_(M))through (X3_(M),Y2_(M)). The build point 1002 located at (X9_(B),Y2_(B))may have received irradiation from a sequential plurality of beamsegments 400 respectively corresponding to the plurality of micromirrorelements 308 located at (X1_(M),Y2_(M)) through (X2_(M),Y2_(M)). Thebuild point 1002 located at (X10_(B),Y2_(B)) may have receivedirradiation from an initial beam segment 400 in a sequential pluralityof beam segments 400, with the initial beam segment 400 corresponding tothe micromirror element 308 located at (X1_(M),Y2_(M)).

As depicted in FIGS. 11A-11G, each build point 1002 in a build array1000 may receive irradiation from a sequential plurality of beamsegments 400 respectively corresponding to a plurality of micromirrorelements 308 in a micromirror array 306, such as a plurality ofmicromirror elements 308 that define a modulation group 500 and/or thatare included in a modulation group 500. Build points 1002 that are notintended to be irradiated, such as build points 1002 that are locatedoutside of a build region for a respective layer of a three-dimensionalobject 114, may be bypassed by the sequential plurality of beam segments400. The sequential plurality of beam segments 400 may irradiated abuild point 1002 and/or may bypass a build point 1002, for example,based at least in part on a build file that defines build points 1002 ofa build array 1000 to be irradiated in order to additively manufacture athree-dimensional object 114. Modulation instructions may cause theoptical modulator 302 to modulate respective modulation groups 500and/or corresponding micromirror elements 308 based at least in part onthe build file. Respective modulation groups 500 and/or correspondingmicromirror elements 308 may be modulated according to modulationinstructions from a control system 104. In some embodiments, a buildpoint 1002 may be bypassed by each of a plurality of beam segmentsrespectively corresponding to a plurality of micromirror elements 308 ina modulation group 500. Additionally, or in the alternative, a buildpoint 1002 may be bypassed by a portion of the micromirror elements 308in the modulation group 500, with remaining micromirror elements 308 inthe modulation group providing a beam segment 400 that becomes incidentupon the respective build point 1002. For example, with reference toFIGS. 4A, 4B, 5C, 5D, 5F, 5H, and/or 5I, a respective build point 1002may be irradiated by a sequential plurality of beam segments 400corresponding to a first beam segment-subset 408 that becomes incidentupon a first micromirror element-subset 406. Additionally, or in thealternative, a respective build point 1002 may be bypassed by asequential plurality of beam segments 400 corresponding to a second beamsegment-subset 412 that becomes incident upon a second micromirrorelement-subset 410. The beam segments 400 in the first beamsegment-subset 408 corresponding to the respective build point 1002 maysequentially propagate along an irradiation beam path 316 towards thefocusing lens assembly 312 and onto the respective build point 1002. Thebeam segments 400 in the second beam segment-subset 412 corresponding tothe respective build point 1002 may sequentially propagate along anextraction beam path 318, for example, to a beam stop 314.

Referring now to FIGS. 12A-12F, another exemplary irradiation sequenceis described. The irradiation sequence described with reference to FIGS.12A-12F may be performed together with the irradiation sequencesdescribed with reference to FIGS. 10A-10F and/or FIGS. 11A-11G, in wholeor in part, such as concurrently in combination with one another and/orwith respect to different regions of a build plane and/or differentportions of an additive manufacturing process. Additionally, or in thealternative, the irradiation sequence described with reference to FIGS.12A-12F may be performed as a stand-alone irradiation sequence, forexample, without also utilizing the irradiation sequences described withreference to FIGS. 10A-10F and/or FIGS. 11A-11G.

As shown in FIG. 12A, in some embodiments, an irradiation device 142 mayinclude one or more optical modulators 302 that include addressableelements 310 configured to modulate the corresponding micromirrorelements 308 to a plurality of respectively different modulation states.For example, as shown, an addressable element 310 may be configured tomodulate a corresponding micromirror element 308 to a plurality ofmodulation states that may correspond to a plurality of deflectionpositions, such as deflection positions of (−2), (−1), (0), (+1), and(+2). In some embodiments, a deflection position of (−2) may correspondto a “landed off” position and/or a deflection position of (+2) maycorrespond to a “landed on” position of the respective micromirrorelement. A “landed on” position may correspond to a micromirror element308 abutting a mechanical stops 424 that aligns the micromirror element308 with an irradiation beam path 316. A “landed off” position maycorrespond to a micromirror element 308 abutting a mechanical stops 424that aligns the micromirror element 308 with an extraction beam path318. In some embodiments, an irradiation device 142 may be configuredsuch that any one or more of the deflection positions of (−2), (−1),(0), (+1), and/or (+2) may align a micromirror element 308 with anirradiation beam path 316. The plurality of deflection positions mayrefer to positions of the micromirror elements 308 across a range ofmotion imparted by the corresponding addressable elements 310. Forexample, a micromirror element may tilt from a (−2) deflection positionsto a (+2) deflection position. The (−2) and (+2) deflection positionsmay respectively represent opposite ends of a range of motion. Forexample, the (−2) and (+2) deflection positions may correspond tomechanical stops 424 at opposite ends of a range of motion (see, e.g.,FIGS. 4C-4G). The (0) deflection position may represent an intermediateposition, such as a midpoint between the (−2) and (+2) deflectionpositions. The (−1) deflection position may represent a midpoint betweenthe (−2) and (0) deflection positions, such as a midpoint between theintermediate position and an end of a range of motion. The (+1)deflection position may represent a midpoint between the (+2) and (0)deflection positions, such as a midpoint between the intermediateposition and an end of a range of motion.

Additionally, or in the alternative, the plurality of deflectionpositions may respectively correspond to a plurality of modulationstates of a respective micromirror element 308 that corresponds to anaddressable element 310 that is movable in a plurality of degrees offreedom motions. For example, a TT optical modulator may be actuated toa plurality of modulation states that may correspond to deflectionpositions of (−2), (−1), (0), (+1), and (+2). The (−2) and (+2)deflection positions may correspond to opposite ends of a range ofmotion for a tip motion. The (−1) and (+1) deflection positions maycorrespond to opposite ends of a range of motion for a tilt motion. The(0) deflection position may represent an intermediate position, such asa midpoint between the (−2) and (+2) deflection positions correspondingto the tip motion and/or a midpoint between the (−1) and (+1) deflectionpositions corresponding to the tilt motion. As another example, a TPoptical modulator may be actuated to a plurality of modulation statesthat may correspond to deflection positions, for example, with (−2) and(+2) deflection positions corresponding to opposite ends of a range ofmotion for a tip motion or tilt option, (−1) and (+1) deflectionpositions corresponding to opposite ends of a range of motion for apiston motion, and/or a (0) deflection position corresponding to anintermediate position, such as a midpoint between the (−2) and (+2)deflection positions corresponding to the tip or tilt motion and/or amidpoint between the (−1) and (+1) deflection positions corresponding tothe piston motion. As yet another example, a TTP optical modulator maybe actuated to a plurality of modulation states that may correspond todeflection positions of (−3), (−2), (−1), (0), (+1), (+2), and (+3). The(−3) and (+3) deflection positions may respectively correspond toopposite ends of a range of motion for a tilt motion. The (−2) and (+2)deflection positions may correspond to opposite ends of a range ofmotion for a tip motion. The (−1) and (+1) deflection positions maycorrespond to opposite ends of a range of motion for a piston motion.The (0) deflection position may represent an intermediate position, suchas a midpoint between the (−3) and (+3) deflection positions, betweenthe (−2) and (+2) deflection positions, and/or between the (−1) and (+1)deflection positions. Additionally, or in the alternative, rather thanrepresenting ends of a range of motion, the (−2) and (+2) deflectionpositions, may represent intermediate positions in the range of motion.The (−3) and (+3) deflection positions and/or the (−1) and (+1)deflection positions may also represent intermediate positions in therange of motion.

In some embodiments, at least one modulation state may correspond to anorientation that causes a micromirror element 308 to direct acorresponding beam segment 400 along an extraction beam path 318leading, for example, to a beam stop 314. As described with reference toFIGS. 12A-12F, the respective micromirror elements 308 may include atleast an additional modulation state corresponding to an (X) deflectionposition that orients a beam segment 400 along the extraction beam path318. For example, as shown in FIG. 12A, a micromirror element located at(M₁) of the micromirror array 306 may exhibit a modulation statecorresponding to an (X) deflection position with an orientation thatreflects a beam segment 400 along an extraction beam path 318, such asto a beam stop 314. Additionally, or in the alternative, as shown inFIG. 12C, micromirror elements 308 located at (M₁) and (M₂) may exhibita modulation state corresponding to an (X) deflection position, and/oras shown in FIG. 12D, located at (M₁₉) and (M₂₀) may exhibit amodulation state corresponding to an (X) deflection position, with arespective orientation that reflects a beam segment 400 along anextraction beam path 318, such as to a beam stop 314.

As shown in FIGS. 12A-12F, a modulation group 500 may include aplurality micromirror elements 308 that provide a correspondingplurality of beam segments 400 that combine to at least partiallyoverlap with one another at a combination zone 334 when the plurality ofmicromirror elements 308 in the modulation group 500 exhibit respectiveones of a plurality of different modulation states. For example, asshown, the plurality of different modulation states may correspond todeflection positions of (−2), (−1), (0), (+1), and (+2). The pluralityof different modulation states may optionally include a modulation statecorresponding to a deflection position of (X), with an orientation thatreflects a beam segment 400 along an extraction beam path 318, such asto a beam stop 314. The (X) deflection position may be in addition tothe deflection positions of (−2), (−1), (0), (+1), and (+2), or the (X)deflection position may be in the alternative to one or more of thedeflection positions of (−2), (−1), (0), (+1), and (+2). A micromirrorelement 308 may include a plurality of modulation groups 500respectively including a plurality of micromirror elements 308 that mayexhibit respective ones of a plurality of different modulation states,corresponding, for example, to deflection positions of (−2), (−1), (0),(+1), and (+2), and/or to deflection positions of (X), (−2), (−1), (0),(+1), and (+2), and/or to deflection positions of (X), (−1), (0), (+1),and (+2).

The optical modulator 302 may cause the micromirror elements 308 toundergo a modulation cycle, that includes cycling the plurality ofmicromirror elements 308 through a sequence of modulation states thatreflect a respective beam segment 400 to a combination zone 334 in thecombination zone array 1200. The sequence of modulation states maycorrespond to deflection positions of (−2), (−1), (0), (+1), and (+2).Micromirror elements that reflect a beam segment 400 along an extractionbeam path 318 may have a deflection position of (X). By way of example,the modulation cycle may include a plurality of micromirror elements 308cycling through a sequence that progresses from a (−2) deflectionposition, to a (−1) deflection position, to a (0) deflection position,to a (+1) deflection position, to a (+2) deflection position. Thesequence may continue from the (+2) deflection position to the (−2)deflection position. Additionally, or in the alternative, the sequencemay continue in the opposite direction, for example, from the (+2)deflection position to the (+1) deflection position, and so forth.Additionally, or in the alternative, the sequence may cycle through aplurality of modulation states in a pseudorandom pattern provided, forexample, by a pseudorandom number generator. The pseudorandom numbergenerator may be configured to position the micromirror elements 308 inrespective ones of the plurality of modulation states a substantiallyequal number of instances over a specified time interval. For example,pseudorandom number generator may provide for the respective micromirrorelements 308 to exhibit respective ones of the plurality of modulationstates with an equivalent number of instances over the specified timeinterval with a variance of +/−10%, such as +/−5%, such as +/−1%, orsuch as +/−0.100.

An energy beam 144 may become incident upon the micromirror array 306when the respective micromirror elements 308 are respectively orientedin a respective one of the plurality of modulation states. Therespective micromirror elements 308 may reflect a corresponding beamsegment 400 when oriented in the respective ones of the plurality ofmodulation states. The respective beam segments 400 may be reflected toa respectively different combination zone 334 depending at least in parton the modulation state of the respective micromirror element 308. Themicromirror array 306 may be mapped or coordinated to a combination zonearray 1200. The combination zone array 1200 may include a plurality ofcombination zones 334. The combination zone array 1200 may correspondto, and/or may be mapped to, a build array 1000. For example, thecombination zone array 1200 may equate to the build array 1000.Additionally, or in the alternative, the combination zone array 1200 andthe build array 1000 may have respectively different spatial locations.In some embodiments, the combination zone array 1200 may be spatiallylocated along an irradiation beam path 316 in proximity to a focusinglens assembly 312. For example, the combination zone array 1200 may bespatially located within a spatial domain occupied by a focusing lens ofthe focusing lens assembly 312, or upstream from a focusing lensassembly 312, or downstream from a focusing lens assembly 312.Additionally, or in the alternative, the combination zone array 1200 maybe spatially located above the build plane 130, such as between thefocusing lens assembly 312 and the build plane 130.

The micromirror array 306 may include a plurality of modulation groups500. An exemplary modulation group 500 may include a plurality ofmicromirror elements 308 respectively oriented in a plurality ofdifferent modulation states, and respective ones of the plurality ofmicromirror elements 308 may respectively reflect a corresponding beamsegment 400 to a common combination zone in the combination zone array1200. By way of example, the plurality of different modulation statesmay respectively correspond to deflection positions of (−2), (−1), (0),(+1), and (+2). As shown, for example, in FIG. 12A, one of themodulation groups 500 may include a plurality of micromirror elements308 respectively located at (M₆), (M₇), (M₈), (M₉), and (M₁₀) of themicromirror array 306. The plurality of micromirror elements 308 mayreflect a corresponding plurality of beam segments 400 to a combinationzone 334 spatially located at (P₁) of the combination zone array 1200. Afirst micromirror element 308 located at (M₆) may reflect a first beamsegment 400 to the combination zone 334 spatially located at (P₁) of thecombination zone array 1200. A second micromirror element 308 located at(M₇) may reflect a second beam segment 400 to the combination zone 334spatially located at (P₁). A third micromirror element 308 located at(M₈) may reflect a third beam segment 400 to the combination zone 334spatially located at (P₁). A fourth micromirror element 308 located at(M₉) may reflect a fourth beam segment 400 to the combination zone 334spatially located at (P₁). A fifth micromirror element 308 located at(M₁₀) may reflect a fifth beam segment 400 to the combination zone 334spatially located at (P₁).

The irradiation sequence shown in FIGS. 12A-12F may include a pluralityof micromirror elements being modulated to respectively differentmodulation states. As the micromirror elements sequence through aplurality of respectively different modulation states, the plurality ofbeam segments 400 in a beam segment-subset 408 may be directed torespectively different combination zones 334 in the combination zonearray 1200. As the micromirror elements 308 cycle through theirradiation sequence, the plurality of beam segments 400 may be combinedat a plurality of different combination zones 334, such as a sequence ofcombination zones 334. The sequence may repeat, such that the respectivemicromirror elements 308 direct beam segments 400 to a plurality ofdifferent combination zones 334 in a repeating sequence. FIGS. 12A-12Fshow an exemplary repeating sequence.

As illustrated, by way of example, in FIGS. 12A-12F, at a first point inthe irradiation sequence, shown, for example, in FIG. 12A, a beamsegment-subset 408 may include a plurality of beam segments 400reflected to a combination zone 334 spatially located at (P₁) in thecombination zone array 1200. At a second point in the irradiationsequence, shown, for example, in FIG. 12B, a beam segment-subset 408 mayinclude a plurality of beam segments 400 reflected to a combination zone334 spatially located at (P₂) in the combination zone array 1200. At athird point in the irradiation sequence, shown, for example, in FIG.12C, a beam segment-subset 408 may include a plurality of beam segments400 reflected to a combination zone 334 spatially located at (P₃) in thecombination zone array 1200. At a fourth point in the irradiationsequence, shown, for example, in FIG. 12D, a beam segment-subset 408 mayinclude a plurality of beam segments 400 reflected to a combination zone334 spatially located at (P₄) in the combination zone array 1200. At afifth point in the irradiation sequence, shown, for example, in FIG.12E, a beam segment-subset 408 may include a plurality of beam segments400 reflected to a combination zone 334 spatially located at (P₅) in thecombination zone array 1200. At a sixth point in the irradiationsequence, shown, for example, in FIG. 12F, a beam segment-subset 408 mayinclude a plurality of beam segments 400 reflected, once again, to acombination zone 334 spatially located at (P₁) in the combination zonearray 1200.

In some embodiments, the particular micromirror elements 308 included ina modulation group 500 may differ as between respective points in anirradiation sequence. At sequential points in the irradiation sequence,a modulation group 500 may differ by at least one micromirror element308. For example, one or more micromirror elements 308 may be added to amodulation group 500 and/or one or more micromirror elements 308 may besubtracted from a modulation group 500 at respective points in theirradiation sequence. The number of micromirror elements 308 in amodulation group 500 may remain constant over a plurality of points inan irradiation sequence. Additionally, or in the alternative, the numberof micromirror elements 308 in a modulation group 500 may remainconstant over a plurality of points in an irradiation sequence. In someembodiments, one or more modulation groups 500 may incrementallypropagate in one or more directions across a micromirror array 306 incoordination with incremental points in the irradiation sequence.Additionally, or in the alternative, the beam segment-subsets 408respectively corresponding to the modulation groups 500 may combine at arespective combination zone 334 spatially located at an incrementallypropagating point of the combination zone array 1200.

By way of example, as shown in FIGS. 12A-12F, at a first point in theirradiation sequence, shown, for example, in FIG. 12A, a beamsegment-subset 408 combining at a combination zone 334 spatially locatedat (P₁) in the combination zone array 1200 may correspond to amodulation group 500 that includes micromirror elements located at (M₆),(M₇), (M₈), (M₉), and (M₁₀) of the micromirror array 306. At a secondpoint in the irradiation sequence, shown, for example, in FIG. 12B, abeam segment-subset 408 combining at a combination zone 334 spatiallylocated at (P₂) in the combination zone array 1200 may correspond to amodulation group 500 that includes micromirror elements located at (M₇),(M₈), (M₉), (M₁₀), and (M₁₁) of the micromirror array 306. At a thirdpoint in the irradiation sequence, shown, for example, in FIG. 12C, abeam segment-subset 408 combining at a combination zone 334 spatiallylocated at (P₃) in the combination zone array 1200 may correspond to amodulation group 500 that includes micromirror elements located at (M₈),(M₉), (M₁₀), (M₁₁), and (M₁₂) of the micromirror array 306. At a fourthpoint in the irradiation sequence, shown, for example, in FIG. 12D, abeam segment-subset 408 combining at a combination zone 334 spatiallylocated at (P₄) in the combination zone array 1200 may correspond to amodulation group 500 that includes micromirror elements located at (M₉),(M₁₀), (M₁₁), (M₁₂), and (M₁₃) of the micromirror array 306. At a fifthpoint in the irradiation sequence, shown, for example, in FIG. 12E, abeam segment-subset 408 combining at a combination zone 334 spatiallylocated at (P₅) in the combination zone array 1200 may correspond to amodulation group 500 that includes micromirror elements located at(M₁₀), (M₁₁), (M₁₂), (M₁₃), and (M₁₄) of the micromirror array 306. At asixth point in the irradiation sequence, shown, for example, in FIG.12F, a beam segment-subset 408 combining at a combination zone 334spatially located at (P₁) in the combination zone array 1200 maycorrespond to a modulation group 500 that includes micromirror elementslocated at (M₁₁), (M₁₂), (M₁₃), (M₁₄), and (M₁₅) of the micromirrorarray 306.

Referring now to FIGS. 13A-13S, and/or FIGS. 14A-14H-2 , furtherexemplary irradiation sequence are described. The irradiation sequencedescribed with reference to FIGS. 13A-13S, and/or FIGS. 14A-14H-2 , maybe performed together with the irradiation sequences described withreference to FIGS. 10A-10 , FIGS. 11A-11G, and/or FIGS. 12A-12F, inwhole or in part, such as concurrently in combination with one anotherand/or with respect to different regions of a build plane and/ordifferent portions of an additive manufacturing process. Additionally,or in the alternative, the irradiation sequence described with referenceto FIGS. 13A-13S, and/or FIGS. 14A-14H-2 , may be performed as astand-alone irradiation sequence, for example, without also utilizingthe irradiation sequences described with reference to FIGS. 10A-10F,FIGS. 11A-11G, and/or FIGS. 12A-12F.

As shown in FIGS. 13A-13S, an energy beam 144 may become incident upon amicromirror array 306 of an optical modulator 302 when the micromirrorelements 308 of the micromirror array 306 are oriented in one or more ofa plurality of modulation states. An irradiation device 142 may beconfigured to synchronize the timing of pulses of the energy beam 144from a beam generation device 300 with modulation of the micromirrorelements 308 of the optical modulator. For example, in some embodiments,the beam generation device 300 may be controlled so as to provide pulsesof the energy beam 144 at timing that coincides with respectivemicromirror elements 308 being located at a desired modulation statewhen the energy beam 144 becomes incident upon the respectivemicromirror elements 308. In some embodiments, the optical modulator 302may dither at least some of the micromirror elements 308 between aplurality of modulation states, such as at a specified frequency, andthe beam generation device 300 may pulse at specified times thatcoincides with respective micromirror elements 308 being located at adesired modulation state when the energy beam 144 becomes incident uponthe respective micromirror elements 308. Additionally, or in thealternative, the beam generation device 300 may pulse, such as at aspecified frequency, and the optical modulator may modulate at leastsome of the micromirror elements 308 to respective modulation states attiming that causes the respective micromirror elements 308 to be locatedat a desired modulation state when a respective energy beam 144 pulsebecomes incident upon the respective micromirror elements 308.

The plurality of modulation states that may correspond to a plurality ofdeflection positions, such as deflection positions of (−2), (−1), (0),(+1), and (+2). The micromirror elements 308 may cycle through asequence that progresses through a plurality of deflection positions.The respective beam segments 400 may be reflected to a respectivelydifferent combination zone 334, such as respective ones of a pluralityof combination zones 334 in a combination zone array 1200, based atleast in part on the modulation state of the respective micromirrorelement 308. In some embodiments, a beam generation device 300 (See,e.g., FIGS. 3A and 3B) may pulse an energy beam at pulse times that aresynchronized with respective modulation states of the respectivemicromirror elements. The pulse times may be determined based at leastin part on a time of flight for the energy beam 144 to become incidentupon the micromirror array 306 and/or the respective micromirrorelements 308 of the micromirror array 306. The beam generation device300 may pulse an energy beam 144 at pulse times corresponding tomodulation states exhibited by the micromirror elements 308 when theenergy beam 144 becomes incident upon the micromirror array 306 and/orthe respective micromirror elements 308 thereof. The addressableelements 310 of the optical modulator 302 may actuate to a plurality ofdifferent modulation states, for example, to position the correspondingmicromirror elements 308 at respective deflection positionscorresponding to the pulses of the energy beam 144. The micromirrorelements 308 may respectively reflect a corresponding beam segment 400to a common combination zone in the combination zone array 1200 thatcorresponds to the respective modulation state coinciding with thepulses of the energy beam 144. Additionally, or in the alternative, acontinuous wave energy beam may be utilized, and the micromirrorelements 308 may sweep respective beam segments 400 across thecombination zone array 1200.

An exemplary modulation cycle may include the optical modulator 302cycling the micromirror elements 308 though a plurality of modulationstates coinciding to respectively different deflection positions with afrequency of about 100 nanoseconds (ns) to about 10,000 ns, such as fromabout 100 ns to 2,500 ns, such as about 250 to about 1,000 ns, such asfrom about 250 ns to about 2,500 ns, such as from about 2,500 ns toabout 5,000 ns or such as from about 5,000 ns to about 10,000 ns. Thetime of flight for a pulse, or a plurality of pulses, of the energy beam144 to travel from the beam generation device 300 to the micromirrorarray 306 and/or to the respective the micromirror elements 308 may beon the order of picoseconds, such as less than 10,000 picoseconds, suchas less than 5,000 picoseconds, such as less than 1,000 picoseconds,such as less than 100 picoseconds, or such as less than 10 picoseconds.With the time of flight being several orders of magnitude shorter thanthe modulation frequency of the optical modulator 302, a pulses of theenergy beam 144 may be reflected by the respective micromirror elements308 at an effectively instantaneous deflection position. For example, anoptical modulator 302 that includes addressable elements 310 configuredto be actuated by a digital actuator, discrete signals from the digitalactuator may cause the respective micromirror elements 308 to actuatebetween a plurality of specified modulation states. Additionally, or inthe alternative, the discrete signals from the digital actuator maycause the respective micromirror elements 308 to sweep through aplurality of specified modulation states located at respectivelydifferent deflection positions within a range of motion of therespective micromirror element 308. For example, a first modulationstate may correspond to a first mechanical stop 424 a first end of therange of motion, and a second modulation state may correspond to asecond mechanical stop 424 at a second end of the range of motion.Additionally, or in the alternative, one or more modulation states maybe located at deflection positions along the range of motion between thefirst mechanical stop 424 and the second mechanical stop 424respectively located, for example, at opposite ends of a range ofmotion. For an optical modulator 302 for an optical modulator 302 thatincludes an addressable element configured to be actuated by an analogactuator, a signal may cause the analog actuator to drive and hold anaddressable element 310 to a position corresponding to a modulationstate a range of motion of the respective micromirror element 308. Incoordination with the movement of respective micromirror elements tospecified modulation states, the beam generation device 300 may providea pulse, or a plurality of pulses, of the energy beam as or when therespective micromirror elements 308 become positioned at the specifiedmodulation states. Regardless of whether the micromirror elements 308are modulated by an addressable element actuated by a digital actuator,an analog actuator, or other actuator, a time interval for the beamgeneration device 300 to provide a pulse, or a plurality of pulses, ofthe energy beam 144 that coincided with the respective modulation stateof the micromirror elements 308 may be orders of magnitude larger thanthe time of flight of the pulse, or the plurality of pulses, of theenergy beam 144 from the beam generation device 300.

FIGS. 13A-13F show an exemplary irradiation sequence that includes amodulation cycle whereby a plurality of micromirror elements 308 cyclethough a plurality of modulation states coinciding to respectivelydifferent deflection positions, such that a corresponding plurality ofbeam segments 400 are reflected to respectively different combinationzones 334 in a combination zone array 1200. By way of example, as shownin FIGS. 13A-13F, an exemplary modulation cycle may have a frequency ofabout 60 nanoseconds (ns). However, it will be appreciated that thecycle frequency shown is provided by way of example only, and not to belimiting, and that any suitable cycle frequency may be provided. A beamgeneration device 300 may emit an energy beam 144, for example, in theform of a pulse, or a plurality of pulses, in coordination with themicromirror elements being oriented to a modulation state that coincidedwith a build point 1002 of a build array 1000 to be irradiated. In someembodiments, the beam generation device 300 may emit a pulse, or aplurality of pulses, according to a pulse frequency. The pulse frequencymay be coordinated with the modulation states of the micromirrorelements 308.

As shown in FIG. 13A, a plurality of micromirror elements 308 mayexhibit a modulation state corresponding to a deflection position of(−2) at about a time of T₁ in a modulation cycle. The time T₁ may beabout +10 nanoseconds (ns) from commencement of the modulation cycle atT₀. Alternatively, the time T₁ may commence the modulation cycle. Incoordination with the time T₁, the beam generation device 300 may emitthe energy beam 144, for example, in the form of one or more pulses.With the plurality of micromirror elements 308 exhibiting a modulationstate corresponding to a deflection position of (−2) in coordinationwith the time T₁, a corresponding plurality of beam segments 400 may bereflected to a corresponding plurality of combination zones 334 of acombination zone array 1200. For example, a beam segment 400corresponding to micromirror element 308 at location M₅ of themicromirror array 306 may coincide with a beam combination zone 334located at P₁ in the combination zone array 1200. Additionally, or inthe alternative, a beam segment 400 corresponding to micromirror element308 at location M₆ of the micromirror array 306 may coincide with a beamcombination zone 334 located at P₂ in the combination zone array 1200.Additionally, or in the alternative, beam segments 400 respectivelycorresponding to micromirror elements 308 at locations M₇, M₈, and M₉ ofthe micromirror array 306 may coincide with beam combination zones 334respectively located at P₃, P₄, and P₅ in the combination zone array1200.

As shown in FIGS. 13B through 13E, as the micromirror elements progressthrough the modulation cycle, the micromirror elements 308 may exhibitrespective sequential modulation states at specified times in themodulation cycle. The respective modulation states may correspond torespective sequential deflection positions that coincide with respectivecombination zones 334 in the combination zone array 1200. In someembodiments, the beam segments 400 reflected at respective specifiedtimes in the modulation cycle may become incident upon a sequence ofcombination zones 334, such as an incremental sequence of combinationzones 334, in the combination zone array 1200. In some embodiments, thesequence of combination zones 334, such as the incremental sequence ofcombination zones 334, may include adjacent combination zones 334.Additionally, or in the alternative, the combination zones 334 in thesequence may be spaced apart by a defined interval of the combinationzone array 1200. After cycling through a plurality of deflectionpositions, such as shown in FIGS. 13A-13E and optionally FIG. 13F, themodulation cycle may proceed in a reverse order relative to a precedingorder, or the modulation cycle may repeat the preceding order. Aftercompleting a modulation cycle, a plurality of beam segments 400 maybecome incident upon a plurality of combination zones 334.

As shown in FIG. 13B, the plurality of micromirror elements 308 mayexhibit a modulation state corresponding to a deflection position of(−1) at about a time of T₂ in the modulation cycle. The time T₂ may beabout +20 ns from commencement of the modulation cycle at T₀.Additionally, or in the alternative, the time T₂ may be about +10 nsfrom time T₁, shown in FIG. 13A. In coordination with the time T₂, thebeam generation device 300 may emit the energy beam 144, for example, inthe form of one or more pulses. With the plurality of micromirrorelements 308 exhibiting a modulation state corresponding to a deflectionposition of (−1) in coordination with the time T₂, a correspondingplurality of beam segments 400 may be reflected to a correspondingplurality of combination zones 334 of a combination zone array 1200. Forexample, a beam segment 400 corresponding to micromirror element 308 atlocation M₄ of the micromirror array 306 may coincide with a beamcombination zone 334 located at P₁ in the combination zone array 1200.By way of comparison, at the time T₁ shown in FIG. 13A, the beam segment400 coinciding with the combination zone 334 located at P₁ in thecombination zone array 1200 was reflected by the micromirror element 308at location M₅ of the micromirror array 306. As further shown in FIG.13B, at time T₂, a beam segment 400 corresponding to micromirror element308 at location M₅ of the micromirror array 306 may coincide with a beamcombination zone 334 located at P₂ in the combination zone array 1200.Additionally, or in the alternative, beam segments 400 respectivelycorresponding to micromirror elements at locations M₆, M₇, and M₈ of themicromirror array 306 may coincide with beam combination zones 334respectively located at P₃, P₄, and P₅ in the combination zone array1200.

As shown in FIG. 13C, the plurality of micromirror elements 308 mayexhibit a modulation state corresponding to a deflection position of (0)at about a time of T₃ in the modulation cycle. The time T₃ may be about+30 ns from commencement of the modulation cycle at T₀. Additionally, orin the alternative, the time T₃ may be about +10 ns from time T₂, shownin FIG. 13B. In coordination with the time T₃, the beam generationdevice 300 may emit the energy beam 144, for example, in the form of oneor more pulses. With the plurality of micromirror elements 308exhibiting a modulation state corresponding to a deflection position of(0) in coordination with the time T₃, a corresponding plurality of beamsegments 400 may be reflected to a corresponding plurality ofcombination zones 334 of a combination zone array 1200. For example, abeam segment 400 corresponding to micromirror element 308 at location M₃of the micromirror array 306 may coincide with a beam combination zone334 located at P₁ in the combination zone array 1200. By way ofcomparison, at the time T₂ shown in FIG. 13B, the beam segment 400coinciding with the combination zone 334 located at P₁ in thecombination zone array 1200 was reflected by the micromirror element 308at location M₄ of the micromirror array 306. As further shown in FIG.13C, at time T₃, a beam segment 400 corresponding to micromirror element308 at location M₄ of the micromirror array 306 may coincide with a beamcombination zone 334 located at P₂ in the combination zone array 1200.Additionally, or in the alternative, beam segments 400 respectivelycorresponding to micromirror elements at locations M₅, M₆, and M₇ of themicromirror array 306 may coincide with beam combination zones 334respectively located at P₃, P₄, and P₅ in the combination zone array1200.

As shown in FIG. 13D, the plurality of micromirror elements 308 mayexhibit a modulation state corresponding to a deflection position of(+1) at about a time of T₄ in the modulation cycle. The time T₄ may beabout +40 ns from commencement of the modulation cycle at T₀.Additionally, or in the alternative, the time T₄ may be about +10 nsfrom time T₃, shown in FIG. 13C. In coordination with the time T₄, thebeam generation device 300 may emit the energy beam 144, for example, inthe form of one or more pulses. With the plurality of micromirrorelements 308 exhibiting a modulation state corresponding to a deflectionposition of (+1) in coordination with the time T₄, a correspondingplurality of beam segments 400 may be reflected to a correspondingplurality of combination zones 334 of a combination zone array 1200. Forexample, a beam segment 400 corresponding to micromirror element 308 atlocation M₂ of the micromirror array 306 may coincide with a beamcombination zone 334 located at P₁ in the combination zone array 1200.By way of comparison, at the time T₃ shown in FIG. 13C, the beam segment400 coinciding with the combination zone 334 located at P₁ in thecombination zone array 1200 was reflected by the micromirror element 308at location M₃ of the micromirror array 306. As further shown in FIG.13D, at time T₄, a beam segment 400 corresponding to micromirror element308 at location M₃ of the micromirror array 306 may coincide with a beamcombination zone 334 located at P₂ in the combination zone array 1200.Additionally, or in the alternative, beam segments 400 respectivelycorresponding to micromirror elements at locations M₄, M₅, and M₆, ofthe micromirror array 306 may coincide with beam combination zones 334respectively located at P₃, P₄, and P₅ in the combination zone array1200.

As shown in FIG. 13E, the plurality of micromirror elements 308 mayexhibit a modulation state corresponding to a deflection position of(+2) at about a time of T₅ in the modulation cycle. The time T₅ may beabout +50 ns from commencement of the modulation cycle at T₀.Additionally, or in the alternative, the time T₅ may be about +10 nsfrom time T₄, shown in FIG. 13D. In coordination with the time T₅, thebeam generation device 300 may emit the energy beam 144, for example, inthe form of one or more pulses. With the plurality of micromirrorelements 308 exhibiting a modulation state corresponding to a deflectionposition of (+2) in coordination with the time T₅, a correspondingplurality of beam segments 400 may be reflected to a correspondingplurality of combination zones 334 of a combination zone array 1200. Forexample, a beam segment 400 corresponding to micromirror element 308 atlocation M₁ of the micromirror array 306 may coincide with a beamcombination zone 334 located at P₁ in the combination zone array 1200.By way of comparison, at the time T₄ shown in FIG. 13D, the beam segment400 coinciding with the combination zone 334 located at P₁ in thecombination zone array 1200 was reflected by the micromirror element 308at location M₂ of the micromirror array 306. As further shown in FIG.13E, at time T₅, a beam segment 400 corresponding to micromirror element308 at location M₂ of the micromirror array 306 may coincide with a beamcombination zone 334 located at P₂ in the combination zone array 1200.Additionally, or in the alternative, beam segments 400 respectivelycorresponding to micromirror elements at locations M₃, M₄, and M₅, ofthe micromirror array 306 may coincide with beam combination zones 334respectively located at P₃, P₄, and P₅ in the combination zone array1200.

In some embodiments, as shown, for example, in FIG. 13E, the pluralityof micromirror elements 308 may exhibit a modulation state correspondingto a deflection position of (X) corresponding to an extraction beam path318 that leads, for example, to a beam stop 314. A modulation cycle mayinclude a modulation state corresponding to the deflection position of(X). An energy beam 144 incident upon the micromirror elementsexhibiting a deflection position of (X) may be reflected along theextraction beam path 318. Additionally, or in the alternative, portionsof the micromirror array 306 that correspond to build points 1002 of thebuild array 1000 that are intended to receive irradiation at a point intime of an irradiation sequence may exhibit a deflection positioncorresponding to an irradiation beam path 316, and/or portions of themicromirror array 306 that correspond to build points 1002 of the buildarray 1000 that are not intended to receive irradiation at the point intime of the irradiation sequence may exhibit a deflection positioncorresponding to an irradiation beam path 316. For example, modulationstates corresponding to deflection positions of (−2), (−1), (0), (+1),and/or (+2) may correspond to an irradiation beam path 316, and adeflection position of (X) may correspond to an extraction beam path318. Additionally, or in the alternative, modulation statescorresponding to deflection positions of (−2), (−1), (0), (+1), and/or(+2) may respectively correspond to either the irradiation beam path 316or the extraction beam path 318. For example, the modulation statescorresponding to the deflection position of (+2) may correspond to theextraction beam path 318, while modulation states corresponding todeflection positions of (−2), (−1), (0), and (+1) may correspond to theirradiation beam path 316. As another example, the modulation statescorresponding to the deflection position of (0) may correspond to theextraction beam path 318, while modulation states corresponding todeflection positions of (−2), (−1), (+1), and (+2) may correspond to theirradiation beam path 316.

Micromirror elements 308 and/or modulation groups 500 that correspond toportions of the build array 1000 that are not intended to receiveirradiation at a point in time of an irradiation sequence may bemodulated to, or sustained at, a modulation state corresponding to theextraction beam path 318, such as a modulation state corresponding to adeflection position of (X). Micromirror elements 308 and/or modulationgroups 500 may be modulated to, or sustained, at, the modulation statecorresponding to the extraction beam path 318 in coordination withportions of the build array 1000 that are not intended to receiveirradiation at respective points in time of the irradiation sequence.Micromirror elements 308 and/or modulation groups 500 that correspond toportions of the build array 1000 that are intended to receiveirradiation at a point in time of an irradiation sequence may bemodulated to one or more modulation states corresponding to theirradiation beam path 316, such as a plurality of modulation statesrespectively corresponding to deflection positions of (−2), (−1), (0),(+1), and (+2). Additionally, or in the alternative, a modulation statecorresponding to a deflection position of (X) may be included in themodulation cycle, for example, such that micromirror elements 308 mayexhibit a modulation state corresponding to a deflection position of (X)in coordination with portions of the build array 1000 that are notintended to receive irradiation at that point in the irradiationsequence. The micromirror elements 308 exhibiting the deflectionposition of (X) may thereby reflect the respective beam segments 400along the extraction beam path 318 and thereby avoid irradiating theportions of the build array 1000 that are not intended to receiveirradiation at that point in the irradiation sequence.

For example, as shown in FIG. 13F, the plurality of micromirror elements308 may exhibit a modulation state corresponding to a deflectionposition of (X) at about a time of T₆ in the modulation cycle.Additionally, or in the alternative, some micromirror elements 308and/or some modulation groups 500, may remain at a deflection positionof (X) while other micromirror elements 308 and/or other modulationgroups 500 cycle through a plurality of deflection positions, such asshown in FIGS. 13A-13E. As shown in FIG. 13F, the time T₆ may be about+60 ns from commencement of the modulation cycle at T₀. Additionally, orin the alternative, the time T₆ may be about +10 ns from time T₅, shownin FIG. 13E. In coordination with the time T₆, the beam generationdevice 300 may emit the energy beam 144, for example, in the form of oneor more pulses. With the plurality of micromirror elements 308exhibiting a modulation state corresponding to a deflection position of(X) in coordination with the time T₆, a corresponding plurality of beamsegments 400 may be reflected to an extraction beam path 318 leading,for example, to a beam stop 314. For example, a plurality of beamsegments 400 respectively corresponding to micromirror elements 308 atlocations M₁ through M₉ of the micromirror array 306 may be reflected tothe extraction beam path 318.

Referring to FIGS. 13G-13L, another exemplary irradiation sequence thatincludes a modulation cycle will be described. As with the modulationcycle described with reference to FIGS. 13A-13F, the modulation cycleshown in FIGS. 13G-13L may include a plurality of micromirror elements308 cycle though a plurality of modulation states coinciding torespectively different deflection positions, such that a correspondingplurality of beam segments 400 are reflected to respectively differentcombination zones 334 in a combination zone array 1200. The modulationcycle shown in FIGS. 13G-13L may have a frequency of about 1,500nanoseconds (ns). In some embodiments, a modulation cycle may include abeam generation device 300 providing a plurality of pulses at a pulseinterval and an optical modulator 302 modulating a plurality ofmicromirror elements 308 to a plurality of modulation states at amodulation interval. As used herein, the term “pulse interval” refers toa time interval within which an energy beam 144 becoming incident upon aplurality of micromirror elements 308 may coincide with a modulationstate of the plurality of micromirror elements 308. As used herein, theterm “modulation interval” refers to a time interval during which one ormore micromirror elements 308, such as a plurality of micromirrorelements 308 in a modulation group 500, transition to a sequentialmodulation state in coordination with a pulse interval, such as from afirst modulation state to a second modulation state. For example, aplurality of micromirror elements 308 that are modulated to a pluralityof modulation states respectively corresponding to deflection positionsof (−2), (−1), (0), (+1), and (+2), may transition to a modulation statecorresponding to a deflection position of (−2) to a modulation statecorresponding to a deflection position of (−1) during a modulationinterval. The transition to sequential modulation states may include anincremental transition and/or a cyclical transition. For example, amodulation interval may increment from a first modulation state to asecond modulation state during a fraction of a modulation cyclefrequency. Additionally, or in the alternative, a modulation intervalthat includes a cyclical transition may be greater than a modulationcycle frequency. For example, the modulation interval may include a timeinterval of a modulation cycle plus a time interval to increment to asequential modulation state. A beam generation device 300 may provide anenergy beam 144, for example, in the form of one or more pulses, at thepulse interval. In some embodiments, a plurality of pulses may beprovided within a pulse interval corresponding to a modulation state. Insome embodiments, a beam generation device 300 may provide an energybeam 144, for example, in the form of one or more pulses, at respectiveones of a plurality of pulse intervals within a modulation cycle.Additionally, or in the alternative, a plurality of pulse intervalsrespectively corresponding to a plurality of modulation states mayextend across a plurality of modulation cycles. For example, a pulseinterval corresponding to a first modulation state may be provided at afirst modulation cycle, and/or a pulse interval corresponding to asecond modulation state may be provided at a second modulation cycle.The second pulse interval may correspond to a time of a modulation cycleplus a time of an incremental transition from the first modulation stateto the second modulation state.

As shown in FIGS. 13G-13L, an irradiation sequence and/or a modulationcycle may include a pulse interval of about 10 ns. The pulse intervalmay occur at a modulation interval of about 250 ns. It will beappreciated that the pulse interval and the modulation interval shownare provided by way of example only, and not to be limiting, and thatany suitable pulse interval and/or modulation interval may be provided.In some embodiments, as shown in FIGS. 13G-13L, the modulation cycle maybe about 1250 ns. Additionally, or in the alternative, as shown in FIGS.13G-13L, the modulation cycle may be about 250 ns, and the respectivepulse intervals may be provided at sequential iterations of themodulation cycle. The irradiation sequence shown in FIGS. 13G-13L isotherwise similar to the irradiation sequence described with referenceto FIGS. 13A-13F, and as such, the irradiation sequence shown in FIGS.13G-13L may be further understood with reference to FIGS. 13A-13F andtherefore will not be further described.

Referring now to FIG. 13M, over the course of one or more modulationcycles, such as according to the irradiation sequence described withreference to FIGS. 13A-13F and/or FIGS. 13G-13L, a plurality of beamsegments 400 may be regarded as at least partially combined at arespective combination zone 334. For example, a combination zone 334located at P₃ of the combination zone array 1200 may receive a pluralityof beam segments 400 from a corresponding plurality of micromirrorelements 308, such as micromirror elements located at M₃, M₄, M₅, M₆,and M₇ of the micromirror array 306. The respective beam segments 400may occupy a spatial location of the combination zone 334 atrespectively different points in time. For example, as shown in FIG.13M, at a time T₁, a micromirror element located at M₇ of themicromirror array 306 may reflect a beam segment 400 coinciding with thecombination zone 334 located at P₃ of the combination zone array 1200.Additionally, or in the alternative, at a time T₂, a micromirror elementlocated at M₆ of the micromirror array 306 may reflect a beam segment400 coinciding with the combination zone 334 located at P₃ of thecombination zone array 1200. Additionally, or in the alternative, attimes T₃, T₄, and T₅, micromirror elements 308 respectively located atM₅, M₄, and M₃ of the micromirror array 306 may reflect a respectivebeam segment 400 coinciding with the combination zone 334 located at P₃of the combination zone array 1200. The beam segments 400 reflected bythe micromirror elements 308 respectively located at M₇, M₆, M₅, M₄, andM₃ of the micromirror array 306 may define a beam segment-subset 408.

Although the respective beam segments 400 of the beam segment-subset 408may become incident upon a build point 1002 corresponding to thecombination zone 334 at respectively different times, the modulationcycle may have a frequency that is one or more orders of magnitudeshorter than the time rate of heat conduction from the build point 1002.For example, the quantity of heat conducted away from the build point1002 may be immaterial relative to the quantity of heat imparted to thebuild point by the beam segment-subset 408 over the duration of one ormore modulation cycles. As such, a suitable power density may beimparted to a build point 1002 by a plurality of beam segments 400becoming incident upon the build point 1002 over the duration of one ormore modulation cycles. In some embodiments, a modulation cycle may havea frequency of from about 50 nanoseconds (ns) to about 10,000 ns, suchas from about 50 ns to about 250 ns, such as from about 250 ns to about500 ns, such as from about 500 ns to about 1,500 ns, such as from about1,500 ns to about 2,500 ns, such as from about 2,500 ns to about 5,000ns, or such as from about 5,000 ns to about 10,000 ns.

Referring now to FIG. 13N, over the course of one or more modulationcycles, such as according to the irradiation sequence described withreference to FIGS. 13A-13F and/or FIGS. 13G-13L, a respectivemicromirror element 308 may reflect a plurality of beam segments 400 toa corresponding plurality of combination zones 334. For example, amicromirror element 308 located at M₅ of the micromirror array 306 mayreflect a plurality of beam segments 400 to combination zones 334respectively located at P₁, P₂, P₃, P₄, and P₅ of the combination zonearray 1200. At a time T₁, the micromirror element 308 located at M₅ ofthe micromirror array 306 may reflect a beam segment 400 to acombination zone 334 respectively located at P₁ of the combination zonearray 1200. Additionally, or in the alternative, at a time T₂, themicromirror element 308 located at M₅ of the micromirror array 306 mayreflect a beam segment 400 to a combination zone 334 respectivelylocated at P₂ of the combination zone array 1200. Additionally, or inthe alternative, at times T₃, T₄, and T₅, the micromirror element 308located at M₅ of the micromirror array 306 may reflect beam segments 400to combination zones 334 respectively located at P₃, P₃, and P₅ of thecombination zone array 1200.

In some embodiments, a plurality of beam segment-subset 408 may bereflected to a corresponding plurality of combination zones 334.Respective ones of the beam segment-subsets 408 may include a pluralityof beam segments 400 reflected by respective ones of a plurality ofmicromirror elements 308. The plurality of beam segments 400 may bereflected by respective ones of the plurality micromirror elements 308at a corresponding plurality of different times in a modulation cycleand/or modulation interval. The plurality of micromirror elements 308respectively corresponding to a beam segment-subset 408 may include atleast one micromirror element 308 located at a respectively differentposition of a micromirror array 306 as between respective ones of theplurality of combination zones 334. For example, FIGS. 13O-13S show beamsegment-subsets 408 respectively corresponding to a plurality ofcombination zones 334 in a combination zone array 1200. The beamsegment-subsets 408 shown in FIGS. 13O-13S may be provided by anirradiation sequence that includes one or more modulation cycles shownin FIGS. 13A-13F and/or in FIGS. 13G-13L. The micromirror elements 308providing the respective beam segments 400 included in the beamsegment-subset 408 may increment with respect to sequential locations inthe combination zone array 1200.

As shown in FIG. 13O, a combination zone 334 located at P₁ of thecombination zone array 1200 may receive a beam segment-subset 408 thatincludes a plurality of beam segments 400 from a corresponding pluralityof micromirror elements 308, such as micromirror elements located at M₁,M₂, M₃, M₄, and M₅ of the micromirror array 306. The respective beamsegments 400 included in the beam segment-subset 408 may occupy aspatial location of the combination zone 334 at respectively differentpoints in time. For example, at a time T₁, a micromirror element locatedat M₅ of the micromirror array 306 may reflect a beam segment 400coinciding with the combination zone 334 located at P₁ of thecombination zone array 1200. Additionally, or in the alternative, at atime T₂, a micromirror element located at M₄ of the micromirror array306 may reflect a beam segment 400 coinciding with the combination zone334 located at P₁ of the combination zone array 1200. Additionally, orin the alternative, at times T₃, T₄, and T₅, micromirror elements 308respectively located at M₃, M₂, and M₁ of the micromirror array 306 mayreflect a respective beam segment 400 coinciding with the combinationzone 334 located at P₁ of the combination zone array 1200. The beamsegments 400 reflected by the micromirror elements 308 respectivelylocated at M₅, M₄, M₃, M₂, and M₁ of the micromirror array 306 maydefine a beam segment-subset 408 corresponding to the combination zone334 located at P₁ of the combination zone array 1200.

As shown in FIG. 13P, a combination zone 334 located at P₂ of thecombination zone array 1200 may receive a beam segment-subset 408 thatincludes a plurality of beam segments 400 from a corresponding pluralityof micromirror elements 308 respectively located at M₂, M₃, M₄, M₅, andM₆ of the micromirror array 306. At a time T₁, the micromirror elementlocated at M₆ of the micromirror array 306 may reflect a beam segment400 coinciding with the combination zone 334 located at P₂ of thecombination zone array 1200. Additionally, or in the alternative, at atime T₂, the micromirror element located at M₅ of the micromirror array306 may reflect a beam segment 400 coinciding with the combination zone334 located at P₂ of the combination zone array 1200. Additionally, orin the alternative, at times T₃, T₄, and T₅, the micromirror elements308 respectively located at and M₄, M₃, and M₂ of the micromirror array306 may reflect a respective beam segment 400 coinciding with thecombination zone 334 located at P₂ of the combination zone array 1200.The beam segments 400 reflected by the micromirror elements 308respectively located at M₆, M₅, M₄, M₃, and M₂ of the micromirror array306 may define a beam segment-subset 408 corresponding to thecombination zone 334 located at P₂ of the combination zone array 1200.

As shown in FIG. 13Q, a combination zone 334 located at P₃ of thecombination zone array 1200 may receive a beam segment-subset 408 thatincludes a plurality of beam segments 400 from a corresponding pluralityof micromirror elements 308 respectively located at M₃, M₄, M₅, M₆, andM₇ of the micromirror array 306. At a time T₁, the micromirror elementlocated at M₇ of the micromirror array 306 may reflect a beam segment400 coinciding with the combination zone 334 located at P₃ of thecombination zone array 1200. Additionally, or in the alternative, at atime T₂, the micromirror element located at M₆ of the micromirror array306 may reflect a beam segment 400 coinciding with the combination zone334 located at P₃ of the combination zone array 1200. Additionally, orin the alternative, at times T₃, T₄, and T₅, the micromirror elements308 respectively located at M₅, M₄, and M₃ of the micromirror array 306may reflect a respective beam segment 400 coinciding with thecombination zone 334 located at P₃ of the combination zone array 1200.The beam segments 400 reflected by the micromirror elements 308respectively located at M₇, M₆, M₅, M₄, and M₃ of the micromirror array306 may define a beam segment-subset 408 corresponding to thecombination zone 334 located at P₃ of the combination zone array 1200.

As shown in FIG. 13R, a combination zone 334 located at P₄ of thecombination zone array 1200 may receive a beam segment-subset 408 thatincludes a plurality of beam segments 400 from a corresponding pluralityof micromirror elements 308 respectively located at M₄, M₅, M₆, M₇, andM₈ of the micromirror array 306. At a time T₁, the micromirror elementlocated at M₈ of the micromirror array 306 may reflect a beam segment400 coinciding with the combination zone 334 located at P₄ of thecombination zone array 1200. Additionally, or in the alternative, at atime T₂, the micromirror element located at M₇ of the micromirror array306 may reflect a beam segment 400 coinciding with the combination zone334 located at P₄ of the combination zone array 1200. Additionally, orin the alternative, at times T₃, T₄, and T₅, the micromirror elements308 respectively located at M₆, M₅, and M₄ of the micromirror array 306may reflect a respective beam segment 400 coinciding with thecombination zone 334 located at P₄ of the combination zone array 1200.The beam segments 400 reflected by the micromirror elements 308respectively located at M₈, M₇, M₆, M₅, and M₄ of the micromirror array306 may define a beam segment-subset 408 corresponding to thecombination zone 334 located at P₄ of the combination zone array 1200.

As shown in FIG. 13S, a combination zone 334 located at P₅ of thecombination zone array 1200 may receive a beam segment-subset 408 thatincludes a plurality of beam segments 400 from a corresponding pluralityof micromirror elements 308 respectively located at M₅, M₆, M₇, M₈, andM₉ of the micromirror array 306. At a time T₁, the micromirror elementlocated at M₉ of the micromirror array 306 may reflect a beam segment400 coinciding with the combination zone 334 located at P₄ of thecombination zone array 1200. Additionally, or in the alternative, at atime T₂, the micromirror element located at M₈ of the micromirror array306 may reflect a beam segment 400 coinciding with the combination zone334 located at P₅ of the combination zone array 1200. Additionally, orin the alternative, at times T₃, T₄, and T₅, the micromirror elements308 respectively located at M₇, M₆, and M₅ of the micromirror array 306may reflect a respective beam segment 400 coinciding with thecombination zone 334 located at P₅ of the combination zone array 1200.The beam segments 400 reflected by the micromirror elements 308respectively located at M₉, M₈, M₇, M₆, and M₅ of the micromirror array306 may define a beam segment-subset 408 corresponding to thecombination zone 334 located at P₅ of the combination zone array 1200.

Now turning to FIGS. 14A-14H-2 , exemplary irradiation sequences arefurther described. An irradiation sequence may include a pulse cyclethat includes a plurality of pulses of an energy beam 144 from a beamgeneration device 300. The pulse cycle may be coordinated with amodulation cycle of an optical modulator 302. The optical modulator maymodulate respective ones of a plurality of micromirror elements 308 of amicromirror array 306 to a plurality of modulation states. Themicromirror elements 308 may be grouped into modulation groups 500respectively including a plurality of micromirror elements 308, and therespective modulation groups 500 may be modulated in coordination withthe pulses of the energy beam 144. The plurality of modulation statesmay respectively correspond to a plurality of deflection positions, suchas deflection positions of (−2), (−1), (0), (+1), and (+2), and,optionally, (X). The beam generation device 300 may provide one or morepulses of an energy beam 144 in coordination with the respectivemodulation states.

FIGS. 14A-14H-2 graphically depict exemplary pulse cycles that may becoordinated with exemplary modulation cycles in an irradiation sequence.As shown in FIGS. 14A-14H-2 , shaded spots represents points in themodulation cycle when one or more pulses of an energy beam 144 areprovided, and unshaded spots represent points in the modulation cyclewhen a pulse of the energy beam is not provided. An exemplary modulationcycle may include a repeating and/or alternating progression through asequence of a plurality of modulation states respectively correspondingto different deflection positions for a plurality of micromirrorelements 308, such as deflection positions of (−2), (−1), (0), (+1),(+2), and (X). An exemplary pulse cycle may include a beam generationdevice 300 providing one or more pulses of an energy beam 144 at anysuitable ones of a plurality of modulation cycle times corresponding torespective modulation states. As shown, for example, in FIGS. 14A and14C, a modulation cycle may progress through a plurality of modulationstates in alternating sequence. For example, a modulation cycle mayinclude a progression from a modulation state corresponding to adeflection position of (−2) to a modulation state corresponding to adeflection position of (+2), and optionally, to a modulation statecorresponding to a deflection position of (X). Next, a modulation cyclemay include a progression in the opposite direction, from a modulationstate corresponding to a deflection position of (+2) to a modulationstate corresponding to a deflection position of (−2). The modulationcycle may progress through modulation states corresponding to deflectionpositions of (−1), (0), and (+1), between the modulation statescorresponding to deflection positions of (−2) and (+2), as themodulation cycle proceeds in alternating directions. Additionally, or inthe alternative, as shown in FIGS. 14B and 14D, a modulation cycle mayprogress through a plurality of modulation states in a repeatingsequence. For example, a modulation cycle may include a progression froma modulation state corresponding to a deflection position of (−2) to amodulation state corresponding to a deflection position of (+2), andoptionally, to a modulation state corresponding to a deflection positionof (X). Next, a modulation cycle may return to a modulation statecorresponding to a deflection position of (−2), and again progress to amodulation state corresponding to a deflection position of (+2). Themodulation cycle may progress through modulation states corresponding todeflection positions of (−1), (0), and (+1), between the modulationstates corresponding to deflection positions of (−2) and (+2), as themodulation cycle proceeds in a repeating manner.

A beam generation device 300 may provide one or more pulses of an energybeam 144 in coordination with any one or more of the modulations statesexhibited by the micromirror elements during the modulation cycle. Thepulses may be provided in the form of a pulse cycle, with pulsesoccurring at regular or irregular intervals. One or more pulses may beprovided at any one or more modulation cycle times, as shown, forexample, in FIGS. 14A-14D. For example, when an irradiation sequenceindicates one or more build points 1002 to receive irradiation at amodulation cycle time, one or more pulses may be provided incoordination with the modulation cycle time. A plurality of micromirrorelements 308 may reflect one or more beam segments 400 corresponding tothe one or more pulses of the energy beam 144 to a correspondingplurality of build points 1002 of a build array 1000. The build points1002 that receive the one or more beam segments 400 may depend at leastin part on the modulation state of the plurality of micromirror elements308 corresponding to the one or more pulses of the energy beam 144.Additionally, or in the alternative, when an irradiation sequenceindicates that irradiation is not to be provided at a modulation cycletime, the beam generation device 300 may wait to provide further pulsesof the energy beam 144 until such time corresponds with a nextmodulation cycle time when the irradiation sequence indicates that oneor more build point 1002 are to receive irradiation. By way of example,as shown in FIGS. 14A and 14B, an irradiation sequence may include apulse cycle in which one or more pulses are provided at respective onesof a sequential plurality of modulation cycle times. The sequentialplurality of modulation cycle times may respectively correspond to asequential plurality of modulation states respectively exhibiting acorresponding deflection position.

Additionally, or in the alternative, as shown in FIGS. 14C and 14D, anirradiation sequence may include a pulse cycle in which one or morepulses are provided at respective ones of an intermittent plurality ofmodulation cycle times. The intermittent plurality of modulation cycletimes may respectively correspond to an intermittent plurality ofmodulation states respectively exhibiting a corresponding deflectionposition. As shown in FIG. 14C, an intermittent plurality of modulationcycle times may include one or more pulses provided at respective onesof a sequential plurality of modulation cycle times. The sequentialplurality of modulation cycle times for which one or more pulses areprovided may be followed by a sequential plurality of modulation cycletimes for which irradiation is not provided, and as such, the beamgeneration device 300 may wait to provide further pulses of the energybeam 144 until such time corresponds with a next modulation cycle timewhen the irradiation sequence indicates that one or more build point1002 are to receive irradiation. The sequential plurality of modulationcycle times for which irradiation is not provided may be followed by anext sequential plurality of modulation cycle times for which one ormore pulses are provided. Additionally, or in the alternative, as shownin FIG. 14D, an intermittent plurality of modulation cycle times mayinclude one or more pulses provided at respective ones of an alternatingsequence of modulation cycle times. The alternating sequence ofmodulation cycle times may include an alternating sequence of one ormore cycle times for which one or more pulses are provided followed byone or more cycle times for which is not provided.

As shown in FIG. 14E, a pulse cycle may include a pulse interval that isbased at least in part on a function of modulation cycle time. The pulseinterval may increment through a series of modulation states withsequential iterations of a modulation cycle. The pulse interval mayprogress through the series of modulation states in increments of one ormore modulation states. For example, as shown in FIG. 14E, the pulseinterval may increment to a next sequential modulation state withsequential iterations of the modulation cycle. The pulse interval may bedescribed by the relationship: P(T)=M(f)+(i)·(t), where P(T) is thepulse interval, M(f) is the modulation cycle frequency, (i) is theincremental number of modulation states per pulse interval, and (t) isthe incremental time between sequential modulation states in themodulation cycle. FIG. 14E shows an exemplary pulse interval where theincremental number of modulation states per pulse interval, (i) equalsone (1). A pulse interval P(T) in which the incremental number ofmodulation states per pulse interval, (i) equals zero (0) may sometimesbe described with reference to a pulse interval and modulation cyclefrequency that are synchronous with one another. A pulse interval P(T)in which the incremental number of modulation states per pulse interval,(i) does not equal zero (0) may sometimes be described with reference toa pulse interval and modulation cycle frequency that are asynchronouswith one another.

As shown, at a first iteration of a modulation cycle, one or more pulsesmay be provided in coordination with a modulation state corresponding toa deflection position of (−2). At a second iteration of the modulationcycle, one or more pulses may be provided in coordination with amodulation state corresponding to a deflection position of (−1). Duringthe first iteration of the modulation cycle, the beam generation device300 may wait to provide further pulses of the energy beam 144 until thesecond iteration of the modulation cycle progresses to the modulationstate corresponding to a deflection position of (−1). As shown,sequential pulses may be provided at the pulse interval, such that oneor more pulses are provided at incremental modulation states withsequential iterations of the modulation cycle. For example, one or morepulses may be provided in coordination with the modulation statecorresponding to a deflection position of (0) with a third iteration ofthe modulation cycle, in coordination with the modulation statecorresponding to a deflection position of (+1) with a fourth iterationof the modulation cycle, in coordination with the modulation statecorresponding to a deflection position of (+2) with a fifth iteration ofthe modulation cycle, and/or in coordination with the modulation statecorresponding to a deflection position of (X) with a sixth iteration ofthe modulation cycle.

Referring now to FIG. 14F, FIG. 14G, and FIGS. 14H-1 and 14H-2 , in someembodiments, a modulation cycle may include a staggered modulationcycle, in which progression through a plurality of modulation states maybe staggered between respective ones of a plurality of micromirrorelements 308 and/or between respective ones of a plurality of modulationgroups 500. At respective times in the modulation cycle, the pluralityof micromirror elements 308 may exhibit respective ones of a pluralityof modulation states. The plurality of modulation states respectivelycorrespond to a plurality of deflection positions. By way of example, asshown, a staggered modulation cycle may include respective ones of aplurality of micromirror elements 308 staggered by an interval thatcorresponds to the incremental time between modulation states, (t). Byway of example, as shown in FIG. 14F, a staggered modulation cycle mayinclude a plurality of micromirror elements 308 oriented at respectiveones of a plurality of modulation states at a respective time in thestaggered modulation cycle. For example, at a modulation cycle time(t₅), a micromirror element 308 located at M₁ in a micromirror array 306may exhibit a modulation state corresponding to a deflection position of(+2). Additionally, or in the alternative, at the modulation cycle time(t₅), a micromirror element 308 located at M₂ in the micromirror array306 may exhibit a modulation state corresponding to a deflectionposition of (+1), a micromirror element 308 located at M₃ in themicromirror array 306 may exhibit a modulation state corresponding to adeflection position of (0), a micromirror element 308 located at M₄ inthe micromirror array 306 may exhibit a modulation state correspondingto a deflection position of (−1), and/or a micromirror element 308located at M₅ in the micromirror array 306 may exhibit a modulationstate corresponding to a deflection position of (−2).

In some embodiments, a pulse interval and modulation cycle may have anasynchronous frequency. For example, as shown in FIG. 14F, one or morepulses are provided according to a pulse cycle that includes a pulseinterval P(T) in which the incremental number of modulation states perpulse interval, (i) equals one (1). At respective pulse intervals, therespective ones of the plurality of micromirror elements 308 mayincrement through the plurality of modulation states. For example, afirst pulse interval P(T₁) may correspond to a modulation cycle time(t₅), with the respective micromirror elements 308 located at M₁ throughM₅ of the micromirror array 306 oriented at the respective modulationstates mentioned above. With sequential pulse intervals in the pulsecycle, the respective micromirror elements 308 located at M₁ through M₅of the micromirror array 306 may respectively increment to acorresponding next modulation state. For example, a modulation cycletime (t₁₂) may correspond to a second pulse interval P(T₂). At thesecond pulse interval P(T₂), a micromirror element 308 located at M₁ ina micromirror array 306 may exhibit a modulation state corresponding toa deflection position of (X). Additionally, or in the alternative, atthe second pulse interval P(T₂) and/or the modulation cycle time (t₁₂),a micromirror element 308 located at M₂ in the micromirror array 306 mayexhibit a modulation state corresponding to a deflection position of(+2), a micromirror element 308 located at M₃ in the micromirror array306 may exhibit a modulation state corresponding to a deflectionposition of (+1), a micromirror element 308 located at M₄ in themicromirror array 306 may exhibit a modulation state corresponding to adeflection position of (0), and/or a micromirror element 308 located atM₅ in the micromirror array 306 may exhibit a modulation statecorresponding to a deflection position of (−1). Additionally, or in thealternative, a modulation cycle time (t₁₉) may correspond to a thirdpulse interval P(T₃). At the third pulse interval P(T₃), a micromirrorelement 308 located at M₁ in a micromirror array 306 may exhibit amodulation state corresponding to a deflection position of (−2).Additionally, or in the alternative, at the third pulse interval P(T₃)and/or the modulation cycle time (t₁₉), a micromirror element 308located at M₂ in the micromirror array 306 may exhibit a modulationstate corresponding to a deflection position of (X), a micromirrorelement 308 located at M₃ in the micromirror array 306 may exhibit amodulation state corresponding to a deflection position of (+2), amicromirror element 308 located at M₄ in the micromirror array 306 mayexhibit a modulation state corresponding to a deflection position of(+1), and/or a micromirror element 308 located at M₅ in the micromirrorarray 306 may exhibit a modulation state corresponding to a deflectionposition of (0).

Additionally, or in the alternative, after completing a pulse cycle, therespective ones of the plurality of micromirror elements 308 may exhibitthe respective modulation states as exhibited at the beginning of thepulse cycle. For example, the pulse cycle shown in FIG. 14F includes six(6) pulse intervals P(T). As shown, at a seventh pulse interval P(T₇),which may correspond to a modulation cycle time (t₄₇), the pulse cyclemay repeat, with a micromirror element 308 located at M₁ in amicromirror array 306 may exhibit a modulation state corresponding to adeflection position of (+2). Additionally, or in the alternative, at theseventh pulse interval P(T₇) and/or the modulation cycle time (t₄₇), amicromirror element 308 located at M₂ in the micromirror array 306 mayexhibit a modulation state corresponding to a deflection position of(+1), a micromirror element 308 located at M₃ in the micromirror array306 may exhibit a modulation state corresponding to a deflectionposition of (0), a micromirror element 308 located at M₄ in themicromirror array 306 may exhibit a modulation state corresponding to adeflection position of (−1), and/or a micromirror element 308 located atM₅ in the micromirror array 306 may exhibit a modulation statecorresponding to a deflection position of (−2).

As shown in FIG. 14G, in some embodiments, a pulse interval P(T) and amodulation cycle may have a synchronous frequency. With a frequency thatis synchronous, the incremental number of modulation states per pulseinterval, (i) equals zero (0). As shown, the plurality of micromirrorelements 308 respectively located at M₁ through M₅ in the micromirrorarray 306 may exhibit the same respectively staggered set of modulationstates at respective pulse intervals P(T). For example, for respectiveones of a plurality of pulse intervals, P(T₁ through T_((n+1))), theplurality of micromirror elements 308 may exhibit the same respectivelystaggered set of modulation states. As shown, for respective ones of aplurality of pulse intervals, P(T₁ through T_((n+1))), a micromirrorelement 308 located at M₁ in a micromirror array 306 may exhibit amodulation state corresponding to a deflection position of (+2).Additionally, or in the alternative, for respective ones of a pluralityof pulse intervals, P(T₁ through T_((n+1))), a micromirror element 308located at M₂ in the micromirror array 306 may exhibit a modulationstate corresponding to a deflection position of (+1), a micromirrorelement 308 located at M₃ in the micromirror array 306 may exhibit amodulation state corresponding to a deflection position of (0), amicromirror element 308 located at M₄ in the micromirror array 306 mayexhibit a modulation state corresponding to a deflection position of(−1), and/or a micromirror element 308 located at M₅ in the micromirrorarray 306 may exhibit a modulation state corresponding to a deflectionposition of (−2).

As shown in FIGS. 14H-1 and 14H-2 , in some embodiments, a pulse cyclemay be configured such that at least some of the plurality ofmicromirror elements 308 may have a common modulation state on at leastsome instances of a pulse interval P(T). Additionally, or in thealternative, the plurality of micromirror elements 308 may haverespectively different modulation states on at least some instances of apulse interval P(T). Additionally, or in the alternative, a pulse cyclemay be configured such that respective ones of the plurality ofmodulations states have a variable number of micromirror elements 308 atrespective pulse intervals P(T). By configuring a pulse cycle to providea variable number of micromirror elements 308 exhibiting respective onesof a plurality of modulations states at respective pulse intervals P(T),the intensity and/or power density of the irradiation directed torespective combination zones 334 and/or build points 1002 may beaugmented, for example, increased or decreased. The intensity and/orpower density directed to respective combination zones 334 and/or buildpoints 1002 may be decreased, for example, without requiring that aportion of the energy beam 144 be directed to an extraction beam path318, by providing a pulse interval corresponding to a point in themodulation cycle when the plurality of micromirror elements are notexhibiting a respective modulation state but instead are exhibitingother modulation states from among the plurality of modulation states inthe modulation cycle. Additionally, or in the alternative, the intensityand/or power density directed to respective combination zones 334 and/orbuild points 1002 may be increased, for example, without requiringadditional pulses from the energy beam 144 and/or without requiring thatthe intensity and/or power density of the energy beam 144 be increased,by providing a pulse interval corresponding to a point in the modulationcycle when at least some of the plurality of micromirror elementsexhibit a common modulation state. Additionally, or in the alternative,a nominal intensity and/or power density may be directed to respectivecombination zones 334 and/or build points 1002, for example, byproviding a pulse interval corresponding to a point in the modulationcycle when respective ones of the plurality of micromirror elementsexhibit respectively different modulation states.

Additionally, or in the alternative, in some embodiments, the intensityand/or power density directed to respective combination zones 334 and/orbuild points 1002 may be shifted to selected regions of the combinationzone, for example, by providing a pulse interval corresponding to apoint in the modulation cycle when the plurality of micromirror elementsexhibit a common modulation state, and/or when the plurality ofmicromirror elements are not exhibiting a respective modulation statebut instead are exhibiting other modulation states from among theplurality of modulation states in the modulation cycle. For example, aplurality of beam segments 400 may at least partially overlap at acombination zone 334. The intensity and/or power density of a beam spot336 corresponding to a combination zone 334 may be shifted from a firstregion of the beam spot 336 to a second region of the beam spot 336 atleast in part by providing a pulse interval corresponding to a point inthe modulation cycle when at least some of the plurality of micromirrorelements exhibit a common modulation state that corresponds to thesecond region of the beam spot 336 and/or when the plurality ofmicromirror elements are not exhibiting a modulation state thatcorresponds to the first region of the beam spot 336. By way of example,the first region of the beam spot 336 may correspond to a central regionof the beam spot 336, such as a radially inward portion of the beam spot336, away from which the intensity and/or power density may be shifted.Additionally, or in the alternative, the second region of the beam spot336 may be an outward region of the beam spot 336, such as a radiallyoutward portion of the beam spot 336, towards which the intensity and/orpower density may be shifted. In some embodiments, a shift in intensityand/or power density of the beam spot 336 from a radially inward portionof the beam spot 336 to a radially outward portion of the beam spot 336may provide an annular beam spot 336. Such an annular beam spot 336 maybe particularly suitable for a conduction irradiation regime in someembodiments.

In some embodiments, the number of micromirror elements 308 exhibiting arespective modulation state may vary by a modulation factor set. Anysuitable modulation factor set may be provided. By way of example, asshown in FIGS. 14H-1 and 14H-2 , the modulation factor set may includemodulation factors of (0, 1, and 2). With respect to a modulation statefor which the number of micromirror elements 308 varies by a modulationfactor of (1), the number of micromirror elements 308 exhibiting suchmodulation state is nominal, or unchanged. With respect to a modulationstate for which the number of micromirror elements 308 varies by amodulation factor of (0), the number of micromirror elements 308exhibiting such modulation state augmented by a factor of zero, meaningthe number of micromirror elements 308 exhibiting such modulation stateis zero. With respect to a modulation state for which the number ofmicromirror elements 308 varies by a modulation factor of (2), thenumber of micromirror elements 308 exhibiting such modulation stateaugmented by a factor of (2), meaning the number of micromirror elements308 exhibiting such modulation state is doubled.

In some embodiments, as shown, for example, in FIGS. 14H-1 and 14H-2 , apulse cycle may be configured such that respective ones of the pluralityof modulation states exhibit respective ones of the plurality ofmodulation factors upon at least one of the pulse intervals P(T) in thepulse cycle. Additionally, or in the alternative, a pulse cycle may beconfigured such that respective ones of the plurality of micromirrorelements exhibit respective ones of the plurality of modulation statesupon at least one of the pulse intervals P(T) in the pulse cycle. For apulse cycle configured such that respective ones of the plurality ofmodulation states exhibit respective ones of the plurality of modulationfactors upon at least one of the pulse intervals P(T) in the pulse cycleand such that respective ones of the plurality of micromirror elementsexhibit respective ones of the plurality of modulation states upon atleast one of the pulse intervals P(T) in the pulse cycle, any one ormore of the respective ones of the plurality of micromirror elements 308may be augmented by the modulation factor with respect to any one ormore of the respective ones of the plurality of modulation states. Themodulation factor may be applied to respective ones of the plurality ofmicromirror elements 308 and/or to respective ones of the plurality ofmodulation states by configuring the pulse cycle such that the pulseintervals P(T) correspond to the respective micromirror elements 308and/or to the respective modulation states for which the modulationfactor is intended to be applied.

By way of example, as shown in FIG. 14H-1 , at a first pulse intervalP(T₁), a plurality of micromirror elements 308 at locations M₁ throughM₅ of a micromirror array 306 may exhibit respective ones of a pluralityof modulation states respectively corresponding to deflection positions(−2) through (+2). By way of example, the pulse intervals shown in FIGS.14H-1 and 14H-2 may have a pulse cycle of eight (8) pulse intervalsP(T_(i)), meaning that the sequence repeats every eight (8) pulseintervals. At a second pulse interval P(T₂), a modulation factor of (0)may be imparted to the modulation state corresponding to a deflectionposition of (+2), meaning that none of the plurality of micromirrorelements 308 at locations M₁ through M₅ of a micromirror array 306exhibit the modulation state corresponding to the deflection position of(+2). Additionally, or in the alternative, a modulation factor of (2)may be imparted to the modulation state corresponding to a deflectionposition of (−1), meaning that the number of micromirror elements 308exhibiting the modulation state corresponding to the deflection positionof (−1) has been doubled. As shown, the micromirror elements 308 atlocations M₁ and M₃ of a micromirror array 306 may exhibit themodulation state corresponding to the deflection position of (−1) at thesecond pulse interval P(T₂).

At a third pulse interval P(T₃), a modulation factor of (0) may beimparted to the modulation states respectively corresponding to adeflection position of (+2) and (+1), meaning that none of the pluralityof micromirror elements 308 at locations M₁ through M₅ of a micromirrorarray 306 exhibit those modulation states. Additionally, or in thealternative, a modulation factor of (2) may be imparted to themodulation states respectively corresponding to a deflection position of(−1) and (0), meaning that the number of micromirror elements 308exhibiting those modulation states has been doubled. As shown, at thethird pulse interval P(T₃), the micromirror elements 308 at locations M₁and M₅ of a micromirror array 306 may exhibit the modulation statecorresponding to the deflection position of (0), and/or the micromirrorelements 308 at locations M₂ and M₄ of the micromirror array 306 mayexhibit the modulation state corresponding to the deflection position of(−1). At a seventh pulse interval P(T₇), a modulation factor of (0) maybe imparted to the modulation states respectively corresponding to adeflection position of (−2) and (−1), meaning that none of the pluralityof micromirror elements 308 at locations M₁ through M₅ of a micromirrorarray 306 exhibit those modulation states. Additionally, or in thealternative, a modulation factor of (2) may be imparted to themodulation states respectively corresponding to a deflection position of(+1) and (0), meaning that the number of micromirror elements 308exhibiting those modulation states has been doubled. As shown, at theseventh pulse interval P(T₇), the micromirror elements 308 at locationsM₂ and M₄ of a micromirror array 306 may exhibit the modulation statecorresponding to the deflection position of (+1), and/or the micromirrorelements 308 at locations M₁ and M₅ of the micromirror array 306 mayexhibit the modulation state corresponding to the deflection position of(0).

By way of further example, referring to FIG. 14H-2 , at a seventh pulseinterval P(T₈), a modulation factor of (0) may be imparted to themodulation states respectively corresponding to a deflection position of(−2), meaning that none of the plurality of micromirror elements 308 atlocations M₁ through M₅ of a micromirror array 306 exhibit thosemodulation states. Additionally, or in the alternative, a modulationfactor of (2) may be imparted to the modulation states respectivelycorresponding to a deflection position of (+1), meaning that the numberof micromirror elements 308 exhibiting that modulation state has beendoubled. As shown, at the eighth pulse interval P(T₈), the micromirrorelements 308 at locations M₃ and M₅ of a micromirror array 306 mayexhibit the modulation state corresponding to the deflection position of(+1), and/or the micromirror elements 308 at locations M₂ and M₄ of themicromirror array 306 may exhibit the modulation state corresponding tothe deflection position of (+2). At a ninth pulse interval P(T₉), thepulse cycle shown in FIGS. 14H-1 and 14H-2 repeats.

In some embodiments, a pulse cycle that includes a plurality of pulseintervals P(T_(i)) may be configured to increase and/or decrease thenumber of beam segments 400 that become incident upon respectivemicromirror elements 308 in a respective modulation state. For example,in the pulse cycle shown in FIGS. 14H-1 and 14H-2 , energy beam segments400 may become incident upon micromirror elements preferentially atmodulation states that have deflection positions of (−1), (0), and (+1).As shown, forty (40) energy beam segments 400 become incident upon themicromirror elements 308 at locations M₁ and M₅, of which, ten (10)energy beam segments 400 become incident upon micromirror elements 308at modulation states that have deflection positions of (−1), (0), and(+1), respectively, and five (5) energy beam segments 400 becomeincident upon micromirror elements at modulation states that havedeflection positions of (−2) and (+2), respectively. This can beobserved in FIGS. 14H-1 and 14H-2 by counting the number of pulses overone pulse cycle.

While only a selection of the pulse intervals P(T) in FIGS. 14H-1 and14H-2 have been mentioned, it will be appreciated that, as illustratedin FIGS. 14H-1 and 14H-2 , over the course of a pulse cycle, each of themodulation states may be augmented by respective ones of the modulationfactors in the modulation factor set, such as a modulation factor setthat includes deflection positions of (0, 1, and 2). Additionally, itwill be appreciated that as illustrated in FIGS. 14H-1 and 14H-2 , overthe course of a pulse cycle, respective ones of a plurality ofmicromirror elements 308, such as a plurality of micromirror elements308 included in a modulation group 500, may exhibit respective ones ofthe plurality of modulation states corresponding to respectivedeflection positions, including, for example, at respective pulseintervals corresponding to respective ones of the plurality ofmodulation factors in the modulation factor set.

Now turning to FIG. 15 , and exemplary control system 104 will bedescribed. A control system 104 may be configured to perform one or morecontrol operations associated with an additive manufacturing system 100and/or an additive manufacturing machine 102. The control operations mayinclude, one or more control commands may be configured to controloperations of an energy beam system 134, including, for example, controloperations of one or more irradiation devices 142 and/or one or moreoptical modulators 302 included in a respective irradiation device 142.

As shown in FIG. 15 , an exemplary control system 104 may include acontroller 1500. The controller may include one or more control modules1502 configured to cause the controller 1500 to perform one or morecontrol operations. The one or more control modules 1502 may includecontrol logic executable to provide control commands configured tocontrol one or more controllable components associated with an additivemanufacturing machine 102, such as controllable components associatedwith an energy beam system 134, one or more irradiation devices 142,and/or one or more optical modulators 302. For example, a control module1502 may be configured to provide one or more control commandsexecutable to control operation of one or more components of anirradiation device 142, such as operation of a beam generation device300, an optical modulator 302, and/or a modulation sensor 330, and/orany one or more other components thereof.

The controller 1500 may be communicatively coupled with an additivemanufacturing machine 102. The controller 1500 may be communicativelycoupled with one or more components of an additive manufacturing machine102, such as one or more components of an energy beam system 134 and/oran irradiation device 142, such as a beam generation device 300, anoptical modulator 302, and/or a modulation sensor 330, and/or any one ormore other elements thereof. The controller 1500 may also becommunicatively coupled with a management system 106 and/or a userinterface 108.

The controller 1500 may include one or more computing devices 1504,which may be located locally or remotely relative to an additivemanufacturing machine 102, an energy beam system 134, and/or anirradiation device 142. The one or more computing devices 1504 mayinclude one or more processors 1506 and one or more memory devices 1508.The one or more processors 1506 may include any suitable processingdevice, such as a microprocessor, microcontroller, integrated circuit,logic device, and/or other suitable processing device. The one or morememory devices 1508 may include one or more computer-readable media,including but not limited to non-transitory computer-readable media,RAM, ROM, hard drives, flash drives, and/or other memory devices 1508.

As used herein, the terms “processor” and “computer” and related terms,such as “processing device” and “computing device”, are not limited tojust those integrated circuits referred to in the art as a computer, butbroadly refers to a microcontroller, a microcomputer, a programmablelogic controller (PLC), an application specific integrated circuit, andother programmable circuits, and these terms are used interchangeablyherein. A memory device 1508 may include, but is not limited to, anon-transitory computer-readable medium, such as a random access memory(RAM), and computer-readable nonvolatile media, such as hard drives,flash memory, and other memory devices. Alternatively, a floppy disk, acompact disc-read only memory (CD-ROM), a magneto-optical disk (MOD),and/or a digital versatile disc (DVD) may also be used.

As used herein, the term “non-transitory computer-readable medium” isintended to be representative of any tangible computer-based deviceimplemented in any method or technology for short-term and long-termstorage of information, such as, computer-readable instructions, datastructures, program modules and sub-modules, or other data in anydevice. The methods described herein may be encoded as executableinstructions embodied in a tangible, non-transitory, computer readablemedia, including, without limitation, a storage device and/or a memorydevice. Such instructions, when executed by a processor, cause theprocessor to perform at least a portion of the methods described herein.Moreover, as used herein, the term “non-transitory computer-readablemedium” includes all tangible, computer-readable media, including,without limitation, non-transitory computer storage devices, including,without limitation, volatile and nonvolatile media, and removable andnon-removable media such as a firmware, physical and virtual storage,CD-ROMs, DVDs, and any other digital source such as a network or theInternet, as well as yet to be developed digital means, with the soleexception being a transitory, propagating signal.

The one or more memory devices 1508 may store information accessible bythe one or more processors 1506, including computer-executableinstructions 1510 that can be executed by the one or more processors1506. The instructions 1510 may include any set of instructions whichwhen executed by the one or more processors 1506 cause the one or moreprocessors 1506 to perform operations, including beam modulationoperations, calibration operations, and/or additive manufacturingoperations. Additionally, or in the alternative, the instructions, whenexecuted by the one or more processors 1506, may cause the one or moreprocessors 1506 to perform an irradiation sequence as described herein,including, for example, an irradiation sequence that includes amodulation cycle and/or a pulse cycle as described herein.

The memory devices 1508 may store data 1512 accessible by the one ormore processors 1506. The data 1512 can include current or real-timedata 1512, past data 1512, or a combination thereof. The data 1512 maybe stored in a data library 1514. As examples, the data 1512 may includedata 1512 associated with or generated by an additive manufacturingsystem 100 and/or an additive manufacturing machine 102, including data1512 associated with or generated by the controller 1500, an additivemanufacturing machine 102, an energy beam system 134, one or moreirradiation devices 142, one or more beam generation devices 300, one ormore optical modulators 302, one or more modulation sensors 330, amanagement system 106, a user interface 108, and/or a computing device1504, such as operational data 1512 and/or calibration data 1512pertaining thereto. The data 1512 may also include other data sets,parameters, outputs, information, associated with an additivemanufacturing system 100 and/or an additive manufacturing machine 102.

The one or more computing devices 1504 may also include a communicationinterface 1516, which may be used for communications with acommunication network 1518 via wired or wireless communication lines1520. The communication interface 1516 may include any suitablecomponents for interfacing with one or more network(s), including forexample, transmitters, receivers, ports, controllers, antennas, and/orother suitable components. The communication interface 1516 may allowthe computing device 1504 to communicate with various nodes on thecommunication network 1518, such as nodes associated with the additivemanufacturing machine 102, the energy beam system 134, the one or moreirradiation devices 142, the one or more beam generation devices 300,the one or more optical modulators 302, the one or more modulationsensors 330, the management system 106, and/or the user interface 108.The communication network 1518 may include, for example, a local areanetwork (LAN), a wide area network (WAN), SATCOM network, VHF network, aHF network, a Wi-Fi network, a WiMAX network, a gatelink network, and/orany other suitable communication network 1518 for transmitting messagesto and/or from the controller 1500 across the communication lines 1520.The communication lines 1520 of communication network 1518 may include adata bus or a combination of wired and/or wireless communication links.

The communication interface 1516 may allow the computing device 1504 tocommunicate with various components of an additive manufacturing system100 and/or an additive manufacturing machine 102 communicatively coupledwith the communication interface 1516 and/or communicatively coupledwith one another. The communication interface 1516 may additionally oralternatively allow the computing device 1504 to communicate with themanagement system 106 and/or the user interface 108. The managementsystem 106 may include a server 1522 and/or a data warehouse 1524. As anexample, at least a portion of the data 1512 may be stored in the datawarehouse 1524, and the server 1522 may be configured to transmit data1512 from the data warehouse 1524 to the computing device 1504, and/orto receive data 1512 from the computing device 1504 and to store thereceived data 1512 in the data warehouse 1524 for further purposes. Theserver 1522 and/or the data warehouse 1524 may be implemented as part ofa control system 104 and/or as part of the management system 106.

Now turning to FIGS. 16A and 16B, exemplary methods 1600 of additivelymanufacturing a three-dimensional object will be described. Exemplarymethods may be performed at least in part by a control system 104, acontroller 1500, and/or one or more control modules 1502 associated withthe control system 104 and/or the controller 1500. Additionally, or inthe alternative, exemplary methods may be performed at least in part byan additive manufacturing system and/or an additive manufacturingmachine 102, for example, by a control system 104 and/or a controller1500 associated therewith.

As shown in FIG. 16A, an exemplary method 1600 may include, at block1602, generating an energy beam with a beam generation device 300. Theenergy beam 144 may become incident upon an optical modulator 302disposed downstream from the beam generation device 300. The opticalmodulator 302 may include a micromirror array 306. The micromirror array306 may include a plurality of micromirror elements 308. At block 1604,an exemplary method 1600 may include reflecting a plurality of beamsegment 400 of the energy beam 144 with the micromirror array 306. Themicromirror array 306 may include a plurality of micromirror elements308 configured to reflect the plurality of beam segment 400 of theenergy beam 144 along a beam path 316 incident upon one or more lenses600 of a focusing lens assembly 312. At block 1606, an exemplary method1600 may include modulating respective ones of the plurality ofmicromirror elements 308 according to beam modulation instructionsdefining a modulation state corresponding to respective ones of theplurality of micromirror elements 308 and/or corresponding to respectiveones of the plurality of modulation groups 500.

As shown in FIG. 16B, an exemplary method 1600 may continue with blocks1608 and 1610, and/or with blocks 1612 and 1614. At block 1608, anexemplary method 1600 may include focusing the plurality of beamsegments 400 such that for respective ones of a plurality of modulationgroups 500 that include a subset of micromirror elements 308 from amongthe plurality of micromirror elements 308, a corresponding subset ofbeam segments 400 are focused by one or more lenses 600 of the focusinglens assembly 312 to at least partially overlap with one another atleast at a respective one of a plurality of combination zones 334. Theplurality of combination zones 334 may respectively correspond to therespective ones of the plurality of modulation groups 500. At block1610, an exemplary method 1600 may include propagating a plurality ofbeam spots 336 across a build plane 130 by way of relative motionbetween the build plane 130 and the plurality of beam spots 336. Theplurality of beam spots 336 may respectively correspond to respectiveones of the plurality of combination zones 334. The build plane 130 mayinclude a build array 1000 defining a plurality of build points 1002.Respective ones of the plurality of build points 1002 may receiveirradiation from a respective ones of the plurality of beam spots 336corresponding to a respective one of the plurality of combination zones334.

Additionally, or in the alternative, at block 1612, an exemplary method1600 may include focusing the plurality of beam segments 400 upon abuild plane 130 that includes a build array 1000 defining a plurality ofbuild points 1002, such that for respective ones of a plurality ofmodulation groups 500 including a subset of micromirror elements 308from among the plurality of micromirror elements 308, a correspondingplurality of subset of beam segments 400 become incident upon acorresponding subset of build points 1002 from among the plurality ofbuild points 1002. At block 1614, an exemplary method 1600 may includepropagating the plurality of beam segments 400 incrementally across thebuild array 1000 by way of relative motion between the build plane 130and the plurality of beam segments 400, such that for respective ones ofthe plurality of modulation groups, the corresponding subset of buildpoints 1002 receives irradiation sequentially from the correspondingsubset of beam segments 400.

The exemplary method described with reference to FIGS. 16A and 16B maybe performed in connection with any suitable irradiation sequencedescribed herein, including, for example, the irradiation sequencesdescribed with reference to FIGS. 10A-10F, FIGS. 11A-11G, FIGS. 12A-12F,FIGS. 13A-13S, and/or FIGS. 14A-14H-2 .

This written description uses exemplary embodiments to describe thepresently disclosed subject matter, including the best mode, and also toenable any person skilled in the art to practice such subject matter,including making and using any devices or systems and performing anyincorporated methods. The patentable scope of the presently disclosedsubject matter is defined by the claims, and may include other examplesthat occur to those skilled in the art. Such other examples are intendedto be within the scope of the claims if they include structural elementsthat do not differ from the literal language of the claims, or if theyinclude equivalent structural elements with insubstantial differencesfrom the literal languages of the claims.

What is claimed is:
 1. A method of additively manufacturing athree-dimensional object, the method comprising: generating an energybeam with a beam generation device, the energy beam becoming incidentupon an optical modulator comprising a micromirror array disposeddownstream from the beam generation device; reflecting a plurality ofbeam segments of the energy beam with the micromirror array, themicromirror array comprising a plurality of micromirror elementsconfigured to reflect the plurality of beam segments; and converging theplurality of beam segments into a plurality of beam spots having alinear arrangement.
 2. The method of claim 1, comprising: propagating aplurality of beam spots across a build plane by way of relative motionbetween the build plane and the plurality of beam spots.
 3. The methodof claim 1, wherein the plurality of beam spots have a space betweenadjacent beam spots on a surface of a powder bed defined by a pluralityof particles, wherein the space between adjacent beam spots has a spacewidth that is less than an average particle size of the plurality ofparticles.
 4. The method of claim 1, wherein the plurality of beam spotshave a space between adjacent beam spots on a surface of a powder bed,wherein the space between adjacent beam spots has an aspect ratio of thespace to a width of the beam spot that is less than 0.5.
 5. The methodof claim 1, wherein the plurality of beam spots form one or more linearmelt pools across a surface of a powder bed.
 6. The method of claim 1,comprising: modulating respective ones of the plurality of micromirrorelements according to beam modulation instructions.
 7. The method ofclaim 6, wherein modulating respective ones of the plurality ofmicromirror elements according to beam modulation instructionscomprises: modulating a plurality of micromirror elements to respectiveones of a plurality of modulation states.
 8. The method of claim 1,comprising: propagating a plurality of beam spots across a build planeby way of relative motion between the build plane and the plurality ofbeam spots.
 9. The method of claim 8, wherein the plurality of beamspots respectively correspond to respective ones of a plurality ofcombination zones.
 10. The method of claim 1, wherein the micromirrorarray comprises a plurality of micromirror elements, wherein amodulation group comprising a subset of micromirror elements arearranged linearly with a space between adjacent micromirror elements ofthe subset of micromirror elements, wherein the micromirror elements ofthe subset of micromirror elements are spaced apart according to anaspect ratio of the space to a width of the micromirror elements that isless than 0.5.
 11. A method of additively manufacturing athree-dimensional object, the method comprising: generating an energybeam with a beam generation device, the energy beam becoming incidentupon an optical modulator comprising a micromirror array disposeddownstream from the beam generation device; reflecting a plurality ofbeam segment of the energy beam with the micromirror array, themicromirror array comprising a plurality of micromirror elementsconfigured to reflect the plurality of beam segment of the energy beamalong a beam path incident upon one or more lenses of a focusing lensassembly; and focusing the plurality of beam segments such that forrespective ones of a plurality of modulation groups comprising a subsetof micromirror elements from among the plurality of micromirrorelements, a corresponding subset of beam segments are focused by the oneor more lenses to at least partially overlap with one another at leastat a respective one of a plurality of combination zones, the pluralityof combination zones respectively corresponding to the respective onesof the plurality of modulation groups.
 12. The method of claim 11,comprising: modulating respective ones of the plurality of micromirrorelements according to beam modulation instructions defining a modulationstate corresponding to respective ones of the plurality of micromirrorelements and/or corresponding to respective ones of the plurality ofmodulation groups.
 13. The method of claim 11, wherein modulatingrespective ones of the plurality of micromirror elements according tobeam modulation instructions comprises: modulating a plurality ofmicromirror elements to respective ones of a plurality of modulationstates.
 14. The method of claim 11, comprising: propagating a pluralityof beam spots across a build plane by way of relative motion between thebuild plane and the plurality of beam spots, the plurality of beam spotsrespectively corresponding to respective ones of the plurality ofcombination zones, wherein the build plane comprises a build arraydefining a plurality of build points, and wherein respective ones of theplurality of build points receive irradiation from a respective ones ofthe plurality of beam spots corresponding to a respective one of theplurality of combination zones.
 15. The method of claim 11, wherein theplurality of beam spots become incident upon respective ones of theplurality of build points based at least in part on modulationinstructions configured to cause the optical modulator to modulaterespective modulation groups and/or corresponding micromirror elementsbased at least in part on a build file that defines the build points ofthe build array to be irradiated by a respective one of the plurality ofbeam spots.
 16. The method of claim 11, wherein modulating the pluralityof micromirror elements to respective ones of the plurality ofmodulation states comprises: modulating a plurality micromirror elementscorresponding to a modulation group to respective ones of a plurality ofdifferent modulation states, the plurality of different modulationstates of the plurality micromirror elements causing a correspondingplurality of beam segments to at least partially combine with oneanother at a combination zone corresponding to the modulation group. 17.The method of claim 11, wherein the plurality of micromirror elementsreflect a respective beam segment to a corresponding combination zonehaving a location in a combination zone array that depends at least inpart on the modulation state of the respective micromirror element. 18.The method of claim 11, wherein generating the energy beam from the beamgeneration device comprises: pulsing the energy beam at a plurality ofpulse times, the plurality of pulse times synchronized with respectivemodulation states of the plurality of micromirror elements.
 19. Acomputer-readable medium comprising computer-executable instructions,which when executed by a processor associated with an additivemanufacturing machine, cause the additive manufacturing machine toperform a method comprising: generating an energy beam with a beamgeneration device, the energy beam becoming incident upon an opticalmodulator comprising a micromirror array disposed downstream from thebeam generation device; reflecting a plurality of beam segment of theenergy beam with the micromirror array, the micromirror array comprisinga plurality of micromirror elements configured to reflect the pluralityof beam segment of the energy beam along a beam path incident upon oneor more lenses of a focusing lens assembly; and focusing the pluralityof beam segments such that for respective ones of a plurality ofmodulation groups comprising a subset of micromirror elements from amongthe plurality of micromirror elements, a corresponding subset of beamsegments are focused by the one or more lenses to at least partiallyoverlap with one another at least at a respective one of a plurality ofcombination zones, the plurality of combination zones respectivelycorresponding to the respective ones of the plurality of modulationgroups.